Method for fusing nanowire junctions in conductive films

US9925616B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9925616-B2
Application numberUS-201414567983-A
CountryUS
Kind codeB2
Filing dateDec 11, 2014
Priority dateDec 23, 2013
Publication dateMar 27, 2018
Grant dateMar 27, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

According to one or more embodiments of the present invention, a method for fusing metal nanowire junctions in a conductive film includes applying a constant current through the conductive film including a plurality of metal nanowires and a plurality of metal nanowire junctions, or conducting an ultrasonic welding of the metal nanowire junctions.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for fusing metal nanowire junctions in a conductive film, the method comprising: applying a constant current with a constant linear current density selected from 0.01 A/cm to 1 A/cm through the conductive film for a duration selected from 10 ms to 10 s to generate heat, the conductive film comprising a plurality of metal nanowires and a plurality of metal nanowire junctions, and fusing the metal nanowire junctions with the heat. 2. The method of claim 1 , wherein the applying of the constant current is through a pair of electrodes facing each other. 3. The method of claim 1 , wherein the applying of the constant current is through two or more pairs of electrodes. 4. The method of claim 1 , wherein the conductive film is coated on a glass substrate or a plastic substrate. 5. The method of claim 1 , wherein the conductive film is coated on a rigid substrate, a flexible substrate, or a stretchable substrate. 6. The method of claim 1 , wherein the conductive film is coated on an optically transparent substrate or an opaque substrate. 7. The method of claim 1 , wherein the applying of the constant current through the conductive film comprises: applying the constant current on a first section of the conductive film; advancing the conductive film; and applying the constant current on a second section of the conductive film. 8. The method of claim 1 , wherein the applying of the constant current is performed as part of a roll-to-roll process, and a speed of advancement of the roll is varied to control a treatment time of the film. 9. A method for fusing metal nanowire junctions in a conductive film, the method comprising: conducting an ultrasonic welding of the conductive film to generate heat, the conductive film comprising a plurality of metal nanowires and a plurality of metal nanowire junctions, and fusing the metal nanowire junctions with the heat. 10. The method of claim 9 , wherein the ultrasonic welding is conducted at a frequency of 10 to 400 kHz. 11. The method of claim 9 , wherein the conducting of the ultrasonic welding is through two or more ultrasonic heads. 12. The method of claim 11 , wherein the array of ultrasonic heads are in contact with the conductive film during the conducting of the ultrasonic welding. 13. The method of claim 11 , wherein the array of ultrasonic heads are separated from the conductive film by an air gap during the conducting of the ultrasonic welding. 14. The method of claim 9 , wherein the conductive film is coated on a glass substrate or a plastic substrate. 15. The method of claim 9 , wherein the conductive film is coated on a rigid substrate, a flexible substrate, or a stretchable substrate. 16. The method of claim 9 , wherein the conductive film is coated on an optically transparent substrate or an opaque substrate. 17. The method of claim 9 , wherein the conducting of the ultrasonic welding of the conductive film comprises: conducting the ultrasonic welding on a first section of the conductive film; advancing the conductive film; and conducting the ultrasonic welding on a second section of the conductive film. 18. The method of claim 9 , wherein the conducting of the ultrasonic welding is performed as part of a roll-to-roll process, and a speed of advancement of the roll is varied to control a treatment time of the film. 19. A method of manufacturing a device, comprising: applying at least one of a constant current or an ultrasonic welding through a conductive film to generate heat, the conductive film comprising a plurality of metal nanowires and a plurality of metal nanowire junctions, and fusing the metal nanowire junctions with the heat, wherein the device is a liquid crystal display, an organic light emitting device, a solar photovoltaic, a touch screen, or an electrochromic oxide-based film, and wherein the constant current has a constant linear current density selected from 0.01 A/cm to 1 A/cm and is applied for a duration selected from 10 ms to 10 s.

Assignees

Inventors

Classifications

  • Welding of thin articles · CPC title

  • taking account of the properties of the material to be welded · CPC title

  • making use of vibrations, e.g. ultrasonic welding · CPC title

  • specially adapted for particular articles or work (B23K20/129 takes precedence) · CPC title

  • B23K11/008Primary

    Manufacturing of metallic grids or mats by spot welding · CPC title

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Frequently asked questions

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What does patent US9925616B2 cover?
According to one or more embodiments of the present invention, a method for fusing metal nanowire junctions in a conductive film includes applying a constant current through the conductive film including a plurality of metal nanowires and a plurality of metal nanowire junctions, or conducting an ultrasonic welding of the metal nanowire junctions.
Who is the assignee on this patent?
Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23K11/008. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).