Heat assisted media recording device with reduced likelihood of laser mode hopping

US9905996B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9905996-B2
Application numberUS-201414492785-A
CountryUS
Kind codeB2
Filing dateSep 22, 2014
Priority dateSep 22, 2014
Publication dateFeb 27, 2018
Grant dateFeb 27, 2018

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus includes a laser diode, a heater arrangement, and a circuit. The laser diode is configured to facilitate heat assisted magnetic recording during a lasing state. The heater arrangement is positioned proximate the laser diode. The circuit electrically couples the laser diode and the heater arrangement in a parallel relationship. The circuit is configured to alternately operate the laser diode in a lasing state and a non-lasing state, and to activate the heater arrangement during the non-lasing state to warm a junction of the laser diode.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus, comprising: a laser diode configured to facilitate heat assisted magnetic recording during a lasing state; a heater arrangement proximate the laser diode; and a circuit electrically coupling the laser diode and the heater arrangement in a parallel relationship and to a controller configured to control the parallel-coupled laser diode and heater arrangement, the circuit configured to alternately operate the laser diode in the lasing state and a non-lasing state, and to activate the heater arrangement during the non-lasing state to warm a junction of the laser diode. 2. The apparatus of claim 1 , wherein the heater arrangement comprises a temperature sensor configured to measure a temperature of the junction of the laser diode in one or both of the lasing state and the non-lasing state. 3. The apparatus of claim 2 , further comprising: an analyzer configured to determine a temperature at a junction of a laser diode when the laser diode is operated in the lasing state, wherein the analyzer compares the junction temperature and an injection current supplied during the lasing state to stored combinations of junction temperature and injection current to determine a likelihood of mode hopping occurring for the laser diode during the lasing state; and a controller in communication with the analyzer and configured to vary a current supplied to the heater arrangement for varying a temperature of the junction to reduce the likelihood of mode hopping occurring during the lasing state. 4. The apparatus of claim 1 , wherein the heater arrangement comprises a diode arranged to be reverse biased during the lasing state and forward biased during the non-lasing state, the forward biased diode generating heat to warm the junction of the laser diode. 5. The apparatus of claim 1 , wherein the heater arrangement comprises a photodiode arranged to facilitate power monitoring of the laser diode and heating of the laser diode during at least the non-lasing state. 6. The apparatus of claim 1 , wherein the heater arrangement comprises a diode coupled in series with a heater, the diode arranged to be reverse biased during the lasing state and forward biased during the non-lasing state. 7. The apparatus of claim 1 , wherein: the heater arrangement comprises a diode coupled in series to a thermistor; the diode is arranged to be reversed bias during the lasing state and forward biased during the non-lasing state; and the thermistor serves as a temperature sensor for the junction at least during a portion of the non-lasing state. 8. The apparatus of claim 1 , wherein the controller is configured to vary a current supplied to the heater arrangement for varying a temperature of the junction. 9. The apparatus of claim 1 , wherein the heater arrangement is configured to warm the junction to a temperature associated with a reduced risk of mode hopping of the laser diode. 10. A method, comprising: measuring a junction temperature of a laser diode in a lasing state that facilitates heat assisted recording and in a non-lasing state; generating a drive signal having an energizing portion and a non-energizing portion to cause the laser diode to operate in the lasing state and non-lasing state, respectively; activating a diode of a heater arrangement coupled in parallel with the laser diode and to a controller configured to control the parallel-coupled laser diode and heater arrangement using at least the non-energizing portion of the drive signal; and heating the laser diode using the heater arrangement during at least the non-lasing state. 11. The method of claim 10 , wherein: the energizing portion comprises a negative-going portion for forward biasing the diode during at least a portion of the lasing state; and heating the laser diode comprises heating the laser diode using the heater arrangement during at least a portion of the lasing state. 12. The method of claim 10 , wherein measuring the junction temperature of the laser diode during the non-lasing state is facilitated by the heater arrangement. 13. The method of claim 10 , comprising controlling operation of the heater arrangement based on the measured junction temperature. 14. The method of claim 10 , comprising forward biasing the diode during at least a portion of the lasing state and the non-lasing state. 15. The method of claim 10 , wherein heating the laser diode comprises heating the laser diode to a temperature that falls within a temperature range associated with a reduced risk of mode hopping of the laser diode. 16. An apparatus, comprising: a laser diode configured to facilitate heat assisted magnetic recording during a lasing state; a heater arrangement proximate the laser diode; and a circuit electrically coupling the laser diode and the heater arrangement in a parallel relationship and to a controller configured to control the parallel-coupled laser diode and heater arrangement, the circuit configured to alternately operate the laser diode in the lasing state and a non-lasing state, and to activate the heater arrangement during at least a portion of the non-lasing state and at least a portion of the lasing state to warm a junction of the laser diode. 17. The apparatus of claim 16 , wherein: the circuit is configured to receive a drive signal having an energizing portion and a non-energizing portion to cause the laser diode to operate in the lasing state and non-lasing state, respectively, the energizing portion having a positive-going portion and a negative-going portion; and the heater arrangement comprises a diode that is forward biased during the negative-going portion to facilitate warming of the junction by the heater arrangement during at least the portion of the lasing state. 18. The apparatus of claim 16 , wherein the heater arrangement comprises a temperature sensor configured to measure a temperature of the junction during one or both of the lasing state and the non-lasing state. 19. The apparatus of claim 18 , further comprising: an analyzer configured to determine a temperature at a junction of a laser diode when the laser diode is operated in the lasing state, wherein the analyzer compares the junction temperature and an injection current supplied during the lasing state to stored combinations of junction temperature and injection current to determine a likelihood of mode hopping occurring for the laser diode during the lasing state; and a controller in communication with the analyzer and configured to vary a current supplied to the heater arrangement for varying a temperature of the junction to reduce the likelihood of mode hopping occurring during the lasing state. 20. The apparatus of claim 16 , wherein the heater arrangement is configured to warm the junction to a temperature that falls within a temperature range associated with a reduced risk of mode hopping of the laser diode.

Assignees

Inventors

Classifications

  • Pulse modulation or generation · CPC title

  • by monitoring an external parameter, e.g. temperature · CPC title

  • Recording, reproducing, or erasing methods; Read, write or erase circuits therefor · CPC title

  • Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment (H01S5/0612 takes precedence, for monolithically integrated heaters see also H01S5/0261) · CPC title

  • Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title

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What does patent US9905996B2 cover?
An apparatus includes a laser diode, a heater arrangement, and a circuit. The laser diode is configured to facilitate heat assisted magnetic recording during a lasing state. The heater arrangement is positioned proximate the laser diode. The circuit electrically couples the laser diode and the heater arrangement in a parallel relationship. The circuit is configured to alternately operate the la…
Who is the assignee on this patent?
Seagate Technology Llc
What technology area does this patent fall under?
Primary CPC classification H01S5/06804. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).