Nitride semiconductor element and nitride semiconductor package

Patent metadata

Field	Value
Publication number	US-9905419-B2
Application number	US-201615271759-A
Country	US
Kind code	B2
Filing date	Sep 21, 2016
Priority date	Nov 16, 2010
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A nitride semiconductor element capable of accommodating GaN electron transfer layers of a wide range of thickness, so as to allow greater freedom of device design, and a nitride semiconductor element package with excellent voltage tolerance performance and reliability. On a substrate, a buffer layer including an AlN layer, a first AlGaN layer and a second AlGaN layer is formed. On the buffer layer, an element action layer including a GaN electron transfer layer and an AlGaN electron supply layer is formed. Thus, an HEMT element is constituted.

First claim

What is claimed is:

1. A nitride semiconductor element, comprising:
a Si substrate including a primary surface;
a buffer layer comprised of an AlN layer formed on the primary surface of the Si substrate, and an AlGaN laminated structure formed by laminating multiple AlGaN layers on the AlN layer, the buffer layer having a primary surface which has a c-plane orientation;
a Group III-nitride electron transfer layer formed on the AlGaN laminated structure; and
a Group III-nitride electron supply layer formed on the Group III-nitride electron transfer layer,
wherein the AlGaN laminated structure includes a reference AlGaN layer, and an AlGaN layer that is closer to the AlN layer, and
wherein the reference AlGaN layer has an a-axis average lattice constant, the AlGaN layer arranged in contact with a surface of the reference AlGaN layer has an a-axis in-plane lattice constant, wherein the surface of the reference AlGaN layer faces the AlN layer, and wherein the a-axis average lattice constant of the reference AlGaN layer is greater than the a-axis in-plane lattice constant of the AlGaN layer arranged in contact with the surface of the reference AlGaN layer, and lower than an original a-axis average lattice constant of the reference AlGaN layer.

2. The nitride semiconductor element of claim 1 , wherein the reference AlGaN layer has an Al component that is lower than the Al component of the AlGaN layer that is closer to the AlN layer.

3. The nitride semiconductor element according to claim 2 , wherein, in the AlGaN laminated structure, the difference in Al component between the reference AlGaN layer and the AlGaN layer arranged in contact with the surface of the reference AlGaN layer is 10% or more.

4. The nitride semiconductor element according to claim 2 , wherein the Al component of the AlGaN layer is 50% and the Al component of the reference AlGaN layer is 10%.

5. The nitride semiconductor element according to claim 2 , wherein the Al component of the AlGaN layer is 50% and the Al component of the reference AlGaN layer is 17%.

6. The nitride semiconductor element according to claim 2 , wherein the Al component of the AlGaN layer is 50% and the Al component of the reference AlGaN layer is 20%.

7. The nitride semiconductor element according to claim 2 , wherein the Al component of the AlGaN layer is 50% and the Al component of the reference AlGaN layer is 25%.

8. The nitride semiconductor element according to claim 1 , wherein the AlN layer has a first a-axis average lattice constant, the Group III-nitride electron transfer layer has a second a-axis average lattice constant, and the a-axis average lattice constant of the reference AlGaN layer and the a-axis in-plane lattice constant of the AlGaN layer are greater than the first a-axis average lattice constant and smaller than the second a-axis average lattice constant.

9. The nitride semiconductor element according to claim 8 , wherein the first a-axis average lattice constant, the a-axis in-plane lattice constant of the AlGaN layer, the a-axis average lattice constant of the reference AlGaN layer, and the second a-axis average lattice constant are monotonic increasing values.

10. The nitride semiconductor element according to claim 1 , wherein the reference AlGaN layer is arranged to compress the Group III-nitride electron transfer layer in a-axis.

11. The nitride semiconductor element according to claim 1 , wherein the AlGaN layer is arranged to compress the reference AlGaN layer in a-axis.

12. The nitride semiconductor element according to claim 1 , wherein the AlN layer is stretched by the AlGaN layer in a-axis.

13. The nitride semiconductor element according to claim 1 , wherein the primary surface of the Si substrate is a (111) plane.

14. The nitride semiconductor element according to claim 1 , wherein the Group III-nitride electron transfer layer has a c-axis lattice constant which has a degree of strain that is −0.07% or more.

15. The nitride semiconductor element according to claim 1 , wherein the Group III-nitride electron transfer layer has a thickness of 500 nm to 2000 nm.

16. The nitride semiconductor element according to claim 1 , wherein the Group III-nitride electron supply layer has a thickness of 500 nm to 2000 nm.

17. The nitride semiconductor element according to claim 1 , wherein the AlN layer has a thickness of 50 nm to 200 nm.

18. The nitride semiconductor element according to claim 1 , wherein the AlGaN layer has a thickness of 100 nm to 500 nm.

19. The nitride semiconductor element according to claim 1 , wherein the reference AlGaN layer has a thickness of 100 nm to 500 nm.

20. A nitride semiconductor package, comprising:
a nitride semiconductor element according to claim 1 ; and
a resin package that covers the nitride semiconductor element.

Assignees

• Rohm Co Ltd

Inventors

• Takado Shinya
• Ito Norikazu
• Yamaguchi Atsushi

Classifications

• H10W72/552

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/936

  Multiple bond pads having different shapes · CPC title

• H10P14/3444

  P-type · CPC title