Thermal capacitance system

Patent metadata

Field	Value
Publication number	US-9913411-B2
Application number	US-201615139440-A
Country	US
Kind code	B2
Filing date	Apr 27, 2016
Priority date	Apr 27, 2016
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

A system for cooling electronics includes at least two modular thermal energy storage cards stacked in one of a horizontal or a vertical stack, where the stack provides cooling to a portion to electronics. The cards include: a thermally conductive enclosure bounding an interior cavity, a cell wall structure that includes cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure, a phase change material having a melting point where the phase change material disposed within the cells and in thermal communication with cell walls of the cells, and a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics that includes a heat generating surface. The thermally conductive interface extends from the interior cavity a distance beyond the interior cavity of the enclosure and is in contact with the heat generating surface.

First claim

The invention claimed is:

1. A system, comprising:
a first modular thermal energy storage card stacked on top of or placed adjacent to a second modular thermal energy storage card such that the first modular thermal energy storage card and the second modular thermal energy storage card comprise one of a horizontal or a vertical stack, and wherein the stack provides cooling to electronics, the first modular thermal energy storage card and the second modular thermal energy storage card each comprising:
a thermally conductive enclosure bounding an interior cavity;
a cell wall structure comprising a plurality of cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure;
a phase change material having a melting point, the phase change material disposed within the plurality of cells and in thermal communication with cell walls of the plurality of cells;
a thermally conductive interface disposed between the thermally conductive enclosure and a portion of the electronics comprising a heat generating surface, the thermally conductive interface extending from the interior cavity a distance beyond the interior cavity of the enclosure and in contact with the heat generating surface.

2. The system of claim 1 , wherein the thermally conductive interface comprises a thermal conductor.

3. The system of claim 1 , the thermally conductive interface of one or more of the first modular thermal energy storage card or the second modular thermal energy storage card comprising at least one of: a heat pipe, a vapor chamber, or a graphite rod.

4. The system of claim 1 , the first modular thermal energy storage card and the second modular thermal energy storage each further comprising a wedgelock coupled to the enclosure, wherein the thermally conductive interface is configured to circumvent utilizing the wedgelock to conduct heat to or from the portion of the electronics.

5. The system of claim 1 , the melting point of the phase change material of the first modular thermal energy storage card and the melting point of the phase change material of the second modular thermal energy storage card not being equal.

6. The system of claim 1 , wherein the thermally conductive enclosure bounding the interior cavity of one or more of the first modular thermal energy storage card or the second modular thermal energy storage card comprises an upper surface opposing a bottom surface.

7. The system of claim 6 , wherein the thermally conductive interface comprises a heat pipe embedded in at least one of the upper surface or the lower surface of the thermally conductive enclosure.

8. The system of claim 1 , wherein the stack comprises a horizontal stack and the horizontal stack forms a thermal energy storage card for insertion into a chassis and the chassis comprises the heat generating surface.

9. The system of claim 1 , wherein the stack comprises a horizontal stack and the system further comprises a frame, wherein the frame is fitted over the horizontal stack to secure the first modular thermal energy storage card and the second modular thermal energy storage card adjacent to each other.

10. The system of claim 9 , the frame comprising a thermal conductive material wherein the frame transfers heat from the first modular thermal energy storage card to the second modular thermal energy storage card.

11. The system of claim 1 , wherein the first modular thermal energy storage card is stacked on top of the second modular thermal energy storage such that a surface of the thermally conductive enclosure of the first modular thermal energy storage card is in contact with the phase change material of the second modular thermal energy storage card.

12. The system of claim 1 , wherein the phase change material of first modular thermal energy storage card and the phase change material of the second modular thermal energy storage card each comprise one of: an organic wax, an inorganic multi-phase metal alloy, an eutectic salt.

13. The system of claim 1 , wherein the overall cell porosity within the interior cavity of the first modular thermal energy storage card is in a range from about 50% to about 88%.

14. The system of claim 1 , wherein a half-cell width of the plurality of cells of the first modular thermal energy storage card is in a range from about 0.25 millimeters to about 1 millimeter.

15. The system of claim 1 wherein a thickness of the cell wall structure of the first modular thermal energy storage card is in a range from about 0.25 millimeters to about 2 millimeters.

16. The system of claim 1 , wherein the thermally conductive interface comprises a heat pipe.

17. A system comprising:
an electronic system comprising electronic components and a chassis, the chassis in thermal contact with components;
a first modular thermal energy storage card and a second modular thermal energy storage card inserted into the chassis, the first modular thermal energy storage card stacked on top of or placed adjacent to the second modular thermal energy storage card such that the first modular thermal energy storage card and the second modular thermal energy storage card comprise one of a horizontal or a vertical stack, wherein the stack provides cooling to the electronic system, the first modular thermal energy storage card and the second modular thermal energy storage card each comprising:
a thermally conductive enclosure bounding an interior cavity;
a cell wall structure comprising a plurality of cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure;
a phase change material having a melting point, the phase change material disposed within the plurality of cells and in thermal communication with cell walls of the plurality of cells;
a thermally conductive interface disposed between the thermally conductive enclosure and the chassis, the thermally conductive interface extending from the interior cavity a distance beyond the interior cavity of the enclosure and in contact with the chassis.

18. The system of claim 17 , wherein the chassis comprises a heat generating surface.

19. The system of claim 17 , the melting point of the phase change material of the first modular thermal energy storage card and the melting point of the phase change material of the second modular thermal energy storage card not being equal.

20. A system comprising:
an electronic system comprising electronic components and a chassis, the chassis in thermal contact with components;
a first modular thermal energy storage card and a second modular thermal energy storage card inserted into the chassis, the first modular thermal energy storage card placed adjacent to the second modular thermal energy storage card such that the first modular thermal energy storage card and the second modular thermal energy storage card comprise one of a horizontal stack, wherein the stack provides cooling to the electronic system, the first modular thermal energy storage card and the second modular thermal energy storage card each comprising:
a thermally conductive enclosure bounding an interior cavity;
a cell wall structure comprising a plurality of cells disposed within the interior cavity and in thermal communication with the thermally conductive enclosure;
a phase change material having a melting point, the phase change material disposed within the plurality of cells and in thermal communication with cell walls of the plurality of cells;
a thermally conductive interface,
wherein the thermally conductive inte

Assignees

• Gen Electric

Inventors

• De Bock Hendrik Pieter Jacobus
• Vogel John Anthony
• Thiagarajan Naveenan

Classifications

• H05K7/20881 Primary

  Liquid coolant with phase change · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20681 Primary

  within cabinets for removing heat from sub-racks · CPC title

• Y02E60/14

  Thermal energy storage · CPC title