Method of manufacturing an article with integral active electronic component

Patent metadata

Field	Value
Publication number	US-9905389-B2
Application number	US-201715675835-A
Country	US
Kind code	B2
Filing date	Aug 14, 2017
Priority date	Mar 21, 2014
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A method of manufacturing an article with integral active electronic component includes using an additive manufacturing process to: a) form a non-electrically conductive substrate; b) form a non-electrically conductive perforated layer having an aperture; c) form electrically conductive anode and cathode elements spaced in the aperture; d) deposit a conductive electrical connection to each of the elements suitable for imparting an electrical potential difference between the elements; and e) form a non-electrically conductive sealing layer atop the perforated layer so as to retain and seal the aperture in the perforated layer.

First claim

The invention claimed is:

1. A method of manufacturing an article with integral active electronic component comprising:
using an additive manufacturing process to:
a) form a non-electrically conductive substrate;
b) form a non-electrically conductive perforated layer having an aperture;
c) form electrically conductive anode and cathode elements spaced in the aperture;
d) deposit a conductive electrical connection to each of the elements suitable for imparting an electrical potential difference between the elements;
e) form a non-electrically conductive sealing layer atop the perforated layer so as to retain and seal the aperture in the perforated layer.

2. The method of claim 1 wherein forming one or more of: the substrate; perforated layer; and sealing layer includes forming a channel providing fluid communication between the aperture and an evacuation port of the article, wherein the evacuation port is suitable for evacuating the aperture of gas so as to generate vacuum-like conditions in the aperture.

3. The method of claim 1 wherein the additive manufacturing process takes place within a sealed atmosphere constituted substantially of an inert gas so as to encase the inert gas in the aperture on formation of the sealing layer.

4. The method of claim 1 wherein the anode and cathode are positioned at opposing sides of the aperture.

5. The method of claim 1 wherein the cathode is located centrally in the aperture and the anode occupies at least part of a wall of the aperture.

6. The method of claim 1 wherein the additive manufacturing process includes an extrusion deposition process.

7. The method of claim 1 wherein the additive manufacturing process includes a granular material binding process.

8. The method of claim 1 further comprising: using the additive manufacturing process to form a filament element in thermal proximity with the cathode so as to, in use, induce thermionic emission by the cathode.

9. The method of claim 1 further comprising using the additive manufacturing process to: form a conductive grid element spaced from, and positioned between, the anode and cathode elements; and deposit a conductive electrical connection to the grid for providing an electrical signal to the grid, such that the grid regulates the transmission of electrons from the cathode to the anode.

10. The method of claim 1 wherein at least one of the: non-electrically conductive substrate; perforated layer; and sealing layer are formed in ceramic.

11. The method of claim 1 wherein at least one of the: anode; the grid; and the conductive electrical connections are formed from a gallium alloy.

12. The method of claim 11 wherein the gallium alloy is a binary eutectic alloy of gallium and indium.

13. The method of claim 1 wherein the cathode includes tungsten.

14. An article with integral active electronic component manufactured by the process of claim 1 .

15. An additive manufacturing apparatus for manufacturing an article with integral active electronic component, the apparatus comprising:
a computer system;
a first additive manufacturing component adapted to form non-electrically conductive three dimensional structures;
a second additive manufacturing component adapted to form electrically conductive three dimensional structures;
wherein the first and second additive manufacturing components are operable under control of the computer system, the computer system being adapted to control the components to:
a) form a non-electrically conductive substrate;
b) form a non-electrically conductive perforated layer having an aperture;
c) form electrically conductive anode and cathode elements spaced in the aperture;
d) deposit a conductive electrical connection to each of the elements suitable for imparting an electrical potential difference between the elements;
e) form a non-electrically conductive sealing layer atop the perforated layer so as to retain and seal the aperture in the perforated layer.

16. A computer system for controlling an additive manufacturing apparatus, the additive manufacturing apparatus being adapted to manufacture three dimensional structures from both non-electrically conductive and electrically conductive materials simultaneously, the computer system being operable to control the additive manufacturing apparatus to perform the method of claim 1 .

Assignees

• British Telecomm

Inventors

• Ghanea Hercock Robert

Classifications

• H01J19/08

  Cathodes heated directly by an electric current · CPC title

• H01J21/10

  with one or more immovable internal control electrodes, e.g. triode, pentode, octode · CPC title

• B33Y30/00

  Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

• B29C64/188 Primary

  involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control (surface shaping B29C59/00; after-treatment of articles without altering their shape B29C71/00) · CPC title

• H01J21/04

  without control means, i.e. diodes · CPC title