Intermediate transfer member and image forming apparatus
US-2015078791-A1 · Mar 19, 2015 · US
US9921526B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9921526-B2 |
| Application number | US-201514967827-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 14, 2015 |
| Priority date | Jan 9, 2015 |
| Publication date | Mar 20, 2018 |
| Grant date | Mar 20, 2018 |
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A semiconductive resin composition includes at least two thermoplastic resins and a conductive filler. Each of the two thermoplastic resins has a sea-island structure, and 40% to 75% of the conductive filler are present in the thermoplastic resin in an island portion of the sea-island structure at an areal ratio of a cross section observed with a scanning electron microscope.
Opening claim text (preview).
What is claimed is: 1. A semiconductive resin composition, comprising: at least two thermoplastic resins; and a conductive filler, wherein the two thermoplastic resins form a sea-island structure in which one of the two thermoplastic resins forms a sea portion and another of the two thermoplastic resins forms one or more island portions, and in a cross section observed with a scanning electron microscope, an abundance ratio of the conductive filler in the one or more island portions of the sea-island structure to that in the sea portion and the one or more island portions is 40% to 75%. 2. The semiconductive resin composition of claim 1 , wherein the following relation is satisfied: Tc 1< Tc 2 wherein Tc1 represents a crystallization temperature of the thermoplastic resin in the sea portion of the sea-island structure and Tc2 represents a crystallization temperature of the thermoplastic resin in the one or more island portions thereof. 3. The semiconductive resin composition of claim 2 , wherein a difference between Tc2 and Tc1 (Tc2−Tc1) is not less than 5° C. 4. The semiconductive resin composition of claim 1 , wherein the following relation is satisfied: γ2−γ1≥30 mJ/m2 wherein γ1 represents a surface free energy of the thermoplastic resin in the sea portion of the sea-island structure and γ2 represents a surface free energy of the thermoplastic resin in the one or more island portions thereof. 5. The semiconductive resin composition of claim 1 , wherein the conductive filler is carbon black. 6. The semiconductive resin composition of claim 5 , wherein the carbon black has an average primary particle diameter of from 10 nm to 40 nm. 7. The semiconductive resin composition of claim 5 , wherein the carbon black has a DBP oil absorption not greater than 200 cm 3 /100 g. 8. A seamless belt member for electrophotography, comprising a semiconductive resin composition comprising: at least two thermoplastic resins; and a conductive filler, wherein the two thermoplastic resins form a sea-island structure in which one of the two thermoplastic resins forms a sea portion and another of the two thermoplastic resins forms one or more island portions, and wherein the sea-island structure is configured to decrease variation of resistance in the seamless belt member, and in a cross section observed with a scanning electron microscope, an abundance ratio of the conductive filler in the one or more island portions of the sea-island structure to that in the sea portion and the one or more island portions is 40% to 75%. 9. An image forming apparatus, comprising: an electrostatic latent image bearer; an electrostatic latent image former to form an electrostatic latent image on the electrostatic latent image bearer; an image developer to develop the electrostatic latent image with a toner to form a visible image; a transferer to transfer the visible image onto a recording medium; and a seamless belt member for electrophotography, comprising a semiconductive resin composition comprising: at least two thermoplastic resins; and a conductive filler, wherein the two thermoplastic resins form a sea-island structure in which one of the two thermoplastic resins forms a sea portion and another of the two thermoplastic resins forms one or more island portions, and wherein the sea-island structure is configured to decrease variation of resistance in the seamless belt member, and in a cross section observed with a scanning electron microscope, an abundance ratio of the conductive filler in the one or more island portions of the sea-island structure to that in the sea portion and the one or more island portions is 40% to 75%.
characterised by their structure; characterised by non-homogenuous distribution of components (microcapsular toners G03G9/093) · CPC title
details of the the intermediate support, e.g. chemical composition · CPC title
Structure, details of the transfer member, e.g. chemical composition · CPC title
the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title
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