PCB connector footprint

US9923309B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9923309-B1
Application numberUS-201715417383-A
CountryUS
Kind codeB1
Filing dateJan 27, 2017
Priority dateJan 27, 2017
Publication dateMar 20, 2018
Grant dateMar 20, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A PCB includes a substrate having a connector surface with a PCB connector footprint defined along a longitudinal axis and a lateral axis and subdivided into PCB column grouping footprints extending generally parallel to the longitudinal axis. The PCB includes signal vias arranged in pairs along a signal pair axis with a plurality of pairs of signal vias in each PCB column grouping footprint. The signal pair axis is non-parallel to the longitudinal axis, non-parallel to the lateral axis and intersects the longitudinal axis at a lesser angle than the signal pair axis intersects the lateral axis. The PCB includes ground vias at least partially through the substrate. The ground vias are arranged around each of the pairs of signal vias to provide electrical shielding around each of the pairs of signal vias.

First claim

Opening claim text (preview).

What is claimed is: 1. A printed circuit board (PCB) for an electrical connector having signal contacts and ground contacts extending from a mounting end of the electrical connector, the PCB comprising: a substrate having a plurality of layers, the substrate having a connector surface configured to face the electrical connector and a PCB connector footprint on the connector surface defined below a footprint of the electrical connector, the PCB connector footprint being an area defined along a longitudinal axis and a lateral axis perpendicular to the longitudinal axis, the PCB connector footprint being subdivided into PCB column grouping footprints generally arranged in columns parallel to the longitudinal axis; signal vias at least partially through the substrate, the signal vias being arranged in pairs arranged along a signal pair axis with a plurality of pairs of signal vias in each PCB column grouping footprint, the pairs of signal vias being aligned in the corresponding columns parallel to the longitudinal axis, the pairs of signal vias being aligned in corresponding rows parallel to the lateral axis, the signal pair axis being non-parallel to the longitudinal axis, the signal pair axis being non-parallel to the lateral axis, the signal pair axis intersecting the longitudinal axis at a lesser angle than the signal pair axis intersects the lateral axis; and ground vias at least partially through the substrate, the ground vias being arranged around each of the pairs of signal vias to provide electrical shielding around each of the pairs of signal vias wherein at least one ground via is arranged between adjacent pairs of signal vias within the PCB column grouping footprints and wherein at least one ground via is arranged between adjacent pairs of signal vias in adjacent PCB column grouping footprints. 2. The PCB of claim 1 , wherein the signal pair axis is a non-45° angle relative to the longitudinal axis. 3. The PCB of claim 1 , wherein the signal pair axis is approximately 30° from the longitudinal axis. 4. The PCB of claim 1 , wherein each pair of signal vias includes a first signal via and a second signal via, the first and second signal vias being offset on opposite sides of the longitudinal centerline of the PCB column grouping footprint. 5. The PCB of claim 1 , wherein the PCB connector footprint includes trace routing areas between the signal vias and the ground vias of adjacent PCB column grouping footprints for routing signal traces connected to corresponding signal vias. 6. The PCB of claim 5 , wherein the ground vias are outside of the trace routing areas. 7. The PCB of claim 1 , wherein the ground vias are arranged in rows between the pairs of signal vias. 8. The PCB of claim 1 , wherein the ground vias are arranged in via sets with corresponding pairs of the signal vias, each via set including, in order, a first ground via, a first signal via, a second signal via, and a second ground via arranged generally along the signal pair axis. 9. The PCB of claim 8 , wherein the ground vias include outlier ground vias offset from the corresponding signal pair axis. 10. The PCB of claim 8 , wherein the first ground vias of the ground via sets are aligned in a row parallel to the lateral axis with the second ground vias of the corresponding adjacent ground via set. 11. An electrical connector system comprising: an electrical connector having a housing having contact modules arranged in a contact module stack received in and extending from the housing, each contact module having a dielectric holder, signal contacts held by the dielectric holder, ground contacts held by the dielectric holder and a ground shield held by the dielectric holder, the signal contacts being arranged in pairs carrying