Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US9905731B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9905731-B2 |
| Application number | US-79636510-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 8, 2010 |
| Priority date | Sep 22, 2004 |
| Publication date | Feb 27, 2018 |
| Grant date | Feb 27, 2018 |
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A light emitting diode is disclosed that includes a silicon carbide substrate and a light emitting structure formed from the Group III nitride material system on the substrate. The diode has an area greater than 100,000 square microns and has a radiant flux at 20 milliamps current of at least 29 milliwatts at its dominant wavelength between 390 and 540 nanometers.
Opening claim text (preview).
The invention claimed is: 1. A light emitting diode comprising: a light emitting layer that comprises a Group III nitride material system; a first ohmic contact on said light emitting layer; a silver-based layer between said first ohmic contact and said light emitting layer, said silver-based layer including a first face of said silver-based layer adjacent said first ohmic contact, a second face of said silver-based layer adjacent and directly contacting said light emitting layer and a sidewall of said silver-based layer that extends between said first and second faces; a barrier layer between said first ohmic contact layer and said silver-based layer and directly contacting said first ohmic contact layer, said barrier layer extending on said first face of said silver-based layer and further extending on said sidewall of said silver-based layer to directly contact said light emitting layer; a transparent conductive substrate on said light emitting layer opposite said silver-based layer; and a second ohmic contact directly on said transparent conductive substrate opposite said light emitting layer. 2. A light emitting diode according to claim 1 wherein said transparent conductive substrate comprises a silicon carbide single crystal substrate. 3. A light emitting diode according to claim 2 further comprising a buffer layer between said silicon carbide substrate and said light emitting layer, said buffer layer comprising the Group III nitride material system. 4. A light emitting diode according to claim 3 further comprising at least two layers of opposite conductivity type comprising the Group III nitride material system for providing carriers for recombination and light emission under an applied current. 5. A light emitting diode according to claim 4 wherein said light emitting layer includes at least one layer of indium gallium nitride. 6. A light emitting diode according to claim 2 wherein said silicon carbide substrate is n-type and has a polytype selected from the 3C, 4H, 6H, and 15R polytypes of silicon carbide. 7. A light emitting diode according to claim 1 wherein said light emitting layer comprises a doped semiconductor layer, said silver-based layer is directly on said doped semiconductor layer and said barrier layer is directly on said first face of said silver-based layer and completely encloses said sidewall of said silver-based layer. 8. A light emitting diode according to claim 7 wherein said doped semiconductor layer is a p-type semiconductor layer. 9. A light emitting diode according to claim 1 wherein said transparent conductive substrate includes an oblique sidewall. 10. A light emitting diode according to claim 9 ; wherein said second ohmic contact is directly on a face of said transparent conductive substrate that is opposite said light emitting layer, and wherein said second ohmic contact extends on only a first portion of said face and exposes a second portion of said face.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
characterised by the dopants · CPC title
the light-emitting regions comprising nitride materials · CPC title
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