Thin wall application with injection compression molding and in-mold roller

US9908272B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9908272-B2
Application numberUS-201314774484-A
CountryUS
Kind codeB2
Filing dateMar 12, 2013
Priority dateMar 12, 2013
Publication dateMar 6, 2018
Grant dateMar 6, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for making a thin wall component comprise: locating a film ( 40 ) in a mold cavity of a mold, wherein the mold cavity has an initial mold thickness, wherein the film comprises a base layer ( 41 ) and a pattern layer ( 42 ); injecting a molding material ( 60 ) into the mold cavity such that the molding material contacts the pattern layer, wherein the molding material comprises a polymeric material and a filler; compressing the mold to a final mold thickness that is less than the initial mold thickness, to form a molded product, wherein the pattern layer forms a surface of the molded product; and removing the molded product from the mold. A molded product formed by the method. The method produce a thin walled component without warpage, inner stresses, poor surface quality, or washout defects.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for making a thin wall component comprising: locating a film in a mold cavity of a mold, wherein the mold cavity has an initial mold thickness, wherein the film comprises a base layer and a pattern layer, and wherein the pattern layer has a thickness of less than or equal to 0.05 mm; injecting a molding material into the mold cavity such that the molding material contacts the pattern layer, wherein the molding material comprises a polymeric material and a filler; compressing the mold to a final mold thickness that is less than the initial mold thickness, to form a molded product, wherein the pattern layer forms a surface of the molded product; removing the molded product from the mold; and removing the base layer from the molded product, wherein a mold temperature is less than or equal to a heat deflection temperature of the molding material minus 25° C. 2. The method of claim 1 , wherein the film has a thickness of less than or equal to 0.03 mm. 3. The method of claim 1 , further comprising applying vacuum pressure to hold the film to a mold surface of the mold. 4. The method of claim 1 , wherein the mold is a variable cavity depth mold. 5. The method of claim 1 , wherein the molded product has a thickness of less than 2 mm. 6. The method of claim 1 , wherein the polymeric material comprises at least one material from polycarbonate, polyamide, acrylonitrile butadiene styrene, polybutylene terephthalate. 7. The method of claim 1 , wherein the filler is present in an amount of greater than or equal to 20 wt %, based upon a total weight of the molding material. 8. The method of claim 1 , wherein the molding material comprises greater than or equal to 20 wt % filler, based upon a total weight of the molding material; and wherein the mold final thickness is less than or equal to 1.5 mm. 9. The method of claim 1 , wherein the filler comprises at least one filler from glass fibers, steel fiber, and talc. 10. The method of claim 1 , wherein the mold temperature is less than or equal to the molding material heat deflection temperature minus 30° C. 11. The method of claim 1 , wherein the polymeric material is polycarbonate and the filler is glass fibers. 12. The method of claim 1 , further comprising introducing the film to the mold cavity from a first roller and removing the base layer from the mold cavity with another roller. 13. A molded product formed by the method of claim 1 . 14. The molded product of claim 13 , wherein the surface of the molded product is free from defects greater than 0.01 mm 2 over an area of greater than or equal to 600 cm 2 . 15. The molded product of claim 13 , wherein the molded product has a warpage of less than 0.5 mm across an area of 600 cm 2 as determined by checking warpage of all edges with feeler gauge on a marble top. 16. The molded product of claim 13 , wherein the molded product has a surface area of at least 600 mm 2 . 17. A method for making a thin wall component comprising: moving a film from a roller into a mold cavity of a mold, wherein the mold cavity has an initial mold thickness, wherein the film comprises a base layer and a pattern layer, and wherein the pattern layer has a thickness of less than or equal to 0.05 mm; injecting a molding material into the mold cavity such that the molding material contacts the pattern layer, wherein the molding material comprises a polymeric material and a filler; compressing the mold to a final mold thickness that is less than the initial mold thickness, to form a molded product, wherein the pattern layer forms a surface of the molded product; removing the molded product from the mold; and removing the base layer from the mold onto another roller, wherein a mold temperature is less than or equal to a heat deflection temperature of the molding material minus 25° C. 18. The method for making a thin wall component of claim 1 , wherein the filler is present in an amount between 20-50 wt %, based upon a total weight of the molding material. 19. The method for making a thin wall component of claim 17 , wherein the filler is present in an amount between 20-50 wt %, based upon a total weight of the molding material.

Assignees

Inventors

Classifications

  • using fillers dispersed in the moulding material, e.g. metal particles · CPC title

  • Multilayered articles (B29C45/14827 takes precedence) · CPC title

  • ink decorations · CPC title

  • Coating articles provided with a decoration · CPC title

  • Fillers · CPC title

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What does patent US9908272B2 cover?
A method for making a thin wall component comprise: locating a film ( 40 ) in a mold cavity of a mold, wherein the mold cavity has an initial mold thickness, wherein the film comprises a base layer ( 41 ) and a pattern layer ( 42 ); injecting a molding material ( 60 ) into the mold cavity such that the molding material contacts the pattern layer, wherein the molding material comprises a polymer…
Who is the assignee on this patent?
Cao Shipu, Shen Qingya, Yan Wei, and 4 more
What technology area does this patent fall under?
Primary CPC classification B29C45/14688. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 06 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).