Heat storage member and method for manufacturing the same

US9909046B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9909046-B2
Application numberUS-201113574870-A
CountryUS
Kind codeB2
Filing dateFeb 25, 2011
Priority dateFeb 26, 2010
Publication dateMar 6, 2018
Grant dateMar 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat storage member includes a honeycomb structure having a plurality of cells, each of which is filled with capsules and a heat conductive filler. Each capsule contains a heat storage material. The heat storage member is prepared by bringing a starting material that is a mixture of the capsules into contact with the honeycomb structure to cover at least one surface of the opening of the cells of the honeycomb structure, subjecting the same to uniaxial pressure molding under the pressure of 4 MPa to 10 MPa, and filling each cell with the starting material.

First claim

Opening claim text (preview).

The invention claimed is: 1. A heat storage member, comprising: a honeycomb structure having a plurality of cells, wherein each of the cells is filled with capsules and a heat conductive filler; each of the capsules contains a heat storage material; the heat conductive filler is 10 to 45 parts by weight relative to 100 parts by weight of the capsules containing the heat storage material; the heat conductive filler contains a heat-conductive material and an adhesive agent; the heat-conductive material is a carbon material or metal; the adhesive agent is an inorganic binder or a thermosetting resin; and the heat conductive filler has a heat conductivity which is in a range of 5 W/(m·K) to 20 W/(m·K). 2. The heat storage member according to claim 1 , wherein each of the cells is filled with the capsules at a filling rate of 65% to 90%. 3. A method for manufacturing the heat storage member of claim 1 , comprising: bringing a starting material that is a mixture of a capsule, which contains a heat storage material, and a heat conductive filler into contact with a honeycomb structural body to cover at least one surface of an opening of cells of the honeycomb structural body; subjecting the starting material to pressure molding under a pressure of 4 MPa or more and 10 MPa or less; and filling each of the cells with the starting material.

Assignees

Inventors

Classifications

  • by melting or evaporation of solids · CPC title

  • characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

  • the latent heat storage material being enclosed in granular particles or dispersed in a porous, fibrous or cellular structure · CPC title

  • C09K5/063Primary

    Materials absorbing or liberating heat during crystallisation; Heat storage materials · CPC title

  • Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 · CPC title

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What does patent US9909046B2 cover?
A heat storage member includes a honeycomb structure having a plurality of cells, each of which is filled with capsules and a heat conductive filler. Each capsule contains a heat storage material. The heat storage member is prepared by bringing a starting material that is a mixture of the capsules into contact with the honeycomb structure to cover at least one surface of the opening of the cell…
Who is the assignee on this patent?
Tsukahara Aiichiro, Abe Isami, Mihara Tetsuya, and 4 more
What technology area does this patent fall under?
Primary CPC classification C09K5/063. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).