Integrated circuit package with radio frequency coupling arrangement

Patent metadata

Field	Value
Publication number	US-9917372-B2
Application number	US-201414303707-A
Country	US
Kind code	B2
Filing date	Jun 13, 2014
Priority date	Jun 13, 2014
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

An integrated circuit package comprises a dielectric material, a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer arranged at a first side of the integrated circuit package, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and/or receiving a radio frequency signal arranged between the first and second electrically isolating layers. The electrically conductive material is separated from the integrated antenna structure by at least the dielectric material and the first electrically isolating layer, arranged to partly overlap the integrated antenna structure and to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer and the dielectric material to the first side.

First claim

The invention claimed is:

1. A radio frequency device comprising:
an integrated circuit package comprising a radio frequency coupling arrangement arranged inside the integrated circuit package, the radio frequency coupling arrangement comprising:
a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer, the first stack being arranged at a first side of the integrated circuit package;
an electrically conductive material arranged at a second side of the integrated circuit package opposite to the first side;
a dielectric material interposed between the first stack and the electrically conductive material;
an integrated antenna structure for at least one of transmitting and receiving a radio frequency signal arranged between the first electrically isolating layer and the second electrically isolating layer; and
the electrically conductive material being arranged to partly overlap the integrated antenna structure and being separated from the integrated antenna structure by at least the first electrically isolating layer and the dielectric material, the electrically conductive material being arranged to reflect the radio frequency signal received by the electrically conductive material through at least the dielectric material and the first electrically isolating layer to the first side, wherein the first stack, the electrically conductive material, the dielectric material, and the integrated antenna structure are entirely integrated into the integrated circuit package; and

a printed circuit board (PCB), the integrated circuit package being mounted on the PCB at the first side of the integrated circuit package, wherein the PCB has a radio frequency waveguide formed therein via a hole extending through the entire thickness of the PCB, the hole having lateral walls covered by an electrically conductive layer, the hole extending to an area of the radio frequency coupling arrangement partly overlapping the integrated antenna structure, and wherein the integrated circuit package is electrically coupled to the radio frequency waveguide and the radio frequency waveguide is configured to guide the radio frequency signal out of a plane parallel to a surface of the first electrically isolating layer.

2. An integrated circuit package according to claim 1 , the integrated circuit package further comprising a second stack comprising at least a third electrically isolating layer and a fourth electrically isolating layer arranged at a second side of the integrated circuit package, the second stack being separated from the first stack by at least the dielectric material, the electrically conductive material being arranged on a face of the second stack opposite to the second side and being encapsulated by the dielectric material.

3. An integrated circuit package according to claim 1 , the integrated circuit package further comprising a second stack comprising at least a third electrically isolating layer and a fourth electrically isolating layer arranged at a second side of the integrated circuit package, the second stack being separated from the first stack by at least the dielectric material, the electrically conductive material being arranged between the third electrically isolating layer and the fourth electrically isolating layer, and being separated from the integrated antenna structure by at least the fourth electrically isolating layer, the dielectric material and the first electrically isolating layer.

4. An integrated circuit package according to claim 3 , the integrated antenna structure being electrically coupled to an integrated circuit die via one or more electrically conductive vias extending through at least the fourth electrically isolating layer, the dielectric material and the first electrically isolating layer, the integrated circuit die being arranged to at least one of to generate the radio frequency signal for transmission via the integrated antenna structure and to receive the radio frequency signal as received via the integrated antenna structure.

5. An integrated circuit package according to claim 4 , the integrated circuit die being arranged inside the integrated circuit package and having a surface in direct contact with a face of the second stack opposite to the second side.

6. An integrated circuit package according to claim 4 , the integrated circuit die comprising a circuit of the group of circuits consisting of: a transmitter, a receiver, and a transceiver, the circuit being electrically coupled to the integrated antenna structure.

7. An integrated circuit package according to claim 1 , the integrated antenna structure being surrounded by electrically conductive vias, the electrically conductive vias extending through at least the first electrically isolating layer and the dielectric material, the electrically conductive vias being electrically connected to the electrically conductive material.

8. An integrated circuit package according to claim 1 , the electrically conductive material being electrically connected to a reference potential.

9. An integrated circuit package according to claim 1 , the integrated antenna structure being an integrated planar antenna of one of the group consisting of: a single-ended microstrip antenna, a differential microstrip antenna, a rectangular patched single-ended antenna, a rectangular patched differential antenna, a square patched single-ended antenna, a square patched differential antenna.

10. An integrated circuit package as claimed in claim 1 , the integrated antenna structure being arranged for at least one of transmitting and receiving a first radio frequency signal in a first predetermined frequency band; the integrated circuit package further comprising:
a second radio frequency coupling arrangement being arranged inside the integrated circuit package, and comprising:
a second electrically conductive material arranged inside the integrated circuit package at the second side,
a second integrated antenna structure arranged inside the first stack for at least one of transmitting and receiving a second radio frequency signal in a second predetermined frequency band,
the second electrically conductive material being arranged to partly overlap the second integrated antenna structure and being separated from the second integrated antenna structure by at least the first electrically isolating layer and the dielectric material, the second electrical conductive material being arranged to reflect the second radio frequency signal received by the second electrically conductive material through at least the dielectric material and the first electrically isolating layer to the first side.

11. An integrated circuit package according to claim 10 , wherein the integrated circuit package further comprises a second stack comprising at least a third electrically isolating layer and a fourth electrically isolating layer arranged at a second side of the integrated circuit package, the second stack being separated from the first stack by at least the dielectric material, the electrically conductive material being arranged on a face of the second stack opposite to the second side and being encapsulated by the dielectric material; and
the second electrically conductive material being arranged on the face of the second stack opposite to the second side, the second electrically conductive material being encapsulated by the dielectric material.

12. A radio frequency device according to claim 11 , wherein
the integrated antenna structure is electrically coupled to an integrated circuit die via one or more electrically conductive vias extending through at least the fourth electrically isolating layer,

Assignees

• Tong Ziqiang
• Reuter Ralf
• Nxp Usa Inc

Inventors

• Tong Ziqiang
• Reuter Ralf

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W44/248

  for antennas · CPC title

• H01Q9/0407

  Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title