Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blank provided with actinic ray-sensitive or radiation-sensitive film, pattern forming method, method for manufacturing electronic device, and electronic device

Patent metadata

Field	Value
Publication number	US-9904168-B2
Application number	US-201615205250-A
Country	US
Kind code	B2
Filing date	Jul 8, 2016
Priority date	Feb 21, 2014
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

An actinic ray-sensitive or radiation-sensitive resin composition includes a resin (A) containing a repeating unit represented by General Formula (4) and a crosslinking agent (C) containing a polar group, in which the crosslinking agent (C) is a compound represented by General Formula (1) or a compound in which two to five structures represented by General Formula (1) are connected via a linking group or a single bond represented by L 1 in General Formula (3).

First claim

What is claimed is:

1. An actinic ray-sensitive or radiation-sensitive resin composition, comprising:
a resin (A) containing a repeating unit represented by General Formula (4); and
a crosslinking agent (C) containing a polar group,
wherein the crosslinking agent (C) is a compound represented by General Formula (1), or a compound in which two to five structures represented by General Formula (1) are connected via a linking group or a single bond represented by L 1 in General Formula (3),

wherein in General Formula (1), R 1 to R 6 each independently represent a hydrogen atom, an organic group having 1 to 50 carbon atoms, or a binding site to a linking group or a single bond represented by L 1 in General Formula (3), provided that at least one of R 2 , R 3 , R 4 , R 5 , or R 6 is a group represented by General Formula (2), and at least one of R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , or L 1 in General Formula (3) is a polar group selected from the following structures, or a group containing a polar group selected from the following structures as a partial structure,

in General Formula (2), R 7 represents an organic group having 1 to 30 carbon atoms,
in General Formula (3), L 1 represents a linking group or a single bond, * represents a binding site in any one of R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 , and k is an integer of 2 to 5, and
in General Formula (4), R 11 represents a hydrogen atom, a methyl group, or a trifluoromethyl group, R 12 represents a hydrogen atom or an alkyl group, L 11 represents a single bond or a linking group, X represents —Ar(OX 1 )m or —CO 2 X 2 in which Ar represents an aromatic ring, X 1 represents a hydrogen atom, a group having a non-acid-decomposable hydrocarbon structure, or a group having an acid-decomposable group, X 2 represents a group capable of leaving by the action of an acid or a group having a group capable of leaving by the action of an acid, and m represents an integer of 1 to 12, or R 12 and X may be bonded to each other to form a ring.

2. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the polar group is a structure selected from the following structures, or a group containing such a structure as a partial structure:

3. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the polar group is a structure selected from the following structures, or a group containing such a structure as a partial structure:

4. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , further comprising a compound (B) capable of generating an acid upon irradiation with actinic rays or radiation.

5. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 4 , wherein the volume of an acid generated from a compound (B) upon irradiation with actinic rays or radiation is 240 Å 3 or more.

6. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , wherein the resin (A) contains at least a repeating unit represented by the following General Formula (6), as the repeating unit represented by General Formula (4),

wherein in General Formula (6), R represents a hydrogen atom or a methyl group, L represents a single bond or a linking group, Ar represents an aromatic ring, and X 1 represents a hydrogen atom, a group having a non-acid-decomposable hydrocarbon structure, or a group having an acid-decomposable group.

7. An actinic ray-sensitive or radiation-sensitive film comprised of the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 .

8. A mask blank provided with the actinic ray-sensitive or radiation-sensitive film according to claim 7 .

9. A pattern forming method, comprising:
forming an actinic ray-sensitive or radiation-sensitive film using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ;
exposing the film; and
developing the exposed film using a developer to form a pattern.

10. The pattern forming method according to claim 9 , wherein the exposure is carried out using X-rays, an electron beam, or EUV light.

Assignees

• Fujifilm Corp

Inventors

• Yokokawa Natsumi
• Yamaguchi Shuhei
• Takahashi Koutarou

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• C08F220/20

  of polyhydric alcohols or phenols {, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate} · CPC title

• G03F7/322

  Aqueous alkaline compositions · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/0397

  the macromolecular compound having an alicyclic moiety in a side chain · CPC title