Wireless communication system, a radar system and a method for determining a position information of an object

Patent metadata

Field	Value
Publication number	US-9910145-B2
Application number	US-201314135069-A
Country	US
Kind code	B2
Filing date	Dec 19, 2013
Priority date	Dec 19, 2013
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module.

First claim

What is claimed is:

1. A radar system comprising a wireless communication system, the wireless communication system comprising:
a first semiconductor module of the radar system located in a radar transmitter wherein the first semiconductor module comprises a first semiconductor die connected to a first antenna structure, wherein the first semiconductor die of the first semiconductor module and the first antenna structure of the first semiconductor module are arranged within a common package, wherein the first semiconductor die of the first semiconductor module comprises a transmitter module configured to transmit a wireless communication signal through the first antenna structure of the first semiconductor module; and
a second semiconductor module of the radar system located in a radar receiver, wherein the second semiconductor module comprises a second semiconductor die connected to a second antenna structure, wherein the second semiconductor die of the second semiconductor module comprises a receiver module configured to receive the wireless communication signal through the second antenna structure of the second semiconductor module from the first semiconductor module,
wherein the first semiconductor module and the second semiconductor module are arranged with a distance of more than 10 cm.

2. The radar system according to claim 1 , wherein the first semiconductor module and the second semiconductor module are arranged on different circuit boards.

3. The radar system according to claim 1 , wherein the first semiconductor module and the second semiconductor module are configured to exchange signals solely wireless.

4. The radar system according to claim 1 , wherein the first semiconductor module and the second semiconductor module are arranged so that the wireless communication signal reaches the second semiconductor module through a direct wireless signal path.

5. The radar system according to claim 1 , wherein the transmitter module of the first semiconductor die of the first semiconductor module is configured to transmit the wireless communication signal with a transmit frequency higher than 10 GHz.

6. The radar system according to claim 1 , wherein the common package of the first semiconductor module is a wafer level package.

7. The radar system according to claim 6 , wherein the first antenna structure of the first semiconductor module is implemented within at least one redistribution layer of the wafer level package.

8. The radar system according to claim 1 , wherein the first antenna structure of the first semiconductor module is surrounded by molding material of the common package.

9. The radar system according to claim 1 , wherein the first antenna structure of the first semiconductor module comprises a maximal dimension larger than a maximal dimension of the first semiconductor die of the first semiconductor module.

10. The radar system according to claim 1 , wherein the wireless communication signal contains information on a phase of a local oscillator signal of the first semiconductor module.

11. The radar system according to claim 1 , wherein an amplitude and a phase of the wireless communication signal contains data to be transmitted.

12. The radar system according to claim 1 , wherein the second semiconductor die of the second semiconductor module and the second antenna structure of the second semiconductor module are arranged within a common package of the second semiconductor module.

13. The radar system according to claim 1 , comprising a third semiconductor module comprising a third semiconductor die connected to a third antenna structure, wherein the third semiconductor die of the third semiconductor module comprises a receiver module configured to receive the wireless communication signal through the third antenna structure of the third semiconductor module from the first semiconductor module.

14. The radar system according to claim 13 , wherein the second semiconductor module and the third semiconductor module are arranged with different distances to the first semiconductor module, wherein the difference of the distances is larger than 1 cm.

15. The radar system according to claim 1 , wherein the first antenna structure of the first semiconductor module is configured to provide the wireless communication signal in a direction in parallel to a main surface of the first semiconductor die of the first semiconductor module with a signal strength larger than a signal strength of the wireless communication signal in a direction orthogonal to the main surface of the first semiconductor die of the first semiconductor module.

16. The radar system according to claim 1 , wherein the first semiconductor module comprises a radar transmitter module configured to transmit a radar signal to at least one object in the proximity of the radar system, wherein the second semiconductor module comprises a radar receiver module configured to receive a reflected radar signal caused by a reflection of the radar signal at the at least one object.

17. The radar system according to claim 16 , wherein the wireless communication signal contains information on a phase of a local oscillator signal used for generating the radar signal by the first semiconductor module, wherein the radar system is configured to determine a position information of the at least one object based on the received reflected radar signal and the information on a phase of a local oscillator signal contained by the received wireless communication signal.

18. A method for determining a position information of an object, the method comprising:
transmitting a radar signal to at least one object by a transmitter device located in a radar transmitter;
receiving a reflected radar signal caused by a reflection of the radar signal at the at least one object by a receiver device located in a radar receiver;
wirelessly transmitting a wireless communication signal containing information on a phase of a local oscillator signal used for generating the radar signal by the transmitter device;
receiving the wireless communication signal by the receiver device; and
determining a position information of the at least one object based on the received reflected radar signal and the information on the phase of the local oscillator signal contained by the received wireless communication signal,
wherein the radar transmitter and the radar receiver are arranged with a distance of more than 10 cm.

19. A wireless communication system comprising:
a first semiconductor module comprising a first semiconductor die connected to a first antenna structure, wherein the first semiconductor die of the first semiconductor module and the first antenna structure of the first semiconductor module are arranged within a common package, wherein the first semiconductor die of the first semiconductor module comprises a transmitter module configured to transmit a wireless communication signal through the first antenna structure of the first semiconductor module; and
a second semiconductor module comprising a second semiconductor die connected to a second antenna structure, wherein the second semiconductor die of the second semiconductor module comprises a receiver module configured to receive the wireless communication signal through the second antenna structure of the second semiconductor module from the first semiconductor module,
wherein the first antenna structure of the first semiconductor module is configured to provide the wireless communication signal in a direction in parallel to a main surface of the first semicond

Assignees

• Infineon Technologies Ag

Inventors

• Boeck Josef
• Lachner Rudolf
• Wojnowski Maciej
• Hartner Walter

Classifications

• H10W72/9413

  on encapsulations · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W44/248

  for antennas · CPC title

• G01S7/032

  Constructional details for solid-state radar subsystems · CPC title

• G01S7/02 Primary

  of systems according to group G01S13/00 · CPC title