Method for molding a body in a mold

US9914859B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9914859-B2
Application numberUS-201515326891-A
CountryUS
Kind codeB2
Filing dateJul 14, 2015
Priority dateJul 31, 2014
Publication dateMar 13, 2018
Grant dateMar 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Method for molding a body in a mold, comprising the following steps: applying an adhesive tape to the inside of a mold, distributing the layers of material forming the body over the adhesive tape, curing the layers of material, removing the body from the mold, where the adhesive tape has a backing on one side of which a self-adhesive has been applied in the form of a polymer mixture, the polymers being constructed of 60 to 99.5 wt % of n-butyl acrylate and/or 2-ethylhexyl acrylate, 0.5 to 10 wt % of an ethylenically unsaturated monomer having an acid or acid-anhydride function, 0 to 30 wt % of one or more olefinic monomers and the self-adhesive comprises between 0 and 60 parts by weight of one or more tackifiers.

First claim

Opening claim text (preview).

The invention claimed is: 1. Method for molding a body in a mold, comprising the following steps: application of an adhesive tape to the inside of a mold, distribution of the material layers forming the body on the adhesive tape, curing the material layers, and removal of the body from the mold, wherein the adhesive tape has a carrier film, on one side of which a self-adhesive compound is applied in the form of a polymer mixture, wherein the polymers are composed of the following: (a) 60 to 99.5 wt. % of n-butyl acrylate and/or 2-ethylhexyl acrylate, (b) 0.5 to 10 wt. % of an ethylenically unsaturated monomer with an acid or acid anhydride functional group, and (c) 0 to 30 wt. % of one or a plurality of (a) various olefin monomers, and the self-adhesive compound contains 0 to 60 parts by weight of one or a plurality of tackifiers based on the mass of the polymer mixture. 2. Method according to claim 1 , wherein (a) comprises a mixture of 2-ethylhexyl acrylate and n-butyl acrylate. 3. Method according to claim 1 , wherein monomer (b) is acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid and/or maleic acid anhydride. 4. Method according to claim 1 , wherein the monomers (c) are selected from the group consisting of alkyl(meth)acrylates, other than the monomers forming (a), C 1 to C 10 hydroxyalkyl(meth)acrylates, and unsaturated hydrocarbons with 2 to 8 carbon atoms. 5. Method according to claim 1 , wherein the polymers are composed of a) 75 to 94 wt. % of n-butyl acrylate and/or 2-ethylhexyl acrylate, b) 1 to 5 wt. % of an ethylenically unsaturated monomer with an acid or acid anhydride functional group, and c) 5 to 20 wt. % of one different olefin monomer or a plurality of different olefin monomers. 6. Method according to claim 1 , wherein the polymers are composed of a) 87 to 94 wt. % of n-butyl acrylate and/or 2-ethylhexyl acrylate, b) 1 to 3 wt. % of an ethylenically unsaturated monomer with an acid or acid anhydride functional group, and c) 5 to 10 wt. % of one or a plurality of (a) different olefin monomers. 7. Method according to claim 1 , wherein the self-adhesive compound contains 15 to 50 parts by weight of one or a plurality of tackifiers based on the mass of the polymer mixture. 8. Method according to claim 1 , wherein films composed of PUR, PE, PP, PET or PA are used as carrier films. 9. Method according to claim 1 , wherein the carrier film contains one or at least two fluoropolymers. 10. Method according to claim 9 , wherein the carrier film contains up to 50 wt. % of one or at least two fluoropolymers based on the total composition of the carrier film or the polymers making up the carrier film are composed up to 100% of one or at least two fluoropolymers. 11. Method according to claim 9 , wherein as fluoropolymers, PTFE (polytetrafluoroethylene), ETFE (poly(ethylene-co-tetrafluoroethylene)), FEP (poly(tetrafluoroethylene-co-hexafluoropropylene)), PVF (polyvinyl fluoride), PCTFE (polychlorotrifluoroethylene), ECTFE (poly(ethylene-co-chlorotrifluoroethylene), PVDF (poly(1,1-difluorethene)), PFA (perfluoroalkoxy polymers), or mixtures of two or more of the aforementioned fluoropolymers are used. 12. Method according to claim 11 , wherein the fluoropolymers are mixed with further polymers. 13. Method according to claim 1 , wherein the thickness of the carrier film is 15 to 350 μm. 14. Method according to claim 1 , wherein the carrier film is composed of an at least two-layered laminate comprising two or more film layers. 15. Method according to claim 1 , wherein the carrier film is composed of at least two film layers, wherein the two outer film layers are of different colors. 16. Method according to claim 1 , wherein the mass of the adhesive compound applied to the carrier film is 10 to 200 g/m 2 . 17. Method according to claim 1 , wherein the inside of the mold is equipped with a release agent before application of the adhesive tape. 18. Method according to claim 1 , wherein curing of the material layers is carried out in a vacuum. 19. Method according to claim 3 , wherein monomer b is acrylic acid, methacrylic acid or a mixture thereof.

Assignees

Inventors

Classifications

  • C09J7/22Primary

    Plastics; Metallised plastics · CPC title

  • PTFE, i.e. polytetrafluoroethylene {, e.g. ePTFE, i.e. expanded polytetrafluoroethylene} · CPC title

  • in the substrate · CPC title

  • Polymers of esters · CPC title

  • Pressure-sensitive adhesives [PSA] · CPC title

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What does patent US9914859B2 cover?
Method for molding a body in a mold, comprising the following steps: applying an adhesive tape to the inside of a mold, distributing the layers of material forming the body over the adhesive tape, curing the layers of material, removing the body from the mold, where the adhesive tape has a backing on one side of which a self-adhesive has been applied in the form of a polymer mixture, the polyme…
Who is the assignee on this patent?
Tesa Se
What technology area does this patent fall under?
Primary CPC classification C09J7/22. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).