Patterned stamp manufacturing method, patterned stamp imprinting method and imprinted article

US9908358B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9908358-B2
Application numberUS-201414905856-A
CountryUS
Kind codeB2
Filing dateJul 22, 2014
Priority dateJul 22, 2013
Publication dateMar 6, 2018
Grant dateMar 6, 2018

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a patterned stamp ( 100 ) for patterning a contoured surface ( 10 ) is disclosed. The method comprises providing a pliable stamp layer ( 120 ) carrying a pattern of features ( 122 ), forcing the pliable stamp layer onto the contoured surface with said pattern of features facing the contoured surface; applying a fluid support layer ( 130 ) over the pliable stamp layer on the contoured surface; solidifying the support layer ( 140 ) to form the patterned stamp; and removing the patterned stamp from the contoured surface. A corresponding patterned stamp, imprinting method and imprinted article are also disclosed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a patterned stamp for patterning a contoured surface, the method comprising: providing a pliable stamp layer carrying a pattern of relief features; forcing the pliable stamp layer onto the contoured surface with said pattern of relief features facing the contoured surface; applying a fluid support layer over the pliable stamp layer on the contoured surface; solidifying the support layer to form the patterned stamp; and removing the patterned stamp from the contoured surface. 2. The method of claim 1 , wherein forcing the pliable stamp layer onto the contoured surface comprises: placing the contoured surface with the pliable stamp layer in a vacuum chamber; and reducing the pressure in said vacuum chamber to force the pliable stamp layer onto the contoured surface. 3. The method of claim 1 , wherein solidifying comprises grafting the support layer onto the pliable stamp layer. 4. The method of claim 3 , wherein the pliable stamp layer and the support layer comprise a rubbery material. 5. The method of claim 4 , wherein the rubbery material is a siloxane-based material such as polydimethylsiloxane. 6. The method of claim 1 , wherein the relief features have a larger than intended dimensions, the relief features shrinking to the intended dimensions during solidifying. 7. The method of claim 1 , further comprising applying a soft layer onto the contoured surface, wherein forcing the pliable stamp layer onto the contoured surface comprises forcing the relief features into the soft layer. 8. The method of claim 1 , wherein the pliable stamp layer comprises a distorted pattern of features, and wherein forcing the patterned pliable stamp layer onto the contoured surface comprises deforming the distorted pattern into an intended pattern. 9. The method of claim 1 , further comprising fixating the patterned stamp on a rigid carrier.

Assignees

Inventors

Classifications

  • B41N1/14Primary

    Lithographic printing foils {(B41N1/003, B41N3/03 take precedence; compositions of the image-forming layer B41C1/10)} · CPC title

  • Rotary lithographic machines {(such office printing machines B41L7/00)} · CPC title

  • flexible · CPC title

  • G03F7/0002Primary

    Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

  • with stamping surfaces adapted for application to non-flat surfaces · CPC title

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Frequently asked questions

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What does patent US9908358B2 cover?
A method of manufacturing a patterned stamp ( 100 ) for patterning a contoured surface ( 10 ) is disclosed. The method comprises providing a pliable stamp layer ( 120 ) carrying a pattern of features ( 122 ), forcing the pliable stamp layer onto the contoured surface with said pattern of features facing the contoured surface; applying a fluid support layer ( 130 ) over the pliable stamp layer o…
Who is the assignee on this patent?
Koninklijke Philips Nv
What technology area does this patent fall under?
Primary CPC classification B41N1/14. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).