Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device

Patent metadata

Field	Value
Publication number	US-9923130-B2
Application number	US-201414773805-A
Country	US
Kind code	B2
Filing date	Mar 7, 2014
Priority date	Mar 14, 2013
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

An optoelectronic semiconductor component has at least one semiconductor chip for emitting electromagnetic radiation. The semiconductor chip has at least one side surface and wherein a part of the electromagnetic radiation exits through the side surface during operation of the semiconductor chip. The semiconductor component additionally has at least one deflecting element that is formed to be transmissive to radiation. The deflecting element and the semiconductor chip are arranged one alongside another. The deflecting element is arranged at the side surface of the semiconductor chip. The deflecting element has a material, the index of refraction of which is greater than an average index of refraction of a semiconductor material of the semiconductor chip.

First claim

The invention claimed is:

1. An optoelectronic semiconductor device comprising:
a semiconductor chip that emits electromagnetic radiation during operation, wherein the semiconductor chip comprises a lateral surface and a top side facing away from a carrier, and wherein a first portion of the electromagnetic radiation exits through the lateral surface and a second portion of the electromagnetic radiation is outcoupled at the top side during the operation of the semiconductor chip; and
a radiation-transmissive deflecting element arranged next to the lateral surface of the semiconductor chip, wherein the deflecting element comprises a material whose refractive index is higher than an average refractive index of a semiconductor material of the semiconductor chip, wherein the deflecting element does not cover the top side of the semiconductor chip.

2. The optoelectronic semiconductor device according to claim 1 , wherein the deflecting element is formed in one piece, and wherein the deflecting element is arranged circumferentially on the lateral surface of the semiconductor chip.

3. The optoelectronic semiconductor device according to claim 1 , wherein the deflecting element comprises a first lateral surface facing the lateral surface of the semiconductor chip and a second lateral surface arranged opposite to the first lateral surface, and wherein the semiconductor chip is formed such that the first portion of the radiation that has exited the lateral surface of the semiconductor chip enters into the deflecting element via the first lateral surface.

4. The optoelectronic semiconductor device according to claim 3 , wherein the deflecting element is formed and arranged such that the radiation that has entered the deflecting element is completely or partially prevented from exiting the second lateral surface of the deflecting element.

5. The optoelectronic semiconductor device according to claim 3 , wherein the deflecting element comprises a top side facing away from the carrier, and wherein the deflecting element is formed and arranged such that the first portion of the radiation which is emitted by the semiconductor chip and has entered the deflecting element is outcoupled at the top side of the deflecting element.

6. The optoelectronic semiconductor device according to claim 5 , wherein the top side of the deflecting element has a structuring, and wherein the first and second lateral surfaces of the deflecting element are formed smoother than the top side of the deflecting element.

7. The optoelectronic semiconductor device according to claim 3 , wherein the top side of the semiconductor chip has a structuring.

8. The optoelectronic semiconductor device according to claim 7 , further comprising a wavelength conversion element, wherein the wavelength conversion element is configured for at least partially converting the radiation exiting the top side of the semiconductor chip and the radiation exiting the top side of the deflecting element into an electromagnetic secondary radiation.

9. The optoelectronic semiconductor device according to claim 1 , wherein the deflecting element is arranged immediately adjacent the lateral surface of the semiconductor chip.

10. The optoelectronic semiconductor device according to claim 1 , further comprising a connecting layer arranged between the deflecting element and the semiconductor chip, wherein the connecting layer comprises a material whose refractive index is less than or equal to the refractive index of the material of the semiconductor chip, and wherein the refractive index of the material of the connecting layer is less than the refractive index of the material of the deflecting element.

11. The optoelectronic semiconductor device according to claim 1 , wherein the deflecting element comprises a first lateral surface facing the lateral surface of the semiconductor chip and a second lateral surface arranged opposite to the first lateral surface, wherein the deflecting element comprises a bottom side facing the carrier, and wherein a reflecting layer is arranged between the bottom side of the deflecting element and the carrier and/or on the second lateral surface of the deflecting element.

12. The optoelectronic semiconductor device according to claim 1 , wherein the semiconductor chip comprises GaN, and wherein the deflecting element comprises TiO 2 , TeO 2 or InGaN.

13. The optoelectronic semiconductor device according to claim 1 , wherein a vertical extent of the deflecting element is substantially the same as a vertical extent of the semiconductor chip, wherein the deflecting element is configured to deflect the radiation generated by the semiconductor chip that exits from the lateral surface of the semiconductor chip at which the deflecting element is arranged, and wherein the deflecting element covers the lateral surfaces of the semiconductor chip at least in parts.

14. The optoelectronic semiconductor device according to claim 1 , further comprising a wavelength conversion element, wherein the wavelength conversion element is configured for at least partially converting the radiation exiting the top side of the semiconductor chip and radiation exiting a top side of the deflecting element into an electromagnetic secondary radiation, wherein the wavelength conversion element is arranged immediately adjacent the deflecting element and the semiconductor chip.

15. A method for producing an optoelectronic semiconductor device according claim 1 , the method comprising:
providing the carrier; and
arranging the semiconductor chip and the deflecting element on the carrier such that a first lateral surface of the deflecting element faces the lateral surface of the semiconductor chip.

16. The method according to claim 15 , wherein the deflecting element is formed in a frame-like manner,
wherein the semiconductor chip is introduced into the deflecting element to establish a form-fitting connection between the deflecting element and semiconductor chip, or
wherein the semiconductor chip is introduced into the deflecting element, and wherein a connecting layer is arranged between the deflecting element and the semiconductor chip, in order to establish a firmly bonded connection between the deflecting element and semiconductor chip.

17. A method for producing an optoelectronic semiconductor device according to claim 1 , wherein the deflecting element is applied directly to the lateral surface of the semiconductor chip using a coating process.

18. An optoelectronic semiconductor device comprising:
a semiconductor chip configured to emit electromagnetic radiation, wherein the semiconductor chip comprises a lateral surface, and wherein a portion of the electromagnetic radiation exits through the lateral surface during operation of the semiconductor chip; and
a radiation-transmissive deflecting element arranged next to the lateral surface of the semiconductor chip, wherein the deflecting element comprises a material whose refractive index is higher than an average refractive index of a semiconductor material of the semiconductor chip, wherein the deflecting element is formed and arranged such that the radiation which has entered the deflecting element is completely or partially prevented from exiting a second lateral surface of the deflecting element, wherein the deflecting element comprises a first lateral surface facing the lateral surface of the semiconductor chip, the second lateral surface arranged opposite to the first lateral surface and a top side facing away from a carrier, wherein the semiconductor chip is formed such that the portio

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Zini Lorenzo
• Meyer Tobias

Classifications

• H01L33/46

  Electricity · mapped topic

• H01L33/505

  Electricity · mapped topic

• H01L33/60

  Electricity · mapped topic

• H01L33/62

  Electricity · mapped topic

• H01L33/44

  Electricity · mapped topic