Aluminum alloy material, aluminum alloy structure, and manufacturing method for same

Patent metadata

Field	Value
Publication number	US-9903008-B2
Application number	US-201715411739-A
Country	US
Kind code	B2
Filing date	Jan 20, 2017
Priority date	Dec 2, 2011
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

Aluminum alloy material containing Si: 1.0 to 5.0 mass % and Fe: 0.01 to 2.0 mass % with balance being Al and inevitable impurities, wherein 250 pcs/mm 2 or more to 7×10 5 pcs/mm 2 or less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 μm are present in a cross-section of the aluminum alloy material, while 100 pcs/mm 2 or more to 7×10 5 pcs/mm 2 or less of Al-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 μm are present in a cross-section of the aluminum alloy material. An aluminum alloy structure is manufactured by bonding two or more members in vacuum or a non-oxidizing atmosphere at temperature at which a ratio of a mass of a liquid phase generated in the aluminum alloy material to a total mass of the aluminum alloy material is 5% or more and 35% or less.

First claim

The invention claimed is:

1. A fin member for a heat exchanger having a heat bonding ability with a single layer comprising an aluminum alloy material consisting essentially of Si: 1.0 mass % to 5.0 mass % and Fe: 0.01 mass % to 2.0 mass %, at least one of Mg: in an amount of >0 and ≦2.0 mass %, Cu: in an amount of >0 and ≦1.5 mass %, and Mn: in an amount of >0 and ≦2.0 mass %, and at least one of Ti: in an amount of >0 and ≦0.3 mass %, V: in an amount of >0 and ≦0.3 mass %, Cr: in an amount of >0 and ≦0.3 mass %, Ni: in an amount of >0 and ≦2.0 mass %, and Zr: in an amount of >0 and ≦0.3 mass %, with balance being Al and inevitable impurities,
wherein the contents (mass %) of Si, Fe and Mn are denoted by S, F, and M, respectively and a relational expression of 1.2≦S−0.3(F+M)≦3.5 is satisfied,
wherein 1.3×10 3 pcs/mm 2 or more to 2.2×10 4 pcs/mm 2 or less of Si-based intermetallic compound particles, each of which has equivalent circle diameters of 0.5 to 5 μm and is selected from Si alone and Si partly containing elements of Ca and P, are present in a cross-section of the aluminum alloy material,
wherein 1.3×10 3 pcs/mm 2 or more to 3.3×10 4 pcs/mm 2 or less of dispersed particles of Al-based intermetallic compounds, each of which has equivalent circle diameters of 0.5 to 5 μm and is generated from Al and additive elements selected from Al—Fe-based, Al—Fe—Si-based, Al—Mn—Si-based, Al—Fe—Mn-based and Al—Fe—Mn—Si-based compounds, are present in a cross-section of the aluminum alloy material,
wherein the aluminum alloy material is heat bonded with a single layer without the use of a brazing filler metal, and
wherein the fin is bonded to a second member, wherein, in a metal structure in a cross-section of at least one of the bonded members, 10 to 3000 pcs/mm 2 of eutectic structures having a length of 3 μm or more are present within matrix crystal grains.

2. The fin member according to claim 1 , wherein in the metal structure in the cross-section of the at least one bonded members, a number of triple points of grain boundaries where Si-based intermetallic compounds and Al-based intermetallic compounds both having equivalent circle diameters of 1 μm or more exist, is 50% or more of the number of triple points of all the grain boundaries.

Assignees

• Uacj Corp

Inventors

• Niikura Akio
• Fujita Kazuko
• Murase Takashi
• Oya Yoshiyuki
• KUROSAKI Tomohito

Classifications

• F28F1/126

  consisting of zig-zag shaped fins (F28F1/105 takes precedence) · CPC title

• B23K2203/10

  Operations & Transport · mapped topic

• B23K2201/14

  Operations & Transport · mapped topic

• B23K20/2333

  one layer being aluminium, magnesium or beryllium · CPC title

• C22C21/02 Primary

  with silicon as the next major constituent · CPC title