High temperature superconductor tape with alloy metal coating

Patent metadata

Field	Value
Publication number	US-9911910-B2
Application number	US-201314013313-A
Country	US
Kind code	B2
Filing date	Aug 29, 2013
Priority date	Aug 29, 2013
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

In one embodiment a superconductor tape includes a substrate comprising a plurality of layers, an oriented superconductor layer disposed on the substrate, and an alloy coating disposed upon the superconductor layer, the alloy coating comprising one or more metallic layers in which at least one metallic layer comprises a metal alloy.

First claim

What is claimed is:

1. A superconductor tape, comprising:
a substrate comprising a plurality of layers;
an oriented superconductor layer disposed on the substrate; and
an alloy coating disposed upon the superconductor layer, the alloy coating comprising two or more metallic layers, including a copper layer/silver layer bilayer structure, wherein a silver alloy layer of the copper layer/silver layer bilayer structure contacts the oriented superconductor layer, wherein a copper layer of the copper layer/silver layer bilayer structure is disposed directly in contact with the silver alloy layer and does not contact the superconductor layer, and wherein the copper layer comprises a copper alloy having an alloying element in a precipitate phase, the silver alloy comprising Ta, the Ta having a molar fraction between 0.5 and 10.0%.

2. The superconductor tape of claim 1 , the copper alloy comprising a mixture of copper and zirconium, copper and tin, or copper and zinc.

3. The superconductor tape of claim 2 , comprising a mixture of copper and zirconium having a molar fraction of zirconium less than or equal to 10%.

4. The superconductor tape of claim 1 , the superconductor layer comprising RBa 2 Cu 3 O 7−x where R is a rare earth element.

5. The superconductor tape of claim 1 , the copper layer comprising a thickness of 10 μm or less.

6. The superconductor tape of claim 1 , the superconductor layer comprising:
RBa 2 Cu 3 O 7−x where R is a rare earth element; wherein the silver alloy is effective to generate Ta-containing oxide precipitates when the superconductor tape is heated to above 300° C. for about one second or more.

7. The superconductor tape of claim 1 , the silver alloy comprising Sn or Zn, the Sn or Zn having a molar fraction of between 0.5 and 30%.

8. The superconductor tape of claim 1 , the silver alloy comprising AgZr precipitates dispersed within a matrix of Ag.

9. A superconductor tape, comprising:
a substrate comprising a plurality of layers;
an oriented superconductor layer disposed on the substrate; and
an alloy coating disposed upon the superconductor layer, the alloy coating comprising two or more metallic layers, including a copper layer/silver layer bilayer structure, wherein a silver alloy layer of the copper layer/silver layer bilayer structure contacts the oriented superconductor layer, wherein a copper layer of the copper layer/silver layer bilayer structure is disposed directly in contact with the silver alloy layer and does not contact the superconductor layer, and wherein the copper layer comprises a copper alloy having an alloying element in a precipitate phase, the silver alloy comprising Zr, the Zr having a molar fraction of 6 % to to 10.0 %.

10. The superconductor tape of claim 9 , the superconductor layer comprising:
RBa 2 Cu 3 O 7−x where R is a rare earth element; wherein the silver alloy is effective to generate Zr-containing oxide precipitates when the superconductor tape is heated to above 300° C. for about one second or more.

11. The superconductor tape of claim 9 , the silver alloy comprising AgZr precipitates dispersed within a matrix of Ag.

12. A superconductor tape, comprising:
a substrate comprising a plurality of layers;
an oriented superconductor layer disposed on the substrate; and
an alloy coating disposed upon the superconductor layer, the alloy coating comprising two or more metallic layers, including a copper layer/silver layer bilayer structure, wherein a silver alloy layer of the copper layer/silver layer bilayer structure contacts the oriented superconductor layer, wherein a copper layer of the copper layer/silver layer bilayer structure is disposed directly in contact with the silver alloy layer and does not contact the superconductor layer, and wherein the copper layer comprises a copper alloy, the copper alloy comprising a mixture of copper and zirconium, copper and tin, or copper and zinc, the silver alloy comprising Ta, the Ta having a molar fraction between 0.5 and 10.0%.

13. The superconductor tape of claim 12 , comprising a mixture of copper and zirconium having a molar fraction of zirconium less than or equal to 10%.

14. The superconductor tape of claim 12 , the copper alloy having an alloying element in a precipitate phase.

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Wang Connie P
• Sullivan Paul
• Murphy Paul
• Tekletsadik Kasegn D
• Ramakrishnan Bharatwaj

Classifications

• Y10T428/31678

  Of metal · CPC title

• Y10T428/12618

  Plural oxides · CPC title

• H01B12/06 Primary

  Films or wires on bases or cores · CPC title

• H01L39/248 Primary

  Electricity · mapped topic

• H01L39/16

  Electricity · mapped topic