Antenna and electronic device comprising thereof

Patent metadata

Field	Value
Publication number	US-9923264-B2
Application number	US-201615146337-A
Country	US
Kind code	B2
Filing date	May 4, 2016
Priority date	May 8, 2015
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

An antenna is provided. The antenna includes a carrier having a via hole penetrating an outer surface and an inner surface thereof, a first antenna radiator formed on the outer surface of the carrier and at least a part of a surface of the carrier that defines the via hole, a second antenna radiator formed on an inner surface of the carrier and electrically contacting the first antenna radiator through the via hole, and a coupling member configured to electrically connect the second antenna radiator with a circuit board provided in the electronic device.

First claim

What is claimed is:

1. An antenna for an electronic device, the antenna comprising:
a carrier including a via hole;
a first antenna radiator formed on an outer surface of the carrier and on at least a part of a surface of the carrier that defines the via hole;
a second antenna radiator formed on an inner surface of the carrier and electrically contacting the first antenna radiator through the via hole;
a coupling member configured to electrically connect the second antenna radiator with a circuit board provided in the electronic device; and
a contact pin configured for insertion into and coupling with the via hole,
wherein the first antenna radiator and the second antenna radiator are electrically interconnected through the contact pin.

2. The antenna of claim 1 , wherein the first antenna radiator or the second antenna radiator extends along the surface of the carrier that defines the via hole to allow the first antenna radiator and the second antenna radiator to be electrically interconnected.

3. The antenna of claim 1 , wherein the first antenna radiator corresponds to a direct printed antenna (DPA) radiator.

4. The antenna of claim 1 , wherein the second antenna radiator corresponds to a laser direct structuring (LDS) antenna radiator.

5. The antenna of claim 1 , wherein the first antenna radiator and the second antenna radiator are formed by a same process.

6. The antenna of claim 1 , wherein the coupling member comprises:
a flat portion configured to contact the circuit board; and
a bending portion extending from the flat portion and configured to contact the second antenna radiator.

7. The antenna of claim 1 , wherein the coupling member comprises an elastic member.

8. The antenna of claim 7 , wherein the elastic member comprises a clip.

9. The antenna of claim 1 , wherein the coupling member makes contact with the second antenna radiator and is physically spaced apart from the contact pin.

10. The antenna of claim 1 , wherein a laser direct structuring (LDS) process is applied to a surface of the contact pin.

11. The antenna of claim 1 , wherein the contact pin comprises a metal.

12. An electronic device including an antenna for communication with an external device,
wherein the antenna comprises:
a carrier including a via hole;
a first antenna radiator formed on an outer surface of the carrier and on at least a part of a surface of the carrier that defines the via hole;
a second antenna radiator formed on an inner surface of the carrier and electrically connected with the first antenna radiator through the via hole;
a coupling member configured to electrically connect the second antenna radiator with a circuit board provided in the electronic device; and
a contact pin configured for insertion into and coupling with the via hole, and

wherein the first antenna radiator and the second antenna radiator are electrically interconnected through the contact pin.

13. The antenna of claim 12 , wherein the first antenna radiator or the second antenna radiator extends along the surface of the carrier that defines the via hole to allow the first antenna radiator and the second antenna radiator to be electrically interconnected.

14. The antenna of claim 12 , wherein the first antenna radiator corresponds to a direct printed antenna (DPA) radiator.

15. The antenna of claim 12 , wherein the second antenna radiator corresponds to a laser direct structuring (LDS) antenna radiator.

16. An electronic device comprising:
at least one processor;
a transceiver; and
an antenna electrically connected with the transceiver,
wherein the antenna comprises:
a carrier including a via hole;
a first antenna radiator formed on an outer surface of the carrier and on at least a part of a surface of the carrier that defines the via hole;
a second antenna radiator formed on an inner surface of the carrier and electrically connected with the first antenna radiator through the via hole;
a coupling member configured to electrically connect the second antenna radiator with the transceiver; and
a contact pin configured for insertion into and coupling with the via hole,

wherein the first antenna radiator and the second antenna radiator are electrically interconnected through the contact pin, and
wherein the at least one processor is configured to control the transceiver to transmit to or receive from the antenna a signal of a specific frequency band.

17. The antenna of claim 1 , wherein the circuit board comprises:
a main circuit board, and
a sub circuit board,
wherein the coupling member is further configured to electrically connect the second antenna radiator with at least one of the main circuit board or the sub circuit board.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Yeon Woo
• Park Jung Sik
• Jeon Seung Gil

Classifications

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

• H01Q1/38 Primary

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q9/06

  Details · CPC title