Sputtering apparatus and method thereof
US-2015376774-A1 · Dec 31, 2015 · US
US9922809B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9922809-B2 |
| Application number | US-201615293063-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 13, 2016 |
| Priority date | Oct 14, 2015 |
| Publication date | Mar 20, 2018 |
| Grant date | Mar 20, 2018 |
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Systems and methods for growing hexagonal crystal structure piezoelectric material with a c-axis that is tilted (e.g., 25 to 50 degrees) relative to normal of a face of a substrate are provided. A deposition system includes a linear sputtering apparatus, a translatable multi-aperture collimator, and a translatable substrate table arranged to hold multiple substrates, with the substrate table and/or the collimator being electrically biased to a nonzero potential. An enclosure includes first and second deposition stations each including a linear sputtering apparatus, a collimator, and a deposition aperture.
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What is claimed is: 1. A deposition system comprising: a linear sputtering apparatus comprising a target surface configured to eject metal atoms; a substrate table comprising a support surface that is configured to receive at least one wafer and is coupled to a translation element, wherein the translation element is configured to translate the substrate table and the at least one wafer during operation of the linear sputtering apparatus; and a collimator comprising a plurality…
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