High-frequency power amplifier

Patent metadata

Field	Value
Publication number	US-9917559-B2
Application number	US-201615503590-A
Country	US
Kind code	B2
Filing date	Jan 28, 2016
Priority date	Apr 7, 2015
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

An in-line waveguide divider divides power of an incoming high-frequency signal among openings. Amplification boards disposed on a base are provided for respective openings and are each connected in parallel with one another to the in-line waveguide divider. An in-line waveguide combiner includes openings formed correspondingly to the amplification boards, and is connected to the amplification boards. An electrically conductive amplifier cover includes walls formed to provide isolation between circuits of the amplification boards continuously from the in-line waveguide divider to the in-line waveguide combiner, and the entire surface of the amplification boards at the in-line waveguide combiner side is covered with the electrically conductive amplifier cover except openings and openings. Each of the amplification boards includes a waveguide-to-microstrip transition corresponding to the opening, an amplifier element, and a microstrip-to-waveguide transition corresponding to the opening.

First claim

The invention claimed is:

1. A high-frequency power amplifier comprising:
a base;
an in-line waveguide divider to divide power of an incoming high-frequency signal among unit branches;
amplification boards disposed on the base and each connected in parallel with one another to the in-line waveguide divider, the amplification boards being provided for the respective unit branches of the in-line waveguide divider;
an in-line waveguide combiner connected to the amplification boards, and including unit joins configured to correspond to the amplification boards and combine power of the incoming high-frequency signal; and
an electrically conductive amplifier cover including walls configured to provide isolation between circuits of the amplification boards continuously from the in-line waveguide divider to the in-line waveguide combiner, the walls being provided for the respective amplification boards, the electrically conductive amplifier cover except openings of the unit branches and openings of the unit joins covering an entire surface of the amplification boards,
wherein each of the amplification boards includes a waveguide-to-microstrip transition corresponding to the opening of the unit branch, an amplification section including an amplifier element for amplifying the incoming high-frequency signal, and a microstrip-to-waveguide transition corresponding to the opening of the unit join,
wherein the base includes recessed portions formed therein for receiving the amplifier elements mounted on the amplification boards, and
wherein the electrically conductive amplifier cover includes wide-spacing areas between the walls configured to provide isolation between the circuits of the amplification boards and narrow-spacing areas between the walls configured to provide isolation between the circuits of the amplification boards, the narrow-spacing areas being narrower than the wide-spacing areas, and the amplifier elements are disposed in the wide-spacing areas between the walls configured to provide isolation between the circuits of the amplification boards.

2. The high-frequency power amplifier according to claim 1 , wherein the base is formed of an electrically conductive material.

3. The high-frequency power amplifier according to claim 1 , wherein the electrically conductive amplifier cover is a cut-off block having cut-off characteristics at a frequency of the incoming high-frequency signal.

4. The high-frequency power amplifier according to claim 1 , wherein
the amplification section of the amplification board includes a plurality of the amplifier elements connected in series, and
the electrically conductive amplifier cover is configured to cut off the amplifier elements included in the amplification section from one another and reduce signal return through space.

5. The high-frequency power amplifier according to claim 1 , wherein each of the amplifier elements is in contact with the electrically conductive amplifier cover via a thermally conductive member.

6. A high-frequency power amplifier comprising:
a base;
an in-line waveguide divider to divide power of an incoming high-frequency signal among unit branches;
amplification boards disposed on the base and each connected in parallel with one another to the in-line waveguide divider, the amplification boards being provided for the respective unit branches of the in-line waveguide divider;
an in-line waveguide combiner connected to the amplification boards, and including unit joins configured to correspond to the amplification boards and combine power of the incoming high-frequency signal; and
an electrically conductive amplifier cover including walls configured to provide isolation between circuits of the amplification boards continuously from the in-line waveguide divider to the in-line waveguide combiner, the walls being provided for the respective amplification boards, the electrically conductive amplifier cover except openings of the unit branches and openings of the unit joins covering an entire surface of the amplification boards,
wherein each of the amplification boards includes a waveguide-to-microstrip transition corresponding to the opening of the unit branch, an amplification section including an amplifier element for amplifying the incoming high-frequency signal, and a microstrip-to-waveguide transition corresponding to the opening of the unit join;
each of the in-line waveguide divider and the in-line waveguide combiner is formed to be divided, in a plane extending through a waveguide in a travel direction of the incoming high-frequency signal, into a lower portion connected to the amplification boards and an upper portion located opposite to the amplification boards; and
the lower portion of the in-line waveguide divider, the lower portion of the in-line waveguide combiner, and the electrically conductive amplifier cover are integrally formed.

7. The high-frequency power amplifier according to claim 6 , wherein the base is formed of an electrically conductive material.

8. The high-frequency power amplifier according to claim 6 , wherein the electrically conductive amplifier cover is a cut-off block having cut-off characteristics at a frequency of the incoming high-frequency signal.

9. The high-frequency power amplifier according to claim 6 , wherein
the amplification section of the amplification board includes a plurality of the amplifier elements connected in series, and
the electrically conductive amplifier cover is configured to cut off the amplifier elements included in the amplification section from one another and reduce signal return through space.

10. The high-frequency power amplifier according to claim 6 , wherein each of the amplifier elements is in contact with the electrically conductive amplifier cover via a thermally conductive member.

Assignees

• Mitsubishi Electric Corp

Inventors

• Nonomura Hiroyuki
• Nishihara Jun
• Fujii Toshihiro

Classifications

• H03F1/0288

  using a main and one or several auxiliary peaking amplifiers whereby the load is connected to the main amplifier using an impedance inverter, e.g. Doherty amplifiers · CPC title

• H03F2203/21106

  An input signal being distributed in parallel over the inputs of a plurality of power amplifiers · CPC title

• H03F3/195

  in integrated circuits · CPC title

• H03F3/68

  Combinations of amplifiers, e.g. multi-channel amplifiers for stereophonics {(power amplifiers using a combination of several semiconductor amplifiers H03F3/211; combinations of amplifiers using coupling networks with distributed constants H03F3/602)} · CPC title

• H03F2203/21142

  Output signals of a plurality of power amplifiers are parallel combined to a common output · CPC title