Micro-perforation overmolding gate

US9910460B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9910460-B2
Application numberUS-201514815376-A
CountryUS
Kind codeB2
Filing dateJul 31, 2015
Priority dateNov 12, 2014
Publication dateMar 6, 2018
Grant dateMar 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A molding tool configured to mold a feature to a substrate having an interior region and an exterior region opposite the interior region, the molding tool comprising: a first chamber configured to align with and fill first micro-apertures formed through the substrate with a moldable material used to form the feature; a second chamber configured to align with second micro-apertures formed through the substrate; and a mold cavity that communicates with the first chamber and the second chamber via the first micro-apertures and the second micro-apertures, respectively, the mold cavity comprising an internal cavity having a shape of the feature. 2. The molding tool of claim 1 , wherein at least one of the first micro-apertures comprises a first opening having a first cross sectional area at the interior region, and a channel through the substrate that connects the first opening with a second opening having a second cross sectional area at the exterior region. 3. The molding tool of claim 2 , wherein the first cross sectional area is about equal to the second cross sectional area. 4. The molding tool of claim 2 , wherein at least some of the moldable material remains within at least one of the channels. 5. The molding tool of claim 1 , wherein the moldable material is a low viscosity liquid polymer. 6. The molding tool of claim 5 , wherein the low viscosity liquid polymer is selected from a group comprising liquid silicone rubber, urethane acrylate, and a two-part resin. 7. An electronic device, comprising: a substrate comprising an interior region and an exterior region, the exterior region defining a visible region of the substrate when the electronic device is assembled; a plurality of micro-apertures, comprising: a first micro-aperture extending from a first opening in the interior region to a second opening in the exterior region, the first opening having a first diameter, the second opening having a second diameter; and a second micro-aperture extending from a third opening in the interior region to a fourth opening in the exterior region; and a polymer feature extending from the exterior region to the interior region, wherein a portion of the polymer feature is positioned within the first micro-aperture and the second micro-aperture. 8. The electronic device of claim 7 , wherein the polymer feature is formed of a low viscosity liquid polymer selected from a group comprising liquid silicone rubber, urethane acrylate, and a two-part resin or other low viscosity molding polymer. 9. The electronic device of claim 8 , wherein the low viscosity liquid polymer is translucent or transparent or opaque. 10. The electronic device of claim 9 , further comprising a light source, wherein when the light source is activated the low viscosity polymer allows the light to pass through the low viscosity polymer to illuminate the polymer feature. 11. The electronic device of claim 7 , wherein the polymer feature comprises: a mechanical interlock in the interior region; a cosmetic exterior that hides the first micro-aperture, the second micro-aperture, and the mechanical interlock. 12. The electronic device of claim 7 , wherein the polymer feature protrudes relative to the exterior region of the substrate to define an exterior surface of the polymer feature. 13. The electronic device of claim 12 , wherein the exterior surface of the polymer feature is rounded. 14. The electronic device of claim 12 , wherein the exterior surface of the polymer feature defines a polygonal shape. 15. The electronic device of claim 12 , wherein the exterior surface of the polymer feature comprises a flat region. 16. The electronic device of claim 7 , wherein the plurality of micro-apertures comprises a first region of micro-apertures surrounded by a second region of micro-apertures. 17. The electronic device of claim 16 , wherein the polymer feature covers the first region of micro-apertures and the second region of micro-apertures. 18. The electronic device of claim 7 , wherein the second diameter is less than the first diameter. 19. The electronic device of claim 7 , wherein the first micro-aperture defines a conical shape. 20. The electronic device of claim 7 , wherein the first micro-aperture defines a cylindrical shape.

Assignees

Inventors

Classifications

  • having venting means · CPC title

  • Moulding in or through a hole in the article, e.g. outsert moulding · CPC title

  • injecting into blind holes · CPC title

  • Electrical apparatus, e.g. sparking plugs or parts thereof · CPC title

  • G06F1/1656Primary

    Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

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What does patent US9910460B2 cover?
An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an …
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification G06F1/1656. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).