Thermoplastic Resin Composition and Molded Article Manufactured Therefrom
US-2024376301-A1 · Nov 14, 2024 · US
US9913324B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9913324-B2 |
| Application number | US-201414566961-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 11, 2014 |
| Priority date | Jun 15, 2012 |
| Publication date | Mar 6, 2018 |
| Grant date | Mar 6, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.
Opening claim text (preview).
The invention claimed is: 1. A resin composition for sealing an organic electroluminescent element, comprising: at least one epoxy compound; at least one polyester resin, which is a polyester resin compound having a cyclohexyl skeleton and no aromatic ring; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, wherein the content of epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of polyester resin. 2. The resin composition for sealing the organic electroluminescent element according to claim 1 , wherein at least one of the epoxy compound is an epoxy compound having a cyclohexyl skeleton and no aromatic ring. 3. The resin composition for sealing the organic electroluminescent element according to claim 1 , wherein the Lewis acid compound is a boron trifluoride complex. 4. The resin composition for sealing the organic electroluminescent element according to claim 1 , satisfying: E′ C <2,000 MPa and E′ B ×5≦ E′ B wherein E′ B is a storage elastic modulus at room temperature in the B stage state of the resin composition for sealing the organic electroluminescent element (the partially cured state in which the resin composition containing the epoxy compound retains 80% or greater of calorific value in a differential scanning calorimetry), and E′ C is a storage elastic modulus at room temperature in the state after heat at 80° C. for 3 hours from the B stage state. 5. The resin composition for sealing the organic electroluminescent element according to claim 1 , wherein the resin composition for sealing the organic electroluminescent element in a B stage state has a glass transition temperature of 40° C. or higher. 6. The resin composition for sealing the organic electroluminescent element according to claim 1 , wherein a 40 μm-thick film prepared by curing the resin composition for sealing the organic electroluminescent element has a total luminous transmittance is 95% or greater. 7. The resin composition for sealing the organic electroluminescent element according to claim 1 , comprising at least one drying agent. 8. A sealing film for an organic electroluminescent element prepared from the resin composition according to claim 1 . 9. An organic electroluminescent element sealed with the sealing film for an organic electroluminescent element prepared from the resin composition according to claim 8 . 10. A gas-barrier film for an organic electroluminescent element having a laminate structure composed of at least two or more layers, wherein at least one layer of the laminate structure is a resin layer prepared from the resin composition for sealing the organic electroluminescent element according to claim 1 and the other at least one layer of the laminate structure comprises a transparent plastics.
Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title
Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title
Encapsulations · CPC title
Polyesters derived from dicarboxylic acids and dihydroxy compounds (C08L67/06 takes precedence) · CPC title
Manufacture of films or sheets · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.