Thermal mass flowmeter

US9921091B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9921091-B2
Application numberUS-201414910360-A
CountryUS
Kind codeB2
Filing dateFeb 5, 2014
Priority dateAug 6, 2013
Publication dateMar 20, 2018
Grant dateMar 20, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

In order to provide a thermal mass flowmeter which makes higher accuracy of gas flowrate measurement possible while reliability in the thermal mass flowmeter is ensured (while deterioration or breakage caused by droplet adhesion is prevented), the thermal mass flowmeter according to the present invention has a heating element for generating heat by conduction, a temperature detection bridge circuit for detecting a temperature of the heating element, and a sensor element driving circuit portion connected to the heating element and the temperature detection bridge circuit and executing conduction control to the heating element, in which the sensor element driving circuit portion has an output mechanism and an output impedance adjustment mechanism and the output impedance adjustment mechanism is disposed between the output mechanism and the heating element and its output impedance is higher than an electric resistance value of the heating element and less than 1 MΩ.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermal mass flowmeter for measuring a mass flowrate of a gas flow, comprising: a sensor element portion having a heating element for generating heat by conduction and a temperature detection bridge circuit for detecting a temperature of the heating element; and a sensor element driving circuit portion connected to the sensor element portion and executing conduction control to the heating element, wherein: the sensor element driving circuit portion has an output mechanism and an output impedance adjustment mechanism; the output impedance adjustment mechanism is disposed between the output mechanism and the heating element; an output impedance of the output impedance adjustment mechanism is higher than an electric resistance value of the heating element and less than 1 MΩ; the conduction control is current control; and an impedance of the output mechanism is higher than the electric resistance value of the heating element, and an output impedance of the sensor element driving circuit portion is lowered by the output impedance adjustment mechanism. 2. The thermal mass flowmeter according to claim 1 , wherein the output mechanism has a current limit mechanism for limiting a current to the heating element. 3. The thermal mass flowmeter according to claim 1 , wherein the output impedance adjustment mechanism is constituted by a current mirror circuit. 4. The thermal mass flowmeter according to claim 3 , wherein the output impedance adjustment mechanism further has an electric resistor that is disposed between the current mirror circuit and the heating element. 5. The thermal mass flowmeter according to claim 1 , wherein the sensor element driving circuit portion has a current output type digital-analog converter. 6. The thermal mass flowmeter according to claim 5 , wherein the sensor element driving circuit portion further has an input limiter for limiting an input value to the current output type digital-analog converter.

Assignees

Inventors

Classifications

  • Micromachined devices · CPC title

  • Feedback or rebalancing circuits, e.g. self heated constant temperature flowmeters · CPC title

  • G01F1/69Primary

    of resistive type · CPC title

  • G01P5/12Primary

    using variation of resistance of a heated conductor · CPC title

  • Circuits therefor, e.g. constant-current flow meters · CPC title

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Frequently asked questions

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What does patent US9921091B2 cover?
In order to provide a thermal mass flowmeter which makes higher accuracy of gas flowrate measurement possible while reliability in the thermal mass flowmeter is ensured (while deterioration or breakage caused by droplet adhesion is prevented), the thermal mass flowmeter according to the present invention has a heating element for generating heat by conduction, a temperature detection bridge cir…
Who is the assignee on this patent?
Hitachi Automotive Systems Ltd
What technology area does this patent fall under?
Primary CPC classification G01F1/69. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).