Low application temperature hot melt adhesive

US9914857B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9914857-B2
Application numberUS-201514804797-A
CountryUS
Kind codeB2
Filing dateJul 21, 2015
Priority dateAug 20, 2009
Publication dateMar 13, 2018
Grant dateMar 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.

First claim

Opening claim text (preview).

We claim: 1. An adhesive composition consisting of: (a) at least greater than about 5 wt % of an ethylene monomer with at least one of C 3 to C 20 α-olefin comonomer produced by metallocene catalysis polymerization, having an average Melt Index range of about 5 to about 35 g/10 minutes at 190° C. (b) an amorphous poly-α-olefin copolymer or a random copolymer having an average Melt Index range greater than about 35 g/10 minutes at 190° C.; (c) a tackifier having a softening point of 115° C. or less (d) a diluent; and (e) optionally, wax, antioxidant, stabilizer pigment, or mixtures thereof.

Assignees

Inventors

Classifications

  • Copolymers of ethene with aliphatic 1-olefins · CPC title

  • having four to nine carbon atoms · CPC title

  • C09J123/02Primary

    not modified by chemical after-treatment · CPC title

  • Copolymers of propene (C09J123/16 takes precedence) · CPC title

  • Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

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Frequently asked questions

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What does patent US9914857B2 cover?
The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
Who is the assignee on this patent?
Henkel IP & Holding GmbH
What technology area does this patent fall under?
Primary CPC classification C09J123/0815. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).