LED lighting device

Patent metadata

Field	Value
Publication number	US-9903579-B2
Application number	US-201113575465-A
Country	US
Kind code	B2
Filing date	Feb 9, 2011
Priority date	Feb 11, 2010
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

The invention relates to a LED lighting device LLD) comprising a heat spreader, having a front side and a back side; LEDs mounted on a PCB positioned on the front side of the heat spreader; a reflector or lens covering the LEDs; a socket for being received by an electrical supply system; optionally a base part; electronic driver components mounted on the back side of the heat spreader or inside the socket or base part; electrical leads or wiring system connecting the socket, the electronic driver components and the heat spreader; and a housing, optionally encapsulating the electronic components and the electrical leads or wiring system, being in thermally conductive contact with the heat spreader, wherein the housing is made of an thermally conductive, electrically conductive plastic material (TC/EC-material-A), covered with a protection layer consisting of an electrically insulating material (EI-material-B), on the outside of the housing.

First claim

The invention claimed is:

1. A light emitting diode lighting device (LLD) comprising:
a heat spreader having a front side and a back side,
a printed circuit board (PCB) positioned on the front side of the heat spreader,
light emitting diodes (LEDs) mounted on the PCB,
a reflector or lens covering the LEDs,
a socket for receiving an electrical supply system,
optionally a base part,
electronic driver components mounted on the back side of the heat spreader or inside the socket or base part,
electrical leads or wiring system connecting the socket, the electronic driver components and the heat spreader, and
a housing, optionally encapsulating the electronic driver components and the electrical leads or wiring system, the housing being in thermally conductive contact with the heat spreader, wherein
the housing is made of an thermally conductive, electrically conductive plastic material (TC/EC-material-A), covered with a protection layer consisting of an electrically insulating material (El-material-B) on an outside of the housing, and wherein
the TC/EC-material-A has a through-plane thermal conductivity, measured according to ASTM standard E1461 at 20° C., in a range of 1-6 W/mK, and the El-material-B has a through-plane thermal conductivity of less than 0.5 W/mK.

2. The LLD according to claim 1 , wherein the TC/EC-material-A has a volume resistivity, measured according to ISO69003, in a through plane direction, in a range of 10 −2 -10 6 Ohm.

3. The LLD according to claim 1 , wherein the TC/EC-material-A has an heat distortion temperature (HDT-A), as measured by ISO 75, of at least 160° C.

4. The LLD according to claim 1 , wherein the protection layer is a coating layer applied by an electrostatic spraying process.

5. The LLD according to claim 1 , wherein the protection layer has a thickness of 25-250 μm.

6. A process for making a housing for an LLD according to claim 1 , comprising the steps of:
(a.) providing a mould with a cavity for shaping the housing;
(b.) injection moulding a thermally conductive and electrically conductive plastic material into the cavity, thus forming a moulded part;
(c.) taking the thus formed molded part from the cavity;
(d.) applying a powder coating on an outside surface of the housing by electrostatic spraying; and
(e.) optionally curing the applied powder coating.

7. A process for making a housing for an LLD according to claim 1 , comprising the steps of:
(a.) providing a mould with a cavity for shaping the housing;
(b.) forming a molded part with an electrically insulating layer by (i) injection moulding a thermally conductive and electrically conductive plastic material into the cavity, thus forming a moulded part, and (ii) injection moulding an electrically insulating plastic material into the cavity, thereby forming an electrically insulating layer on an outside surface of the moulded part; and
(c.) taking the thus formed molded part with the electrically insulating layer from the cavity.

