Inertial sensor and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9919917-B2
Application number	US-201414514356-A
Country	US
Kind code	B2
Filing date	Oct 14, 2014
Priority date	May 26, 2011
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

Disclosed herein an inertial sensor and a method of manufacturing the same. An inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110 , a mass body 120 that includes an adhesive part 123 disposed under a central portion 113 of the membrane 110 and provided at the central portion thereof and a patterning part 125 provided at an outer side of the adhesive part 123 and patterned to vertically penetrate therethrough, and a first adhesive layer 130 that is formed between the membrane 110 and the adhesive part 123 and is provided at an inner side of the patterning part 125 . An area of the first adhesive layer 130 is narrow by isotropic etching using the patterning part 125 as a mask, thereby making it possible to improve sensitivity of the inertial sensor 100.

First claim

What is claimed is:

1. A method of manufacturing an inertial sensor, comprising:
(A) preparing a base member in which a first substrate, a second substrate, and a membrane are stacked in order;
(B) patterning a patterning part of a mass body including an adhesive part provided at a central portion of the mass body and the patterning part provided at an outer side of the adhesive part so as to vertically penetrate therethrough while patterning the first substrate so as to form the mass body at the central portion of the first substrate; and
(C) forming a first adhesive layer on the second substrate remaining at an inner side of the patterning part by selectively removing the second substrate between the membrane and the patterning part by isotropic etching using the patterning part as a mask,
wherein at step (B), the patterning part is patterned so as to vertically penetrate therethrough by being provided with the plurality of first rib parts extending to the outer side of the adhesive part from the adhesive part and a plurality of second rib parts extending to the outer side of the adhesive part from the sides of the first rib parts at each predetermined distance.

2. The method as set forth in claim 1 , wherein at step (B), the first substrate is patterned so as to form a post surrounding the mass body at an edge of the first substrate.

3. The method as set forth in claim 2 , wherein at step (C), a second adhesive layer is formed on the second substrate remaining between the membrane and the post by selectively removing the second substrate by isotropic etching using the mass body and the post as a mask.

4. The method as set forth in claim 1 , wherein at step (B), the patterning part is patterned while patterning the first substrate by anisotropic etching.

5. The method as set forth in claim 2 , wherein at step (B), the first substrate is patterned so as to form a support part extending from the post in a direction of the mass body, and at step (C), the support part is spaced apart from a bottom surface of the membrane by removing the second substrate between the membrane and the support part by isotropic etching.

6. The method as set forth in claim 1 , wherein at step (B), the patterning part is patterned so as to vertically penetrate therethrough by being provided with a plurality of holes.

7. The method as set forth in claim 1 , wherein at step (B), the patterning part is patterned so as to vertically penetrate therethrough by forming a plurality of first rib parts extending to an outer side of the adhesive part from the adhesive part.

Assignees

• Samsung Electro Mech

Inventors

• Kim Jong Woon
• Jeung Won Kyu

Classifications

• G01P15/18

  in two or more dimensions · CPC title

• B81B2201/0235

  Accelerometers · CPC title

• G01P15/0922

  of the bending or flexing mode type · CPC title

• B81B2203/053

  Translation according to an axis perpendicular to the substrate · CPC title

• B81C1/00484

  Processes for releasing structures not provided for in group B81C1/00476 · CPC title