Apparatus with direct cooling pathway for cooling both sides of power semiconductor

Patent metadata

Field	Value
Publication number	US-9907216-B2
Application number	US-201615288891-A
Country	US
Kind code	B2
Filing date	Oct 7, 2016
Priority date	Oct 8, 2015
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

An apparatus includes a cooling segment including an upper box having an open bottom surface facing a top surface of a power semiconductor and adhered to the top surface of the power semiconductor, and a lower box having an open top surface facing a bottom surface of the power semiconductor and adhered to the bottom surface of the power semiconductor, an inlet tank connected to an end portion of one side of the upper box and passing therethrough, and into which a fluid is introduced, an outlet tank connected to an end portion of one side of the lower box and passing therethrough, and into which a fluid is discharged, and a connection tank connected to an end portion of the other side of each of the upper box and the lower box and passing therethrough.

First claim

What is claimed is:

1. An apparatus with a direct cooling pathway for cooling both sides of each of a plurality of power semiconductors, the apparatus comprising:
a plurality of cooling segments, each of the cooling segments including an upper box having an open bottom surface facing a top surface of a corresponding one of the power semiconductors and adhered to the top surface of the corresponding one of the power semiconductors, and a lower box having an open top surface facing a bottom surface of the corresponding one of the power semiconductors and adhered to the bottom surface of the corresponding one of the power semiconductors;
an inlet tank connected to an end portion of one side of the upper box of a first one of the cooling segments and configured to allow fluid to be introduced and pass therethrough, and into which the fluid is introduced;
an outlet tank connected to an end portion of one side of the lower box of the first one of the cooling segments and configured to allow the fluid to pass therethrough and be discharged; and
a connection tank connected to an end portion of another side of each of the upper box and the lower box of a second one of the cooling segments and configured to allow the fluid to pass therethrough,
wherein immediately neighboring two of the plurality of cooling segments are connected to each other, a direct cooling pathway is formed between the inlet tank and the connection tank, and between the outlet tank and the connection tank such that the fluid comes into direct contact with the top surface and the bottom surface of each of the power semiconductors and cools each of the power semiconductors.

2. The apparatus of claim 1 , wherein the upper box includes:
a first hollow body having closed side surfaces and a closed top surface;
a first connection pipe corresponding to the end portion of the one side of the upper box, formed to pass through one of the side surfaces of the first hollow body, and having a diameter smaller than a height of the upper box;
a second connection pipe corresponding to the end portion of the another side of the upper box, formed to pass through another of the side surfaces of the first hollow body, and having a stopping jaw formed inside an inner diameter into which a first connection pipe of an adjacent one of the cooling segments is inserted;
a first flange configured to protrude from an edge of a bottom surface of the first hollow body in an outward direction, having a mounting groove formed on the bottom surface thereof, and in which the bottom surface except for a portion in which the mounting groove is formed is adhered to the top surface of the corresponding one of the power semiconductors; and
a first O-ring coupled to the mounting groove of the first flange.

3. The apparatus of claim 2 , wherein the lower box includes:
a second hollow body having closed side surfaces and a closed bottom surface;
a third connection pipe corresponding to the end portion of the one side of the lower box, formed to pass through one of the side surfaces of the second hollow body, and having a diameter smaller than a height of the lower box;
a fourth connection pipe corresponding to the end portion of the another side of the lower box, formed to pass through another of the side surfaces of the second hollow body, and having a stopping jaw formed inside an inner diameter into which a third connection pipe of the adjacent one of the cooling segments is inserted;
a second flange configured to protrude from an edge of a top surface of the second hollow body in an outward direction, having a mounting groove formed on the top surface thereof, and in which the top surface except for a portion in which the mounting groove is formed is adhered to the bottom surface of the corresponding one of the power semiconductors; and
a second O-ring coupled to the mounting groove of the second flange,
wherein the lower box is formed to be vertically symmetrical to the upper box.

4. The apparatus of claim 3 , wherein, in each of the cooling segments,
the corresponding one of the power semiconductors is interposed between the upper box and the lower box; and
pins of the corresponding one of the power semiconductors protrude from both sides of the power semiconductor in a direction perpendicular to a connection direction of any one connection pipe of the first connection pipe to the fourth connection pipe.

5. The apparatus of claim 3 , wherein the outlet tank includes:
a discharge pipe from which the fluid is discharged;
a plurality of second fitting units, one of the second fitting units connected to the third connection pipe of the first one of the cooling segments; and
a second distribution header formed between the discharge pipe and the second fitting units and having an internal volume which discharges the fluid to the discharge pipe.

6. The apparatus of claim 3 , wherein the connection tank includes:
a third distribution header having an internal volume for receiving the fluid from the upper box of the second one of the cooling segments and configured to supply the fluid to the lower box of the second one of the cooling segments; and
a plurality of third fitting units formed on a side surface of the third distribution header and configured to allow the fluid to pass therethrough, a first one of the third fitting units connected to the second connection pipe of the second one of the cooling segments, and a second one of the third fitting units connected to the fourth connection pipe of the second one of the cooling segments.

7. The apparatus of claim 2 , wherein the inlet tank includes:
an inlet pipe into which the fluid is introduced;
a plurality of first fitting units, one of the first fitting units connected to the first connection pipe of the first one of the cooling segments; and
a first distribution header connected between the inlet pipe and the first fitting units and configured to allow the fluid to pass therethrough, and having an internal volume which distributes the fluid to the first fitting units.

8. The apparatus of claim 1 , further comprising a plurality of cooling segment assemblies,
wherein a subset of the cooling segments are serially connected to each other between the inlet tank and the connection tank and between the outlet tank and the connection tank and constitute one of the cooling segment assemblies having a serial connection structure, each subset of the cooling segment assemblies is parallelly connected to at least one other of the subset of the cooling segment assemblies and is spaced apart from each of the at least one other of the subset of the cooling segment assemblies to form a parallel connection structure.

9. The apparatus of claim 8 , wherein the upper box includes:
a first hollow body having closed side surfaces and a closed top surface;
a first connection pipe corresponding to the end portion of the one side of the upper box, formed to pass through one of the side surfaces of the first hollow body, and having a diameter smaller than a height of the upper box;
a second connection pipe corresponding to the end portion of the another side of the upper box, formed to pass through another of the side surfaces of the first hollow body, and having a stopping jaw formed inside an inner diameter into which a first connection pipe of an adjacent one of the cooling segments is inserted;
a first flange configured to protrude from an edge of a bottom surface of the first hollow body in an outward direction, having a mounting groove formed on the bottom surface thereof, and in which the bottom surface except for a portion in which the mounting groove is formed is adhered to the top surface of the corresponding one of the power semiconductors; an

Assignees

• Hyundai Mobis Co Ltd

Inventors

• Park Young Seop

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H01L23/373

  Electricity · mapped topic