Semiconductive resin composition, member for electrophotography and image forming apparatus

US9921526B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9921526-B2
Application numberUS-201514967827-A
CountryUS
Kind codeB2
Filing dateDec 14, 2015
Priority dateJan 9, 2015
Publication dateMar 20, 2018
Grant dateMar 20, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A semiconductive resin composition includes at least two thermoplastic resins and a conductive filler. Each of the two thermoplastic resins has a sea-island structure, and 40% to 75% of the conductive filler are present in the thermoplastic resin in an island portion of the sea-island structure at an areal ratio of a cross section observed with a scanning electron microscope.

First claim

Opening claim text (preview).

What is claimed is: 1. A semiconductive resin composition, comprising: at least two thermoplastic resins; and a conductive filler, wherein the two thermoplastic resins form a sea-island structure in which one of the two thermoplastic resins forms a sea portion and another of the two thermoplastic resins forms one or more island portions, and in a cross section observed with a scanning electron microscope, an abundance ratio of the conductive filler in the one or more island portions of the sea-island structure to that in the sea portion and the one or more island portions is 40% to 75%. 2. The semiconductive resin composition of claim 1 , wherein the following relation is satisfied: Tc 1< Tc 2 wherein Tc1 represents a crystallization temperature of the thermoplastic resin in the sea portion of the sea-island structure and Tc2 represents a crystallization temperature of the thermoplastic resin in the one or more island portions thereof. 3. The semiconductive resin composition of claim 2 , wherein a difference between Tc2 and Tc1 (Tc2−Tc1) is not less than 5° C. 4. The semiconductive resin composition of claim 1 , wherein the following relation is satisfied: γ2−γ1≥30 mJ/m2 wherein γ1 represents a surface free energy of the thermoplastic resin in the sea portion of the sea-island structure and γ2 represents a surface free energy of the thermoplastic resin in the one or more island portions thereof. 5. The semiconductive resin composition of claim 1 , wherein the conductive filler is carbon black. 6. The semiconductive resin composition of claim 5 , wherein the carbon black has an average primary particle diameter of from 10 nm to 40 nm. 7. The semiconductive resin composition of claim 5 , wherein the carbon black has a DBP oil absorption not greater than 200 cm 3 /100 g. 8. A seamless belt member for electrophotography, comprising a semiconductive resin composition comprising: at least two thermoplastic resins; and a conductive filler, wherein the two thermoplastic resins form a sea-island structure in which one of the two thermoplastic resins forms a sea portion and another of the two thermoplastic resins forms one or more island portions, and wherein the sea-island structure is configured to decrease variation of resistance in the seamless belt member, and in a cross section observed with a scanning electron microscope, an abundance ratio of the conductive filler in the one or more island portions of the sea-island structure to that in the sea portion and the one or more island portions is 40% to 75%. 9. An image forming apparatus, comprising: an electrostatic latent image bearer; an electrostatic latent image former to form an electrostatic latent image on the electrostatic latent image bearer; an image developer to develop the electrostatic latent image with a toner to form a visible image; a transferer to transfer the visible image onto a recording medium; and a seamless belt member for electrophotography, comprising a semiconductive resin composition comprising: at least two thermoplastic resins; and a conductive filler, wherein the two thermoplastic resins form a sea-island structure in which one of the two thermoplastic resins forms a sea portion and another of the two thermoplastic resins forms one or more island portions, and wherein the sea-island structure is configured to decrease variation of resistance in the seamless belt member, and in a cross section observed with a scanning electron microscope, an abundance ratio of the conductive filler in the one or more island portions of the sea-island structure to that in the sea portion and the one or more island portions is 40% to 75%.

Assignees

Inventors

Classifications

  • characterised by their structure; characterised by non-homogenuous distribution of components (microcapsular toners G03G9/093) · CPC title

  • G03G15/162Primary

    details of the the intermediate support, e.g. chemical composition · CPC title

  • Structure, details of the transfer member, e.g. chemical composition · CPC title

  • the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9921526B2 cover?
A semiconductive resin composition includes at least two thermoplastic resins and a conductive filler. Each of the two thermoplastic resins has a sea-island structure, and 40% to 75% of the conductive filler are present in the thermoplastic resin in an island portion of the sea-island structure at an areal ratio of a cross section observed with a scanning electron microscope.
Who is the assignee on this patent?
Takahashi Hiroaki, Yasunaga Hideaki, Izutani Akira, and 5 more
What technology area does this patent fall under?
Primary CPC classification G03G15/162. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).