Liquid jet head, method for integrally manufacturing a liquid jet apparatus, and device

Patent metadata

Field	Value
Publication number	US-9919527-B2
Application number	US-201715463032-A
Country	US
Kind code	B2
Filing date	Mar 20, 2017
Priority date	Dec 26, 2013
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A liquid jet head manufacturing method, a method for integrally manufacturing a liquid jet apparatus, a liquid jet head, a printing apparatus and a liquid jet apparatus. The manufacturing method includes: forming multiple pressure-generating members arranged spaced apart on a first substrate; forming, on a first surface of first substrate, pressure chambers corresponding to multiple pressure-generating members, and a common chamber in communication with multiple pressure chambers; forming a transition layer on pressure chambers, and forming a jet orifice plate on transition layer; and forming, on jet orifice plate and transition layer, jet orifices in communication with pressure chambers. When the number of pressure chambers needs to be increased, since pressure chambers are formed on first substrate individually, mechanical strength of first substrate will not be reduced, and during manufacturing process, breakage of first substrate can be avoided, improving yield of liquid jet head, and reducing manufacturing cost.

First claim

What is claimed is:

1. A method for integrally manufacturing a liquid jet apparatus, comprising:
forming multiple pressure-generating members arranged spaced apart on a first substrate;
forming, on a first surface of the first substrate, pressure chambers corresponding to the multiple pressure-generating members, and a common chamber in communication with the multiple pressure chambers;
forming a jet orifice plate on the pressure chambers by means of a bonding process, and forming, on the jet orifice plate, jet orifices in communication with the pressure chambers by means of a photo-etching process.

2. The method according to claim 1 , wherein, the forming, on the first surface of the first substrate, the pressure chambers corresponding to the multiple pressure-generating members, and the common chamber in communication with the multiple pressure chambers, comprises:
arranging and exposing a chamber layer on the first surface of the first substrate, and defining a shape and a position of the pressure chambers and the common chamber;
developing to form the pressure chambers and the common chamber.

3. The method according to claim 2 , wherein, the forming the jet orifice plate on the pressure chambers by means of the bonding process, comprises:
applying in a spin way a jet orifice layer on a second substrate;
bonding a chamber wall of the chamber layer and the jet orifice layer together by means of a bonding process;
stripping the second substrate.

4. The method according to claim 1 , wherein, the forming multiple pressure-generating members arranged spaced apart on the first substrate, comprises:
etching the first surface of the first substrate to form a recess;
forming a piezoelectric element within the recess, wherein an upper surface of the piezoelectric element is flush with the first surface of the first substrate;
forming, on the first surface of the first substrate, a vibrating plate covering an external of the piezoelectric element.

5. The method according to claim 4 , wherein, the forming the piezoelectric element within the recess, comprises:
forming a lower electrode layer, a piezoelectric layer and an upper electrode layer sequentially by sputtering within the recess; wherein, the lower electrode layer is a titanium layer, a platinum layer or a superimposed layer consisting of multiple titanium layers; the piezoelectric layer is a lead zirconate titanate layer; the upper electrode layer is a platinum layer or a gold layer.

6. The method according to claim 5 , after forming the jet orifice plate on the pressure chambers by means of the bonding process, and forming, on the jet orifice plate, jet orifices in communication with the pressure chambers by means of the photo-etching process, the method further comprises:
etching a second surface of the first substrate to form an ink supply hole in communication with the common chamber and a cavity in communication with the pressure-generating members;
arranging, on the second surface of the first substrate, a cover plate which covers on the cavity and keeps clear of the ink supply hole.

7. The method according to claim 6 , wherein, after etching the second surface of the first substrate to form the ink supply hole in communication with the common chamber and the cavity in communication with the pressure-generating members, the method further comprises:
forming a gap between both sides of the piezoelectric element and the first substrate.

8. The method according to claim 1 , wherein, the forming multiple pressure-generating members arranged spaced apart on the first substrate, comprises:
forming a vibrating plate on the first surface of the first substrate;
forming a piezoelectric element on the vibrating plate.

9. The method according to claim 8 , after forming the jet orifice plate on the pressure chambers by means of the bonding process, and forming, on the jet orifice plate, jet orifices in communication with the pressure chambers by means of the photo-etching process, the method further comprises:
etching a second surface of the first substrate to form an ink supply hole in communication with the common chamber and a cavity in communication with the pressure-generating members;
arranging, on the second surface of the first substrate, a cover plate which covers on the cavity and keeps clear of the ink supply hole.

10. The method according to claim 1 , wherein, the forming multiple pressure-generating members arranged spaced apart on the first substrate, comprises:
depositing a film resistance layer on the first surface of the first substrate, wherein, a material of the film resistance layer is tantalum-aluminum alloy or nickel-chrome alloy or tungsten silicon nitride or titanium nitride.

11. The method according to claim 10 , the forming the jet orifice plate on the pressure chambers by means of the bonding process, and forming, on the jet orifice plate, jet orifices in communication with the pressure chambers by means of the photo-etching process, further comprises:
etching a second surface of the first substrate to form an ink supply hole in communication with the common chamber.

12. A liquid jet head, wherein the liquid jet head is manufactured by a liquid jet head manufacturing method comprising:
forming multiple pressure-generating members arranged spaced apart on a first substrate;
forming, on a first surface of the first substrate, pressure chambers corresponding to the multiple pressure-generating members, and a common chamber in communication with the multiple pressure chambers;
forming a transition layer on the pressure chambers by means of a bonding process, and forming a let orifice plate on the transition layer; and
forming, on the let orifice plate and the transition layer, jet orifices in communication with the pressure chambers by means of a photo-etching process.

13. A printing apparatus, comprising the liquid jet head according to claim 12 .

14. A liquid jet apparatus, wherein the liquid jet apparatus is manufactured by the method according to claim 1 .

Assignees

• Univ Dalian Tech
• Zhuhai Seine Tech Co Ltd

Inventors

• Zou Helin
• He Jingzhi
• Li Yue
• Chen Xiaokun

Classifications

• B41J2/1626

  etching · CPC title

• B41J2/1623 Primary

  bonding and adhesion · CPC title

• B41J2/162 Primary

  Manufacturing of the nozzle plates · CPC title

• B41J2/1433

  Structure of nozzle plates · CPC title

• B41J2/1642

  thin film formation by CVD [chemical vapor deposition] · CPC title