Conductivity based on selective etch for GaN devices and applications thereof
US-9206524-B2 · Dec 8, 2015 · US
US9920438B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9920438-B2 |
| Application number | US-201213544940-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 9, 2012 |
| Priority date | Jul 7, 2011 |
| Publication date | Mar 20, 2018 |
| Grant date | Mar 20, 2018 |
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In exemplary implementations of this invention, a photoelectrode includes a semiconductor for photocarrier generation, and a catalyst layer for altering the reaction rate in an adjacent electrolyte. The catalyst layer covers part of the semiconductor. The thickness of the catalyst layer is less than 60% of its minority carrier diffusion distance. If the photoelectrode is a photoanode, it has an OEP that is more than the potential of the valance band edge but less than the potential of the Fermi level of the semiconductor. If it is a photocathode, it has an RHE potential that is less than the potential of the conduction band edge but more than the potential of the Fermi level of the semiconductor. The absolute value of difference (OEP minus potential of valence band edge, or RHE potential minus potential of conduction band edge) is greater than zero and less than or equal to 0.2V.
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What is claimed is: 1. A photoanode that includes: (a) a semiconductor for photocarrier generation; and (b) a catalyst layer for altering the rate of an electrochemical reaction in an electrolyte adjacent to the catalyst layer; wherein (i) the semiconductor primarily comprises a first material and the catalyst layer primarily comprises a second material, the first material being different than the second material, (ii) the catalyst layer covers a portion of the semiconductor's surface, (iii) the thickness of the catalyst layer is less than 60% of the minority carrier diffusion distance of the catalyst layer, (iv) the photoanode is adapted to have an OEP that is more than the potential of the valance band edge of the semiconductor and less than the potential of the Fermi level of the semiconductor, the absolute value of the difference between the OEP and the potential of the valence band edge being greater than zero and less than or equal to 0.2V, and (v) the interior of the semiconductor is doped with a first n-type dopant at a first dopant concentration, and an exterior region of the semiconductor that is not covered by the catalyst layer is doped with a second n-type dopant at a second dopant concentration, the second dopant concentration being greater than the first dopant concentration. 2. The photoanode of claim 1 , wherein the first n-type dopant and second n-type dopant both comprise phosphorous. 3. A photoelectrochemical cell, wherein: (a) the photoectrochemical cell includes a photoanode; (b) the photoanode includes a semiconductor for photocarrier generation and a catalyst layer for altering the rate of an electrochemical reaction in an electrolyte adjacent to the catalyst layer; (c) the semiconductor primarily comprises a first material and the catalyst layer primarily comprises a second material, the first material being different than the second material; (d) the catalyst layer covers a portion of the semiconductor's surface; (e) the thickness of the catalyst layer is less than 60% of the minority carrier diffusion distance of the catalyst layer; (f) the photoanode is adapted to have an OEP that is more than the potential of the valance band edge of the semiconductor and less than the potential of the Fermi level of the semiconductor, the absolute value of the difference between the OEP and the potential of the valence band edge being greater than zero and less than or equal to 0.2V; and (g) the interior of the semiconductor is doped with an n-type dopant, and an exterior region of the semiconductor that is not covered by the catalyst layer is doped with an n+dopant.
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