Thermal chemical vapor deposition coated article and process
US-2015283307-A1 · Oct 8, 2015 · US
US9915001B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9915001-B2 |
| Application number | US-201514821949-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 10, 2015 |
| Priority date | Sep 3, 2014 |
| Publication date | Mar 13, 2018 |
| Grant date | Mar 13, 2018 |
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A chemical vapor deposition process and coated article are disclosed. The chemical vapor deposition process includes positioning an article in a chemical vapor deposition chamber, then introducing a deposition gas to the chemical vapor deposition chamber at a sub-decomposition temperature that is below the thermal decomposition temperature of the deposition gas, and then heating the chamber to a super-decomposition temperature that is equal to or above the thermal decomposition temperature of the deposition gas resulting in a deposited coating on at least a surface of the article from the introducing of the deposition gas. The chemical vapor deposition process remains within a pressure range of 0.01 psia and 200 psia and/or the deposition gas is dimethylsilane. The coated article includes a substrate subject to corrosion and a deposited coating on the substrate, the deposited coating having silicon, and corrosion resistance.
Opening claim text (preview).
What is claimed is: 1. A chemical vapor deposition process, comprising: positioning an article in a chemical vapor deposition chamber; then purging and evacuating the chemical vapor deposition chamber; then introducing a deposition gas to the chemical vapor deposition chamber at a sub-decomposition temperature that is below the thermal decomposition temperature of the deposition gas; and then heating the chamber to a super-decomposition temperature that is equal to or above the thermal decomposition temperature of the deposition gas resulting in a deposited coating on at least a surface of the article from the introducing of the deposition gas; wherein the chemical vapor deposition process remains within a pressure range of 0.01 psia and 200 psia, wherein the deposition gas is selected from the group consisting of an organosilane, dimethylsilane and a silane gas. 2. The process of claim 1 , wherein the sub-decomposition temperature is between 100° C. and 450° C. 3. The process of claim 1 , wherein the sub-decomposition temperature is between 100° C. and 300° C. 4. The process of claim 1 , wherein the heating of the chamber heats from the sub-decomposition temperature to the super-decomposition temperature at a rate of between 6° C. per minute and 10° C. per minute. 5. The process of claim 1 , wherein the thermal decomposition temperature is between 440° C. and 460° C. 6. The process of claim 1 , wherein the super-decomposition temperature is greater than 440° C. 7. The process of claim 1 , wherein the chemical vapor deposition chamber is substantially devoid of catalyst during the introducing of the deposition gas. 8. The process of claim 1 , wherein the chemical vapor deposition chamber is devoid of catalyst during the introducing of the deposition gas. 9. The process of claim 1 , wherein the surface is a stainless steel surface. 10. The process of claim 1 , wherein the surface is a nickel-based alloy. 11. The process of claim 1 , further comprising oxidizing the deposited coating at an oxidizing temperature of between 300° C. and 350° C. to form an oxidized coating. 12. The process of claim 11 , further comprising functionalizing the oxidized coating by introducing trimethylsilane to the deposited coating at a functionalizing temperature of between 400° C. and 500° C. 13. The process of claim 1 , wherein the deposited coating resists corrosion when exposed to 15% NaClO by a rate of at least 5% greater, in mils per year, than the corrosion rate of a coating applied with the same process but without introducing the deposition gas at the sub-decomposition temperature. 14. The process of claim 1 , wherein the deposited coating has a 15% NaClO corrosion rate of between 0 and 3 mils per year.
Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title
characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title
After-treatment · CPC title
Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides · CPC title
characterised by the deposition of inorganic material, other than metallic material · CPC title
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