Refractory seed metal for electroplated MEMS structures
US-9845235-B2 · Dec 19, 2017 · US
US9914637B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9914637-B2 |
| Application number | US-201615250519-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 29, 2016 |
| Priority date | Mar 15, 2016 |
| Publication date | Mar 13, 2018 |
| Grant date | Mar 13, 2018 |
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Official abstract text for this publication.
According to one embodiment, an electronic device includes a base region, an element portion located on the base region, the element portion including a movable portion, and a protective film overlying the element portion and forming a cavity on an inner side of the protective film. The protective film includes a first protective layer and a second protective layer located on the first protective layer. A hole extends in a direction parallel to a main surface of the base region, and the second protective layer covers the hole.
Opening claim text (preview).
What is claimed is: 1. An electronic device comprising: a base region having a surface; an element portion located on the base region, the element portion including a movable portion; and a protective film covering the element portion and forming a cavity on an inner side of the protective film between the protective film and the element portion, wherein the protective film includes: a first protective layer, a hole extending through the first protective layer in a direction parallel to the surface of the base region, at least one of a shape and a size of the hole being changed in an extending direction of the hole, and a second protective layer overlying the first protective layer and covering the hole. 2. The electronic device according to claim 1 , wherein the hole is located between the surface of the base region and the first protective layer. 3. The electronic device according to claim 1 , wherein the hole is spaced from the surface of the base region. 4. The electronic device according to claim 1 , further including at least a second hole extending in a direction parallel to the surface of the base region. 5. The electronic device according to claim 4 , wherein the second hole is located between the surface of the base region and the first protective layer. 6. The electronic device according to claim 4 , wherein the second hole is spaced from the surface of the base region. 7. The electronic device according to claim 6 , wherein the second hole extends through the first protective layer. 8. The electronic device according to claim 1 , further comprising a columnar portion extending across an inner surface of the hole. 9. The electronic device according to claim 1 , wherein the shape and the size of the hole increases in a central portion of the hole inwardly of the protective layer. 10. An electronic device comprising: a base region; an element portion located on the base region, the element portion including a movable portion; and a protective film overlying the element portion and forming a cavity on an inner side of the protective film facing the element portion, wherein the protective film includes a first protective layer and a second protective layer on the first protective layer, a hole extending between the inner surface of the first protective layer and the outer surface of the first protective layer, wherein the second protective layer covers the hole, at least one of a shape and a size of the hole being changed in an extending direction of the hole, and wherein an inner surface of the hole comprises, at least in part, the first protective layer. 11. The electronic device according to claim 10 , wherein the first protective layer comprises a lower sub-layer containing silicon (Si) and germanium (Ge), an upper sub-layer containing silicon (Si) and germanium (Ge), and an intermediate sub-layer interposed between the lower sub-layer and the upper sub-layer containing at least one of a silicide layer and an amorphous metal layer. 12. The electronic device according to claim 10 , wherein the hole is spaced from the surface of the base region. 13. The electronic device according to claim 10 , wherein the hole extends in a direction parallel to the surface of the base region. 14. The electronic device according to claim 10 , wherein the hole extends in a direction perpendicular to the surface of the base region. 15. The electronic device according to claim 10 , wherein the shape and the size of the hole increases in a central portion of the hole inwardly of the protective layer. 16. An electronic device comprising: a base region; an element portion located on the base region, the element portion including a movable portion; a protective film overlying the element portion and forming a cavity on an inner side of the protective film facing the element portion; and a columnar portion extending between a lower surface and an upper surface of the hole, wherein the protective film includes a first protective layer and a second protective layer on the first protective layer, a hole extending between the inner surface of the first protective layer and the outer surface of the first protective layer, wherein the second protective layer covers the hole, and wherein an inner surface of the hole comprises, at least in part, the first protective layer.
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