Tin-silver diffusion soldering for thin joints without flux

Patent metadata

Field	Value
Publication number	US-9925773-B2
Application number	US-201615184447-A
Country	US
Kind code	B2
Filing date	Jun 16, 2016
Priority date	Jun 16, 2016
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A stack of layers has a first component layer, a first silver layer, a tin layer, a second silver layer, a second component silver layer, and a second component layer.

First claim

What is claimed is:

1. A stack of layers, comprising:
a first component layer;
a bond layer on the first component layer, comprising:
a first silver layer on the first component layer;
a tin layer on the first silver layer;
a second silver layer on the tin layer, wherein the second silver layer is thinner than the first silver layer;
a second component silver layer on the second silver layer; and

a second component layer on the bond layer.

2. The stack of layers of claim 1 , wherein one of the first and second component layers comprises a piezoelectric component.

3. The stack of layers of claim 2 , wherein another of the first and second component layers comprises a stainless steel diaphragm.

4. The stack of layers of claim 1 , wherein the layers are heat bonded together.

5. The stack of layers of claim 1 , wherein the first silver layer, the tin layer and the second silver layer have a thickness of less than 50 micrometers.

6. The stack of layers of claim 1 , wherein the second silver layer has a thickness of less than or equal to 1 micrometer.

7. The stack of layers of claim 1 , wherein the second component silver layer has a thickness of 1 micrometer.

8. An apparatus, comprising:
a first component;
a bond layer consisting of a first layer of silver, a layer of tin on the first layer of silver, and a second layer of silver on the layer of tin, wherein the second layer of tin is thinner than the first layer of silver, the bond layer bonded to the first component having a thickness less than 50 micrometers; and
a second component bonded to the bond layer on a side of the bond layer opposite to the first component.

9. The apparatus of claim 8 , wherein the bond layer has a thickness of less than or equal to 11 micrometers.

Assignees

• Xerox Corp

Inventors

• Knierim David L

Classifications

• B23K1/0016 Primary

  Soldering of electronic components · CPC title

• B23K1/00

  Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) · CPC title

• B41J2/14274 Primary

  of stacked structure type, deformed by compression/extension and disposed on a diaphragm · CPC title

• B41J2/1607

  Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence) · CPC title

• B23K20/026

  with diffusion of soldering material · CPC title