Floor panel for an aircraft, and an aircraft comprising such a floor panel

US9914522B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9914522-B2
Application numberUS-201514880728-A
CountryUS
Kind codeB2
Filing dateOct 12, 2015
Priority dateOct 29, 2014
Publication dateMar 13, 2018
Grant dateMar 13, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A floor panel for an aircraft comprising a panel structure for transmitting forces applied to the floor panel, wherein the panel structure includes an upper cover layer, a lower cover layer, and a core assembly sandwiched between the upper and lower cover layers, and a heater layer for heating the floor panel, wherein the heater layer is provided between the upper and lower cover layers. The object of the present disclosure, to provide a possibly simple heated floor panel for an aircraft, wherein the risk of overheating and at the same time the risk of local hot spots at the heater layer is reduced, is achieved in that the heater layer is formed as a PTC-layer having a plurality of electric conductor paths interconnected to one another by a plurality of PTC-resistor paths comprising a PTC-material, wherein the electric resistance of the PTC-Material increases with increasing temperature.

First claim

Opening claim text (preview).

The invention claimed is: 1. A floor panel for an aircraft, the floor panel comprising: a panel structure for transmitting forces applied to the floor panel, wherein the panel structure comprises an upper cover layer, a lower cover layer, and a core assembly sandwiched between the upper and lower cover layers; and a heater layer for heating the floor panel, wherein the heater layer is formed as a PTC-layer having a plurality of electric conductor paths interconnected to one another by one or more PTC-resistor paths comprising a PTC-material, wherein the electric resistance of the PTC-Material increases with increasing temperature, wherein the core assembly comprises an upper core portion and a lower core portion, and wherein the heater layer is provided between the upper core portion and the lower core portion, or the heater layer is provided attached to or inside the lower cover layer. 2. The floor panel according to claim 1 , wherein an upper additional layer is provided between the heater layer and the upper core portion. 3. The floor panel according to claim 2 , wherein the upper additional layer is formed of a glass fiber reinforced plastic material or of an aramid fiber material. 4. The floor panel according to claim 1 , wherein a lower additional layer is provided between the heater layer and the lower core portion. 5. The floor panel according to claim 4 , wherein the lower additional layer is formed of a glass fiber reinforced plastic material or of an aramid fiber material. 6. The floor panel according to claim 1 , wherein the upper cover layer is formed of a carbon fiber reinforced plastic material, a glass fiber reinforced plastic material, an aramid fiber material, a metal material, or a combination thereof. 7. The floor panel according to claim 1 , wherein the lower cover layer is formed of a carbon fiber reinforced plastic material, a glass fiber reinforced plastic material, an aramid fiber material, a metal material, or a combination thereof. 8. The floor panel according to claim 1 , wherein the core assembly comprises a honeycomb structure or a foam material. 9. The floor panel according to claim 1 , wherein the conductor paths extend in parallel to one another, and wherein the PTC-resistor paths extend in parallel to one another and transverse to the conductor paths, so that each PTC-resistor path connects two adjacent conductor paths. 10. The floor panel according to claim 9 , wherein the distance between two adjacent conductor paths, the cross section of the PTC-resistor paths, and the density of the PTC-material are configured such that for a desired operational current at a fixed ambient temperature a desired carpet temperature at the upper cover layer is reached. 11. The floor panel according to claim 1 , wherein a current supply and a control unit are provided, wherein the control unit is configured to control a current flowing through the conductor paths in dependence of an ambient temperature, such that when the current flowing through the conductor path is higher than a predetermined threshold current which corresponds to a defined maximum carpet temperature at the upper cover layer and which depends on the ambient temperature, the current supply is switched on, wherein when the current flowing through the conductor paths is lower than the predetermined threshold current, the current supply is switched off. 12. The floor panel according to claim 1 , wherein a GFCI-device is provided and connected to the conductor paths. 13. The floor panel according to claim 1 , wherein the floor panel comprises a temperature sensor. 14. An aircraft comprising a floor panel according to claim 1 . 15. The aircraft according to claim 14 , wherein the floor panel is arranged in a door area next to a door of a cabin of the aircraft.

Assignees

Inventors

Classifications

  • in walls, floors, ceilings · CPC title

  • Aromatic polyamide fibres · CPC title

  • another layer next to it being a foam layer · CPC title

  • Sound or heat insulation {, e.g. using insulation blankets} · CPC title

  • Heaters specially adapted for floor heating · CPC title

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Frequently asked questions

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What does patent US9914522B2 cover?
A floor panel for an aircraft comprising a panel structure for transmitting forces applied to the floor panel, wherein the panel structure includes an upper cover layer, a lower cover layer, and a core assembly sandwiched between the upper and lower cover layers, and a heater layer for heating the floor panel, wherein the heater layer is provided between the upper and lower cover layers. The ob…
Who is the assignee on this patent?
Airbus Operations Gmbh
What technology area does this patent fall under?
Primary CPC classification B64C1/18. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 13 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).