Passive layer for attenuation of near-field electromagnetic waves and heatdissipation including graphene, and electromagnetic device including the same

US9924619B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9924619-B2
Application numberUS-201214345996-A
CountryUS
Kind codeB2
Filing dateAug 10, 2012
Priority dateOct 26, 2011
Publication dateMar 20, 2018
Grant dateMar 20, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a passive layer including graphene for the attenuation of near-field electromagnetic waves and heat dissipation. The passive layer blocks electromagnetic waves radiated from an external electronic device or prevents electromagnetic waves generated in an electronic device from emitting to the outside. The passive layer is designed to reduce interference between transmission circuits of a device in the near-field region or influence such as malfunction caused by external electromagnetic waves. The present invention also relates to an electromagnetic device and a circuit board, each including the passive layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electromagnetic device comprising (a) a base, (b) one or more active layers with a small gap of insulator, (c) one or more multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation comprising a graphene layer and a polymer layer, and (d) one or more low dielectric constant layers, wherein the passive layers for the attenuation of near-field electromagnetic waves and heat dissipation are in contact with the low dielectric constant layers, the base is in contact with one of the passive layers for the attenuation of near-field electromagnetic waves and heat dissipation, one of the low dielectric constant layers, or both of them, one of the multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation is formed on the active layers, one of the low dielectric constant layers is formed on the active layers, or the active layers are surrounded by one of the low dielectric constant layers, the low dielectric constant layers are selected from the group consisting of oxide layers, nitride layers, carbide layers, and polymer layers, the multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation are undoped or doped with either an organic dopant or an inorganic dopant or both of them, the base is selected from the group consisting of metal bases, ceramic bases, polymer bases, silicon bases, flexible circuit substrates, rigid circuit substrates, and flexible films, the active layers are selected from the group consisting of signal circuit lines, ground circuit lines, transmission circuit lines, electrodes, semiconductor layers, and memory layers, and the electromagnetic device is selected from the group consisting of thin film devices, nanodevices, semiconductor devices, memory devices, molecular devices, optical devices, display devices, digital devices, and devices comprising a rigid or flexible substrate, wherein the graphene layer is essentially free of carbon nanotubes. 2. The electromagnetic device according to claim 1 , wherein at least some of the active layers (b) are formed on portions of the upper surface of the base (a), one of the multilayer passive layers (c) for the attenuation of near-field electromagnetic waves and heat dissipation is formed as a film or is patterned on the upper portions of the some of the active layers and the remaining portion of the upper surface of the base on which the some active layers are not formed, and one of the low dielectric constant layers (d) is formed on the upper surface of the multilayer passive layer. 3. The electromagnetic device according to claim 2 , wherein the multilayer passive layer for the attenuation of near-field electromagnetic waves and heat dissipation is a composite passive layer for the attenuation of near-field electromagnetic waves and heat dissipation consisting of two or more multilayer passive layers, and the active layers are surrounded by another low dielectric constant layer. 4. The electromagnetic device according to claim 1 , wherein at least some of the active layers (b) are formed on portions of the upper surface of the base (a), one of the low dielectric constant layers (d) is formed on the upper portions of the some active layers and the remaining portion of the upper surface of the base on which the some active layers are not formed, and one of the multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation is formed on the upper surface of the low dielectric constant layer. 5. The electromagnetic device according to claim 4 , wherein another layer of the low dielectric constant layers (d) is further formed on the multilayer passive layer for the attenuation of near-field electromagnetic waves and heat dissipation formed on the upper surface of the low dielectric constant layer. 6. The electromagnetic device according to claim 5 , wherein the multilayer passive layer for the attenuation of near-field electromagnetic waves and heat dissipation formed on the upper surface of the low dielectric constant layer is a composite passive layer for the attenuation of near-field electromagnetic waves and heat dissipation consisting of two or more multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation, and the two or more multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation are doped with a dopant. 7. The electromagnetic device according to claim 6 , wherein a further composite passive layer for the attenuation of near-field electromagnetic waves and heat dissipation is formed on the upper surface of the low dielectric constant layer formed on the multilayer passive layer for the attenuation of near-field electromagnetic waves and heat dissipation, and a further low dielectric constant layer is formed on the upper surface of the further composite passive layer for the attenuation of near-field electromagnetic waves and heat dissipation. 8. The electromagnetic device according to claim 1 , wherein one of the multilayer passive layers (c) for the attenuation of near-field electromagnetic waves and heat dissipation is formed on the upper surface of the base (a), and at least some of the active layers (b) and at least one layer of the low dielectric constant layers (d) surrounding the some active layers are formed on the multilayer passive layer for the attenuation of near-field electromagnetic waves and heat dissipation. 9. The electromagnetic device according to claim 8 , wherein another layer of the multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation is formed on the upper surface of the low dielectric constant layer formed on the multilayer passive layer, and another layer of the low dielectric constant layers is formed on the upper surface of the another passive layer for the attenuation of near-field electromagnetic waves and heat dissipation. 10. The electromagnetic device according to claim 1 , wherein one of the low dielectric constant layers (d) is formed on the upper surface of the base (a), one of the multilayer passive layers (c) for the attenuation of near-field electromagnetic waves and heat dissipation is formed on the upper surface of the low dielectric constant layer, and at least some of the active layers (b) and at least one layer of the low dielectric constant layers (d) surrounding the active layers are formed on the multilayer passive layer for the attenuation of near-field electromagnetic waves and heat dissipation. 11. The electromagnetic device according to claim 1 , wherein at least some of the active layers (b) and at least one layer of the low dielectric constant layers (d) surrounding the active layers are formed on the upper surface of the base (a), one of the multilayer passive layers (c) for the attenuation of near-field electromagnetic waves and heat dissipation is formed on the upper surface of the low dielectric constant layer, the multilayer passive layer for the attenuation of near-field electromagnetic waves and heat dissipation formed on the upper surface of the low dielectric constant layer is a composite passive layer for the attenuation of near-field electromagnetic waves and heat dissipation consisting of two or more multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation, and the two or more multilayer passive layers for the attenuation of near-field electromagnetic waves and heat dissipation are doped with a dopant. 12. The electromagnetic device according to claim 11 , wherein a further low dielect

Assignees

Inventors

Classifications

  • by chemical vapour deposition [CVD] · CPC title

  • H05K9/0081Primary

    Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title

  • Reduction of cross-talk, noise or electromagnetic interference (grounding H05K1/0215) · CPC title

  • B32B9/005Primary

    comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00) · CPC title

  • Electrical equipment · CPC title

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What does patent US9924619B2 cover?
The present invention relates to a passive layer including graphene for the attenuation of near-field electromagnetic waves and heat dissipation. The passive layer blocks electromagnetic waves radiated from an external electronic device or prevents electromagnetic waves generated in an electronic device from emitting to the outside. The passive layer is designed to reduce interference between t…
Who is the assignee on this patent?
Kim Sang Woo, Hong Byung Hee, Choi Jaeboong, and 3 more
What technology area does this patent fall under?
Primary CPC classification H05K9/0081. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).