Manufacturing method of solar cell and solar cell
US-2017025561-A1 · Jan 26, 2017 · US
US9911873B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9911873-B2 |
| Application number | US-201615234586-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 11, 2016 |
| Priority date | Aug 11, 2015 |
| Publication date | Mar 6, 2018 |
| Grant date | Mar 6, 2018 |
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Methods of hydrogenation of passivated contacts using materials having hydrogen impurities are provided. An example method includes applying, to a passivated contact, a layer of a material, the material containing hydrogen impurities. The method further includes subsequently annealing the material and subsequently removing the material from the passivated contact.
Opening claim text (preview).
What is claimed is: 1. A method comprising: applying, to a passivated contact, a layer of a material, the material containing hydrogen impurities; subsequently annealing the layer of the material; and subsequently removing the layer of the material from the passivated contact. 2. The method of claim 1 , wherein the layer of the material comprises alumina (Al2O3). 3. The method of claim 1 , wherein the layer of the material is applied using Plasma-Enhanced Chemical Vapor Deposition (PECVD). 4. The method of claim 1 , wherein the layer of the material is applied using Atomic Layer Deposition (ALD). 5. The method of claim 1 , wherein the passivated contact comprises a layer of polycrystalline silicon (pcSi) on silicon oxide (SiOx). 6. The method of claim 1 , further comprising growing the passivated contact on a silicon wafer, wherein growing the passivated contact comprises growing a layer of silicon oxide (SiOx) on the silicon wafer. 7. The method of claim 6 , wherein the layer of silicon oxide has a thickness of 10 nm or less. 8. The method of claim 7 , wherein the layer of silicon oxide has a thickness of 2 nm or less. 9. The method of claim 6 , wherein the layer of silicon oxide is thermally grown on the silicon wafer. 10. The method of claim 6 , wherein the layer of silicon oxide is chemically grown on the silicon wafer. 11. The method of claim 6 , wherein growing the passivated contact further comprises growing amorphous silicon on the layer of silicon oxide. 12. The method of claim 11 , wherein growing the passivated contact further comprises thermally crystalizing the amorphous silicon to form a layer of polycrystalline silicon (pcSi). 13. The method of claim 11 , wherein the amorphous silicon is applied using Plasma-Enhanced Chemical Vapor Deposition (PECVD). 14. The method of claim 1 , wherein removing the layer of the material comprises applying at least one of an acid or a base to the layer of the material. 15. The method of claim 1 , further comprising applying a doped amorphous silicon cap on the passivated contact after removing the layer of the material. 16. The method of claim 15 , wherein the doped amorphous silicon cap has a thickness between about 3 nm and about 7 nm. 17. The method of claim 1 , wherein the passivated contact is incorporated within a solar cell.
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