Method for containing computer system components

Patent metadata

Field	Value
Publication number	US-9921619-B2
Application number	US-201615055704-A
Country	US
Kind code	B2
Filing date	Feb 29, 2016
Priority date	Apr 22, 2013
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

An apparatus includes a component bay having an operational height and an expanded height. The component bay is moveable between the operational height and the expanded height. A thermal element divides the component bay into one or more compartments, each compartment configured to receive a system component. The component bay at the operational height provides thermal contact between the received system component and the thermal element.

First claim

What is claimed is:

1. A method comprising:
expanding a component bay to an expanded height, a thermal element dividing the component bay into two compartments;
inserting a computer system component into each compartment in the expanded component bay; and
moving the component bay to an operational height, the operational height ensuring thermal contact between the computer system components and the thermal element, wherein scissor structures on opposing sides of the component bay provide movement of the component bay between the expanded height and the operational height.

2. The method of claim 1 , further comprising:
at least partially removing a frame module from a frame unit, the frame module supporting the component bay; and
replacing the frame module in the frame unit.

3. The method of claim 2 , further comprising:
electronically connecting the computer system components to a printed circuit board associated with the frame module.

4. The method of claim 3 , wherein a backplane is associated with each compartment in the component bay, wherein each backplane is electronically connected to the printed circuit board, and wherein electronically connecting the computer system components to the printed circuit board comprises:
electronically connecting the computer system components to the backplanes.

5. The method of claim 1 , further comprising:
securing the component bay at the operational height with a retainer.

6. The method of claim 1 , further comprising:
providing airflow through a heat dissipation region on the thermal element.

7. The method of claim 1 , wherein inserting the computer system components comprises sliding the computer system components along u-shaped sheet metal guide tracks.

Assignees

• IBM

Inventors

• Elison Bret P
• Mann Phillip V
• Moore Arden L
• Sinha Arvind K

Classifications

• G06F1/18

  Packaging or power distribution · CPC title

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• Y10T29/49826

  Assembling or joining · CPC title

• Y10T29/49128

  Assembling formed circuit to base · CPC title

• G06F1/181

  Enclosures (for portable computers G06F1/1613) · CPC title