Thermal conductivity control devices

US9909823B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9909823-B2
Application numberUS-201313913863-A
CountryUS
Kind codeB2
Filing dateJun 10, 2013
Priority dateJun 10, 2013
Publication dateMar 6, 2018
Grant dateMar 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for controlling thermal conductivity between two thermal masses is disclosed. The system includes a first conduction body in thermal contact with a heat source and a second conduction body in contact with a heat sink. A thermal expansion component operatively connects to the first conduction body and moves the body between first and second positions at a predetermined temperature. In the first position the first conduction body is spaced apart from the second conduction body, thermally isolating the heat source from the heat sink. In the second position the first conduction body thermally contacts the second conduction body, and conducts heat from the heat source, through the conduction bodies and into the heat sink. Related methods are also described.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for controlling thermal conductivity between two thermal masses, comprising: a first conduction body configured and adapted for thermal contact with a heat source; a second conduction body configured and adapted for thermal contact with a heat sink; and a thermal expansion component operatively connected to move the first conduction body between a first position in which the first conduction body is spaced apart from the second conduction body for thermal isolation of the heat source and heat sink, and a second position in which the first conduction body is in thermal contact with the second conduction body for conduction of heat from the heat source, through the conduction bodies, and into the heat sink, wherein the thermal expansion component is configured and adapted to move the first conduction body into the second position at a predetermined temperature, wherein the actuator is a snap disk. 2. The system as recited in claim 1 , wherein the first and second positions of the first conduction body define a direction of motion, and wherein the first and second conduction bodies each have a wedge face oblique with respect to the direction of motion. 3. The system as recited in claim 1 , wherein the thermal expansion component includes a bimetal actuator fabricated from first and second thermally responsive elements having different thermal coefficient of expansion, first element being coupled second element. 4. The system as recited in claim 1 , wherein the snap disk adopts a bowed configuration at the predetermined temperature. 5. The system as recited in claim 1 , wherein the wedge face of the first conduction body opposes the wedge face of the second conduction body. 6. The system as recited in claim 1 , wherein the wedge faces define a thermally insulating gap between the conduction bodies when the first conduction body is the first position. 7. The system as recited in claim 1 , wherein at least one of the wedge faces further comprises a polished surface. 8. The system as recited in claim 1 , wherein the wedge faces define a thermally conductive interface between the faces in the second position. 9. The system as recited in claim 7 , wherein the thermal expansion component applies a contact pressure along the interface of the wedge faces when the first conduction body is in the second position. 10. The system for controlling thermal conductivity between two thermal masses as recited in claim 1 , wherein an axis through the first and second position of the first conduction body defines a direction of motion; wherein the first and second conduction bodies each have a wedge face that is oblique with respect to the direction of motion; and wherein the thermal expansion component is configured to compress the first conduction body against the second conduction body at a second predetermined temperature, thereby increasing a rate of heat transfer between the heat source and the heat sink. 11. A system for controlling thermal conductivity between two thermal masses, comprising: a first conduction body configured and adapted for thermal contact with a heat source; a second conduction body configured and adapted for thermal contact with a heat sink; and a thermal expansion component operatively connected to move the first conduction body between a first position in which the first conduction body is spaced apart from the second conduction body for thermal isolation of the heat source and heat sink, and a second position in which the first conduction body is in thermal contact with the second conduction body for conduction of heat from the heat source, through the conduction bodies, and into the heat sink, wherein the thermal expansion component is configured and adapted to move the first conduction body into the second position at a predetermined temperature, wherein the thermal expansion component includes a cylinder configured to remain stationary relative to the first conduction body, and a piston body operatively connecting the first conduction body to the cylinder, wherein a thermal expansion body within the cylinder operatively connects between the cylinder and the piston for movement of the first conduction body between the first and second positions, wherein cylinder contains a fluid having a first coefficient of thermal expansion, wherein a housing of the cylinder is constructed from a material having a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion is greater than the second coefficient of thermal expansion. 12. The system as recited in claim 11 , wherein the thermal expansion body includes a paraffin wax pellet. 13. The system as recited in claim 11 , further comprising a resilient member biasing the first conduction body towards the first position. 14. A battery system comprising: a battery body for storing and supplying electrical energy; a first conduction body in thermal contact with the battery body; and a thermal expansion component operatively connected to move the first conduction body between a first position in which the first conduction body is spaced apart from a second conduction body for thermal isolation of the battery from a heat sink in thermal contact with the second conduction body, and a second position in which the first conduction body is in thermal contact with the second conduction body for conduction of heat from the battery body, through the conduction bodies, and into the heat sink, wherein the thermal expansion component is configured and adapted to move the first conduction body into the second position at a predetermined temperature, wherein the thermal expansion component includes a cylinder configured to remain stationary relative to the first conduction body, and a piston body operatively connecting the first conduction body to the cylinder, wherein a thermal expansion body within the cylinder operatively connects between the cylinder and the piston for movement of the first conduction body between the first and second positions, wherein cylinder contains a fluid having a first coefficient of thermal expansion, wherein a housing of the cylinder is constructed from a material having a second coefficient of thermal expansion, wherein the first coefficient of thermal expansion is greater than the second coefficient of thermal expansion. 15. The battery system as recited in claim 14 , wherein the heat sink is configured and arranged to be a thermally conductive path to an external surface or other heat sink of an aircraft.

Assignees

Inventors

Classifications

  • Vehicles · CPC title

  • Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings · CPC title

  • Rods or plates · CPC title

  • Variable conductance materials; Thermal switches · CPC title

  • for aircrafts or cosmonautics · CPC title

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What does patent US9909823B2 cover?
A system for controlling thermal conductivity between two thermal masses is disclosed. The system includes a first conduction body in thermal contact with a heat source and a second conduction body in contact with a heat sink. A thermal expansion component operatively connects to the first conduction body and moves the body between first and second positions at a predetermined temperature. In t…
Who is the assignee on this patent?
Andres Michael J, Hamilton Sundstrand Corp
What technology area does this patent fall under?
Primary CPC classification F28F13/00. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Mar 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).