Surface-emitting semiconductor laser and method for producing a surface-emitting semiconductor laser
US-2024332901-A1 · Oct 3, 2024 · US
US9917422B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9917422-B2 |
| Application number | US-201514721729-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 26, 2015 |
| Priority date | Feb 12, 2007 |
| Publication date | Mar 13, 2018 |
| Grant date | Mar 13, 2018 |
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An optoelectronic device grown on a miscut of GaN, wherein the miscut comprises a semi-polar GaN crystal plane (of the GaN) miscut x degrees from an m-plane of the GaN and in a c-direction of the GaN, where −15<x<−1 and 1<x<15 degrees.
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What is claimed is: 1. A device, comprising: one or more semi-polar III-Nitride layers epitaxially grown on a semi-polar crystal plane of GaN, the semi-polar crystal plane oriented x degrees from an m-plane of the GaN and in a c-direction of the GaN, where −15<x<−1 and 1<x<15 degrees; and wherein: the III-Nitride layers comprise a layer having a thickness greater than or equal to a critical thickness for such layer deposited on a {11-22} crystal plane of GaN; and one or more of the semi-polar III-Nitride layers have a surface roughness of 0.75 nanometers or less. 2. The device of claim 1 , wherein the semi-polar crystal plane is a {30-31}, {30-3-1}, {40-41}, or {40-4-1} plane. 3. The device of claim 1 , wherein the semi-polar crystal plane is a top surface of Gallium Nitride (GaN). 4. The device of claim 1 , wherein the semi-polar crystal plane is a top surface of a Gallium Nitride substrate. 5. The device of claim 1 , wherein the layer is an InGaN layer. 6. The device of claim 1 , wherein the device is a laser diode and the one or more semi-polar III-nitride layers comprise an indium containing waveguide that provides a modal confinement for the laser diode of at least 4.9%, the laser diode having a lasing peak at a wavelength of at least 444.7 nm. 7. The device of claim 1 , wherein one or more of the semi-polar III-Nitride layers include a light emitting active layer including one or more indium containing quantum wells, one or more of the quantum wells having an Indium composition of at least 16% and a thickness greater than 4 nanometers. 8. The device of claim 1 , wherein the one or more semi-polar III-Nitride layers comprise an Indium composition of at least 7%. 9. The device of claim 1 , wherein the device is grown on a miscut or vicinal surface of a GaN substrate, the miscut or vicinal surface including the semi-polar crystal plane, and the semi-polar III-Nitride layers further comprising: one or more n-type (Al,In,Ga)N layers; one or more p-type (Al,In,Ga)N layers; and an InGaN active layer comprising one or more InGaN quantum well layers between the n-type (Al,In,Ga)N layers and the one or more p-type (Al,In,Ga)N layers, wherein the n-type (Al,In,Ga)N layers, the p-type (Al,In,Ga)N layers, and the InGaN quantum well layers have a semi-polar orientation of the semi-polar crystal plane and the InGaN quantum well layers have a peak light emission or a peak light absorption at a wavelength of at least 477 nm. 10. The device of claim 1 , wherein the device is a laser diode and the semi-polar III-Nitride layers comprise: an n-type GaN layer on or above the semipolar crystal plane; an n-type InGaN waveguiding layer on or above the n-type GaN layer, the n-type InGaN waveguiding layer having a thickness of at least 50 nm and an Indium composition of 7% or more; an InGaN active layer on or above the n-type InGaN waveguiding layer, including one or more InGaN quantum well layers with an Indium composition of at least 7% and a thickness of more than 4 nm; a p-type InGaN waveguiding layer on or above the InGaN active layer; and a p-type GaN layer on or above the p-type InGaN waveguiding layer, the p-type InGaN waveguiding layer having a thickness of at least 50 nm and an Indium composition of 7% or more, wherein the semi-polar III-Nitride layers have a semipolar orientation of the semipolar crystal plane. 11. The device of claim 1 , wherein the semi-polar crystal plane comprises an atomically specific plane, so that a smooth epitaxial growth of the III-Nitride layers is achieved. 12. The device of claim 1 , wherein the device grown on the semi-polar crystal plane includes a laser diode, light emitting diode, superluminescent diode, semiconductor amplifier, photonic crystal laser, VCSEL laser, solar cell, or photodetector. 13. The device of claim 1 , wherein the device is a laser diode grown on the semi-polar crystal plane, the laser diode comprising a waveguide oriented in a c-projection direction of the laser diode, for higher gain. 14. The device of claim 1 , wherein the device is a laser diode having a threshold current density of no more than 12.2 kiloamps per centimeter square and comprises a coherently strained structure as measured by Bragg peaks for each of the III-nitride layers lining up vertically on a Q x axis of an X-ray Reciprocal Space Map. 15. A method of fabricating a device, comprising: depositing one or more semi-polar III-Nitride layers epitaxially on a semi-polar crystal plane, the semi-polar crystal plane oriented x degrees from an m-plane of the GaN and in a c-direction of the GaN, where −15<x<−1 and 1<x<15 degrees, and wherein: the III-Nitride layers comprise a layer having a thickness greater than or equal to a critical thickness for such layer deposited on a {11-22} crystal plane of GaN; and the depositing is under conditions wherein one or more of the semi-polar III-Nitride layers have a surface roughness of 0.75 nanometers or less. 16. The method of claim 15 , wherein the semi-polar crystal plane is a {30-31}, {30-3-1}, {40-41}, or {40-4-1} plane. 17. The method of claim 15 , wherein the semi-polar crystal plane is a top surface of Gallium Nitride (GaN) and the conditions include an N 2 ambient. 18. The method of claim 15 , wherein the layer is an InGaN layer. 19. The method of claim 15 , wherein the device is a laser diode and the one or more semipolar III-nitride layers comprise an indium containing waveguide that provides a modal confinement for the laser diode of at least 4.9%, the laser diode having a lasing peak at a wavelength of at least 444.7 nm. 20. The method of claim 15 , wherein the depositing of the semi-polar III-Nitride layers further includes depositing a light emitting active layer including one or more Indium containing quantum wells, one or more of the quantum wells having an Indium composition of at least 16% and a thickness greater than 4 nanometers.
Crystal orientation · CPC title
Nitrides · CPC title
Crystal orientations · CPC title
Nitrides · CPC title
semi-polar orientation · CPC title
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