Film material, electronic component using film material, and method for producing electronic component

Patent metadata

Field	Value
Publication number	US-9902880-B2
Application number	US-201614997130-A
Country	US
Kind code	B2
Filing date	Jan 15, 2016
Priority date	Mar 25, 2015
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

First claim

What is claimed is:

1. A film material comprising:
a substrate; and
a film layer arranged on one main surface of the substrate, wherein:
the film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and
the linear expansion coefficient CF of the first resin is smaller than the linear expansion coefficient CR of the second resin in a cured state,
where the thickness of the film layer is referred to as T, the volume fraction VF1 0.5 of the fiber in the region from the surface of the film layer on the substrate side to 0.5 T is from 0.1 to 0.5 and the volume fraction VF2 0.5 of the fiber in the region from the surface of the film layer opposite the substrate side to 0.5 T is from 0 to 0.1.

2. The film material according to claim 1 , wherein the fiber diameter of the fiber is 1 μm or less.

3. The film material according to claim 1 , wherein the fiber is contained in a form of a nonwoven fabric in the film layer.

4. The film material according to claim 1 , wherein:
the volume fraction VF1 0.15 of the fiber in the region from the surface of the film layer on the substrate side to 0.15 T is different from the volume fraction VF2 0.85 of the fiber in the region from the other surface of the film layer to 0.85 T.

5. The film material according to claim 1 , wherein the film layer further contains an electroconductive material.

6. The film material according to claim 1 , wherein
the softening start temperature ST1 of the first resin is higher than the softening start temperature ST2 of the second resin in the uncured or semi-cured state.

7. The film material according to claim 6 , wherein:
the volume fraction VF1 0.15 of the fiber in the region from the surface of the film layer on the substrate side to 0.15 T is larger than the volume fraction VF2 0.85 of the fiber in the region from the other surface of the film layer to 0.85 T.

8. An electronic component comprising:
a first circuit member; and a second circuit member, wherein:
the second circuit member is mounted on the first circuit member via a bonding material,
the bonding material contains a fibrous first resin and a thermosetting second resin in a cured state, wherein
the linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in the cured state; and
where the thickness of the bonding material is referred to as TJ, the volume fraction VJ1 0.5 of the fiber in the region from the surface of the bonding material on the first circuit member surface to 0.5 TJ is from 0.1 to 0.5 and the volume fraction VJ2 0.5 of the fiber in the region from the second circuit member surface of the bonding material to 0.5 TJ is from 0 to 0.1.

9. The electronic component according to claim 8 , wherein:
the linear expansion coefficient CC1 of the first circuit member is greater than the linear expansion coefficient CC2 of the second circuit member.

10. The electronic component according to claim 8 , wherein:
the first circuit member and the second circuit member individually have electrodes facing each other, and
the bonding material contains an electroconductive material.

11. A method for producing an electronic component, the method comprising:
preparing a film material including a substrate and a film layer arranged on one main surface of the substrate;
laminating the film material on a first circuit member so that the first circuit member and the film layer face each other;
separating the substrate from the film layer; laminating a second circuit member on the first circuit member so that the film layer and the second circuit member face each other; and
thermally compressing the first circuit member and the second circuit member, wherein:
the film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and
the linear expansion coefficient CF of the first resin is smaller than the linear expansion coefficient CR of the second resin in a cured state;
where the thickness of the film layer is referred to as T, the volume fraction VF1 0.5 of the fiber in the region from the surface of the film layer on the first circuit member to 0.5 T is from 0.1 to 0.5 and the volume fraction VF2 0.5 of the fiber in the region from the surface of the film layer on the second circuit member to 0.5 T is from 0 to 0.1.

12. The method for producing the electronic component according to claim 11 , wherein:
the film material is produced according to a production method that comprises:
fiber-like depositing the first resin on the substrate; and
applying the second resin onto a surface of the substrate on which the fiber is deposited.

13. The method for producing an electronic component according to claim 11 , wherein:
the film material is produced according to a production method that comprises:
applying the second resin to the substrate; and
fiber-like depositing the first resin on a surface of the substrate coated with the second resin.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Motomura Koji

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/074

  of anisotropic conductive adhesives · CPC title

• H10W72/073

  of die-attach connectors · CPC title