differential signals, the signal contacts having signal mounting portions extending from a mounting end of the dielectric holder, the ground contacts having ground mounting portions extending form the mounting end of the dielectric holder, the ground shield having a plurality of ground mounting contacts extending below the mounting end of the dielectric holder; and a printed circuit board (PCB) comprising a substrate having a connector surface facing the electrical connector and a PCB connector footprint on the connector surface defined below a footprint of the electrical connector, the PCB connector footprint being an area defined along a longitudinal axis and a lateral axis perpendicular to the longitudinal axis, the PCB connector footprint being subdivided into PCB column grouping footprints defined below footprints of corresponding contact modules of the electrical connector, the PCB column grouping footprints being areas extending generally parallel to the longitudinal axis, the PCB comprising signal vias arranged in pairs arranged along a corresponding signal pair axis, a plurality of pairs of signal vias being arranged in each PCB column grouping footprint, the signal pair axis being non-parallel to the longitudinal axis, the signal pair axis being non-parallel to the lateral axis, the signal pair axis intersecting the longitudinal axis at a lesser angle than the signal pair axis intersects the lateral axis, the PCB comprising ground vias arranged around each of the pairs of signal vias to provide electrical shielding around each of the pairs of signal vias. 12. The electrical connector system of claim 11 , wherein the signal pair axis is a non-45° angle relative to the longitudinal axis. 13. The electrical connector system of claim 11 , wherein the signal pair axis is approximately 30° from the longitudinal axis. 14. The electrical connector system of claim 11 , wherein the PCB connector footprint includes trace routing areas between the PCB column grouping footprints for routing signal traces connected to corresponding signal vias. 15. The electrical connector system of claim 11 , wherein the ground vias are arranged in rows between the pairs of signal vias. 16. The electrical connector system of claim 11 , wherein the ground vias are arranged in via sets with corresponding pairs of the signal vias, each via set including, in order, a first ground via, a first signal via, a second signal via, and a second ground via arranged generally along the signal pair axis. 17. The electrical connector system of claim 16 , wherein the first ground vias of the ground via sets are aligned in a row parallel to the lateral axis with the second ground vias of the corresponding adjacent ground via set. 18. A contact module for an electrical connector comprising: a dielectric holder having first and second sides extending along a longitudinal axis between a front and a rear of the dielectric holder, the dielectric holder having a lateral axis perpendicular to the longitudinal axis between the first and second sides, the dielectric holder having a mating end at the front and a mounting end at a bottom of the dielectric holder; signal contacts being held by the dielectric holder along a contact plane parallel to the longitudinal axis and defined between the first and second sides, the signal contacts being arranged in pairs carrying differential signals, the signal contacts having mating portions extending from the mating end, mounting portions extending from the mounting end for termination to a printed circuit board (PCB), and transition portions extending through the dielectric holder between the mating and mounting portions; ground contacts being held by the dielectric holder along the contact plane between corresponding signal contacts, the ground contacts providing electrical shielding

Assignees

Inventors

Classifications

  • Lay-out of balanced signal pairs, e.g. differential lines or twisted lines · CPC title

  • Lands, clearance holes or other lay-out details concerning the surrounding of a via · CPC title

  • Locking or fixing a connector to a PCB · CPC title

  • for mounting on PCBs · CPC title

  • Coupling device supported only by cooperation with PCB · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9923309B1 cover?
A PCB includes a substrate having a connector surface with a PCB connector footprint defined along a longitudinal axis and a lateral axis and subdivided into PCB column grouping footprints extending generally parallel to the longitudinal axis. The PCB includes signal vias arranged in pairs along a signal pair axis with a plurality of pairs of signal vias in each PCB column grouping footprint. T…
Who is the assignee on this patent?
Te Connectivity Corp, Tyco Electronics Japan G K
What technology area does this patent fall under?
Primary CPC classification H01R13/6587. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).