Methods and apparatuses for high temperature bonding and bonded substrates having variable porosity distribution formed therefrom

Patent metadata

Field	Value
Publication number	US-9905532-B2
Application number	US-201615064981-A
Country	US
Kind code	B2
Filing date	Mar 9, 2016
Priority date	Mar 9, 2016
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

Methods and systems of bonding substrates include disposing a low melting point material and one or more high melting point materials having a higher melting temperature than a melting temperature of the low melting point material between a first substrate and a second substrate to form a substrate assembly including a contacting surface comprising first and second areas; applying a first force at the first area; and applying heat to form a bond layer between the first and second substrates. A first formed porosity of the bond layer is aligned with the first area of the contacting surface. A second formed porosity of the bond layer is aligned with the second area of the contacting surface to which the first force was not applied, and the first formed porosity is different from the second formed porosity.

First claim

What is claimed is:

1. A method of bonding substrates, the method comprising:
disposing a first composition comprising a low melting point material and one or more high melting point materials between a first substrate and a second substrate to form a substrate assembly, wherein:
the one or more high melting point materials have a melting temperature that is higher than a melting temperature of the low melting point material, and
the substrate assembly comprises a contacting surface of at least one of the first substrate and the second substrate and comprising at least a first area and a second area;

applying a first force at the first area of the contacting surface of the substrate assembly; and
applying heat to the substrate assembly to form a bond layer of the first composition between the first and second substrates, wherein:
a first formed porosity of the bond layer of the first composition is aligned with the first area of the contacting surface,
a second formed porosity of the bond layer of the first composition is aligned with the second area of the contacting surface to which the first force was not applied, and
the first formed porosity is different from the second formed porosity.

2. The method of claim 1 , wherein no force is applied to the second area of the contacting surface.

3. The method of claim 1 , wherein the first area of the contacting surface is aligned with a central area of the substrate assembly.

4. The method of claim 1 , wherein the second area of the contacting surface is aligned with an outer edge area of the substrate assembly.

5. The method of claim 1 , wherein the first substrate comprises Si or SiC.

6. The method of claim 1 , wherein the second substrate is direct bonded copper or direct bonded aluminum.

7. The method of claim 1 , wherein bonding comprises a high temperature bonding that is one of a transient liquid phase sintering heating and a diffusion soldering.

8. The method of claim 1 , wherein the low melting point material comprises a weight percent of 70% tin and the one or more high melting point materials comprises a weight percent of 30% Ni.

9. The method of claim 1 , further comprising:
applying a second force at the second area of the contacting surface of the substrate assembly.

10. The method of claim 9 , wherein the second force is less than the first force and is greater than zero.

11. The method of claim 9 , wherein the first area of the contacting surface is aligned with a central area of the substrate assembly, and the second area of the contacting surface is aligned with an outer edge area of the substrate assembly.

12. The method of claim 9 , wherein the second force comprises at least two separate first and second reduced forces that are each less than the first force.

13. The method of claim 12 , wherein:
the first reduced force comprises a force greater than zero and is applied to a first portion of the second area aligned with the first reduced force, and
the second reduced force comprises a zero force such that no force is applied to a second portion of the second area aligned with the second reduced force.

14. The method of claim 13 , wherein:
the first area of the contacting surface is aligned with a central area of the substrate assembly,
the first portion of the second area of the contacting surface is aligned with an inner portion of an outer edge area of the substrate assembly, and
the second portion of the second area of the contacting surface is aligned with an outer portion of the outer edge area of the substrate assembly.

15. The method of claim 1 , wherein the one or more high melting point materials comprises a material that is selected from at least one of a group consisting of Ni, Cu, Ag, and Al.

16. The method of claim 15 , wherein the low melting point material comprises a weight percent of 70% tin and the one or more high melting point materials comprises a weight percent of 30% of the material that is at least one of a group selected from Ni, Cu, Ag, and Al.

17. The method of claim 1 , wherein:
applying a first force at the first area of the contacting surface of the substrate assembly comprises applying the first force via a first force application device; and
the first force application device comprises at least one of one or more weights, a hydraulic pressure device, and a gas pressure device.

18. The method of claim 17 , wherein the one or more weights comprise a range of from about 500 g to about 1 kg.

19. A system for bonding of substrates, the system comprising:
a force application device;
a substrate assembly in contact with the force application device, the substrate assembly comprising:
a first substrate,
a second substrate, and
a first composition comprising a low melting point material and one or more high melting point materials, wherein:
the low melting point material and the one or more high melting point materials are disposed between the first and second substrates;
the one or more high melting point materials have a melting temperature that is higher than a melting temperature of the low melting point material; and
the force application device applies a first force at a first area of a contacting surface of at least one of the first substrate and the second substrate; and

a heat application device that applies heat to the substrate assembly to form a bond layer of the first composition between the first and second substrates, wherein:
a first formed porosity of the bond layer of the first composition is aligned with the first area, and the first area is aligned with a central area of the first composition of the substrate assembly,
a second formed porosity of the bond layer of the first composition is aligned with a second area of the contacting surface to which the first force was not applied, the second area is aligned with a periphery of an outer edge area of the first composition of the substrate assembly, and the periphery of the outer edge area is disposed around the central area of the first composition of the substrate assembly, and
the first formed porosity is different from the second formed porosity.

Assignees

• Toyota Eng & Mfg North America

Inventors

• Joshi Shailesh N
• Noguchi Masao

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07355

  changes in materials · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title