8. The LLD according to claim 3 , wherein the HDT-A of the TC/EC-material-A is at least 180° C.

9. The LLD according to claim 3 , wherein the HDT-A of the TC/EC-material-A is at least 200° C.

10. A light emitting diode lighting device (LLD) comprising:
a heat spreader having a front side and a back side,
a printed circuit board (PCB) positioned on the front side of the heat spreader,
light emitting diodes (LEDs) mounted on the PCB,
a reflector or lens covering the LEDs,
a socket for receiving an electrical supply system,
optionally a base part,
electronic driver components mounted on the back side of the heat spreader or inside the socket or base part,
electrical leads or wiring system connecting the socket, the electronic driver components and the heat spreader, and
a housing, optionally encapsulating the electronic driver components and the electrical leads or wiring system, the housing being in thermally conductive contact with the heat spreader, wherein
the housing is made of an thermally conductive, electrically conductive plastic material (TC/EC-material-A), covered with a protection layer consisting of an electrically insulating material (El-material-B) on an outside of the housing, and wherein the TC/EC-material-A has a volume resistivity, measured according to ISO69003, in a through plane direction, in a range of 10 −2 -10 6 Ohm, and the El-material-B has a through-plane thermal conductivity of less than 0.5 W/mK.

11. The LLD according to claim 10 , wherein the TC/EC-material-A has an heat distortion temperature (HDT-A), as measured by ISO 75, of at least 200° C.

12. A light emitting diode lighting device (LLD) comprising:
a heat spreader having a front side and a back side,
a printed circuit board (PCB) positioned on the front side of the heat spreader,
light emitting diodes (LEDs) mounted on the PCB,
a reflector or lens covering the LEDs,
a socket for receiving an electrical supply system,
optionally a base part,
electronic driver components mounted on the back side of the heat spreader or inside the socket or base part,
electrical leads or wiring system connecting the socket, the electronic driver components and the heat spreader, and
a housing, optionally encapsulating the electronic driver components and the electrical leads or wiring system, the housing being in thermally conductive contact with the heat spreader, wherein
the housing is made of an thermally conductive, electrically conductive plastic material (TC/EC-material-A), covered with a protection layer consisting of an electrically insulating material (El-material-B) on an outside of the housing, and wherein
the TC/EC-material-A has an heat distortion temperature (HDT-A), as measured by ISO 75, of at least 180° C., and the El-material-B has a through-plane thermal conductivity of less than 0.5 W/mK.

13. The LLD according to claim 12 , wherein the HDT-A of the TC/EC-material-A is at least 200° C.

14. A light emitting diode lighting device (LLD) comprising:
a heat spreader having a front side and a back side,
a printed circuit board (PCB) positioned on the front side of the heat spreader,
light emitting diodes (LEDs) mounted on the PCB,
a reflector or lens covering the LEDs,
a socket for receiving an electrical supply system,
optionally a base part,
electronic driver components mounted on the back side of the heat spreader or inside the socket or base part,
electrical leads or wiring system connecting the socket, the electronic driver components and the heat spreader, and
a housing, optionally encapsulating the electronic driver components and the electrical leads or wiring system, the housing being in thermally conductive contact with the heat spreader, wherein
the housing is made of an thermally conductive, electrically conductive plastic material (TC/EC-material-A), covered with a protection layer consisting of an electrically insulating material (El-material-B) having a through-plane thermal conductivity of less than 0.5 W/mK on an outside of the housing, and wherein
the protection layer is a coating layer applied by an electrostatic spraying process.

15. The LLD according to claim 14 , wherein the TC/EC-material-A has an heat distortion temperature (HDT-A), as measured by ISO 75, of at least 200° C.

Assignees

• Janssen Robert Hendrik Catharina
• Van Dijk Hans Klaas
• Dsm Ip Assets Bv

Inventors

• Janssen Robert Hendrik Catharina
• Van Dijk Hans Klaas

Classifications

• F21V29/70 Primary

  characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

• F21V29/004

  Mechanical Engineering · mapped topic

• F21V15/01 Primary

  Housings, e.g. material or assembling of housing parts (F21V15/02 takes precedence {housings forming signs or letters G09F13/04}) · CPC title

• F21K9/90

  Methods of manufacture · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title