Cured thermoset for high thermal conductive materials

Patent metadata

Field	Value
Publication number	US-9908988-B2
Application number	US-201315108794-A
Country	US
Kind code	B2
Filing date	Dec 30, 2013
Priority date	Dec 30, 2013
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.

First claim

What is claimed is:

1. An article comprising a heat source and an electrically insulating thermal management component located in proximity to the heat source, wherein the thermal management component comprises a cured thermoset formed from a composition comprising:
(a) a diglycidyl compound which has mesogenic structure, and melting point of the compound is 150 degrees Centigrade or less,
(b) a hardener and
(c) an inorganic filler of its thermal conductivity is 100 W/m·K or more.

2. The article of claim 1 wherein the composition may further comprise another inorganic filler, and the content of total inorganic filler is 30 volume % or more based on the volume of the composition.

3. The article of claim 1 wherein the diglycidyl compound is represented by the following formula (1);

wherein R 1 and R 2 are independently selected from hydrogen atoms or an aliphatic hydrogen group having from 1 to 10 carbon atoms, R 3 to R 10 are independently selected from the group consisting of hydrogen atom, alkyl group having 1 to 10 carbon atoms, trifluoromethyl group, aryl group, halogen atom, nitro group, nitrile group and methoxy group, n is a integer from 0 to 10.

4. The article of claim 1 , wherein the diglycidyl compound is represented by the following formula (2);

5. The article of claim 1 wherein the hardener is a diamine having at least one aromatic ring.

6. The article of claim 1 wherein the heat source is an electrical element or a semiconductor element.

7. The article of claim 1 wherein the electrical element or semiconductor element is selected from lighting elements, display elements, power elements and photovoltaic cells.

8. A cured thermoset with the thermal conductivity of 8 W/m·K or more, wherein the thermoset is formed from a composition comprising;
(a) a dyglycidyl compound of the following formula (2);

(b) a hardener and
(c) an inorganic filler of its thermal conductivity is 100 W/m·K or more,
the composition may comprise further another inorganic filler, and the total filler content is 30 volume % or more based on the volume of the composition.

9. The cured thermoset of claim 8 , wherein the inorganic filler is boron nitride and the particle size of the boron nitride is 30 micro meter or more.

10. The cured thermoset of claim 9 , wherein the thermal conductivity of the thermoset is 10 W/m·K or more, the boron nitride is agglomerated and the size of the agglomerated boron nitride is 200 micro meter or more.

11. A method for forming the cured thermoset of claim 8 , wherein the cured temperature of the composition is from 80 to 180 degrees Centigrade.

Assignees

• Dow Global Technologies Llc
• Rohm & Haas

Inventors

• Liu Wei
• Song Xiaomei
• Chen Hongyu
• Huang Yan
• Zhang Yu

Classifications

• H10W40/251

  Organics · CPC title

• H01L23/3737

  Electricity · mapped topic

• C08K3/28 Primary

  Nitrogen-containing compounds · CPC title

• H01L2924/00

  Electricity · mapped topic

• H01L2933/0075

  Electricity · mapped topic