Heat exchanger

US9927184B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9927184-B2
Application numberUS-201515127050-A
CountryUS
Kind codeB2
Filing dateMar 16, 2015
Priority dateMar 20, 2014
Publication dateMar 27, 2018
Grant dateMar 27, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A spacer portion ( 3 ) of this heat exchanger ( 100 ) includes an outer peripheral portion ( 3 a ) circumferentially provided along outer peripheral edges of bonded surfaces ( 1 a ) of cores ( 1 ) and a gap portion ( 3 b and 3 c ) provided in a partial region of the circumferential outer peripheral portion, and the gap portion is provided at a position where a temperature gradient on the bonded surfaces of the cores is relatively shallow.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat exchanger comprising: multiple cores in which flow path portions through which multiple types of fluids flow are alternately stacked; and a spacer portion arranged between bonded surfaces of the cores adjacent to each other and integrally fixed to the cores on both sides by welding, wherein the spacer portion includes an outer peripheral portion circumferentially provided along outer peripheral edges of the bonded surfaces of the cores and a gap portion provided in a partial region of the circumferential outer peripheral portion, and the gap portion is provided at a position where a temperature gradient on the bonded surfaces of the cores is relatively shallow. 2. The heat exchanger according to claim 1 , wherein the spacer portion includes a first spacer having a rectangular plate shape and provided on the outer peripheral edges of the bonded surfaces of the cores and regions inside the outer peripheral edges of the bonded surfaces. 3. The heat exchanger according to claim 2 , wherein the bonded surfaces of the cores each have a rectangular shape, and an outer peripheral portion of the first spacer having the rectangular plate shape is arranged along three sides of the outer peripheral edges of the bonded surfaces of the cores. 4. The heat exchanger according to claim 2 , further comprising a first header portion provided on first side surfaces of the cores orthogonal to the bonded surfaces and a second header portion provided on second side surfaces of the cores orthogonal to the first side surfaces and the bonded surfaces, wherein on the bonded surfaces, a first side of the first spacer having the rectangular plate shape, which is closer to the first side surfaces, has a length equal to or more than a width of the first header portion, and a second side of the first spacer, which is closer to the second side surfaces, has a length equal to or more than a width of the second header portion, and extends to the gap portion. 5. The heat exchanger according to claim 4 , wherein on the bonded surfaces of the cores, the spacer portion includes a pair of the first spacers provided closer to a pair of the first side surfaces that sandwiches each of the bonded surfaces therebetween, respectively, and a second spacer having a rectangular plate shape, provided between the pair of first spacers, and arranged through the gap portion with respect to each of the pair of first spacers. 6. The heat exchanger according to claim 5 , wherein on the bonded surfaces of the cores, the gap portion is provided to pass through a region between the first spacer and the second spacer from one of the second side surfaces to the other of the second side surfaces. 7. The heat exchanger according to claim 2 , wherein on the bonded surfaces of the cores, the gap portion is provided at a position closer to one of a pair of first side surfaces, which is orthogonal to the bonded surfaces and sandwiches each of the bonded surfaces therebetween, than the other of the pair of first side surfaces in a region in which the temperature gradient is relatively shallow in the bonded surfaces of the cores, and the first spacer having the rectangular plate shape extends from an end closer to the other of the first side surfaces to the gap portion closer to the one of the first side surfaces on the bonded surfaces of the cores. 8. The heat exchanger according to claim 1 , further comprising a header portion arranged on side surfaces different from the bonded surfaces of the cores and provided to straddle the spacer portion and to cover the flow path portions of the multiple cores, wherein the gap portion is arranged at a position that is different from a region in which the header portion is arranged and that is closer to the header portion in regions in which the temperature gradient on the bonded surfaces of the cores is relatively shallow.

Assignees

Inventors

Classifications

  • the means being corrugated, plate-like elements · CPC title

  • F28D9/0062Primary

    the conduits for one heat-exchange medium being formed by spaced plates with inserted elements (F28D9/0012, F28D9/0025, F28D9/0081, F28D9/04 take precedence) · CPC title

  • Spacing means · CPC title

  • for preventing leakage · CPC title

  • by welding · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9927184B2 cover?
A spacer portion ( 3 ) of this heat exchanger ( 100 ) includes an outer peripheral portion ( 3 a ) circumferentially provided along outer peripheral edges of bonded surfaces ( 1 a ) of cores ( 1 ) and a gap portion ( 3 b and 3 c ) provided in a partial region of the circumferential outer peripheral portion, and the gap portion is provided at a position where a temperature gradient on …
Who is the assignee on this patent?
Sumitomo Precision Prod Co
What technology area does this patent fall under?
Primary CPC classification F28D9/0062. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).