Ingress protection for reducing particle infiltration into acoustic chamber of a mems microphone package
US-2017041692-A1 · Feb 9, 2017 · US
US9924254B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9924254-B2 |
| Application number | US-201715416744-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 26, 2017 |
| Priority date | May 17, 2016 |
| Publication date | Mar 20, 2018 |
| Grant date | Mar 20, 2018 |
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A MEMS microphone is disclosed. The MEMS microphone includes an encapsulation structure provided with an accommodation space; a MEMS chip for detecting sound signal accommodated in the accommodation space; an ASIC chip received in the accommodation space. The ASIC chip includes a signal processing module connected to MEMS chip for processing the sound signal detected by the MEMS chip and outputting the processed sound signal. The MEMS microphone further includes a temperature detection module for detecting temperature signal and outputting the temperature signal.
Opening claim text (preview).
What is claimed is: 1. A MEMS microphone, comprising: an encapsulation structure provided with an accommodation space; a MEMS chip for detecting sound signal accommodated in the accommodation space, the MEMS chip including a MEMS power module; an ASIC chip received in the accommodation space, the ASIC chip including a signal processing module connected to MEMS chip for processing the sound signal detected by the MEMS chip and outputting the processed sound signal; wherein the MEMS microphone further includes a temperature detection module for detecting temperature signal and outputting the temperature signal, the ASIC chip includes a voltage module for providing drive voltage to the MEMS power module; wherein the temperature detection module is a digital circuit module; wherein, the ASIC chip further includes a clock module connected to the temperature detection module, and the clock module controls whether the temperature detection module outputs temperature signal or not. 2. The MEMS microphone as described in claim 1 , wherein the MEMS chip includes a signal detection module for transmitting the sound signal to the signal processing module. 3. The MEMS microphone as described in claim 2 , wherein the sound signal detected by the signal detection module is a differential analog signal. 4. The MEMS microphone as described in claim 3 , wherein the signal processing module further includes an analog-to-digital converter that converts the differential analog signal to digital signal. 5. The MEMS microphone as described in claim 4 , wherein the signal processing module further includes an amplifier that amplifies the digital signal.
for microphones (H04R29/007 takes precedence) · CPC title
the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title
Microphones (H04R19/01 takes precedence) · CPC title
Microphones or microspeakers · CPC title
Mems transducers or their use · CPC title
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