Method of fabricating nano-silver paste having high bonding strength

Patent metadata

Field	Value
Publication number	US-9902862-B2
Application number	US-201615203029-A
Country	US
Kind code	B2
Filing date	Jul 6, 2016
Priority date	Jul 6, 2016
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A method is provided to make a nano-silver paste. An organic acid is used as a protective agent. Silver nitrate is used as a source of silver ions to reduce silver nanoparticles on a surface protected by the organic acid. The particle size of the silver nanoparticle is 45 nanometers. In the other hand, a silver precursor of organic metal is synthesized. The organic metal is cracked at 200 celsius degrees (° C.) to fill pores left during sintering. After mixing the silver nanoparticle, the silver precursor and the solvent, the nano-silver paste is obtained. After being heated at 250° C. for 30 minutes, the nano-silver paste has a resistance of (3.09±0.61)×10 −5 Ω·cm. By being heated at 250° C. and applied with a pressure of 10 MPa to be hot-pressed for 30 minutes for joining copper to copper, the nano-silver paste obtains a bonding strength reaching 36 MPa.

First claim

What is claimed is:

1. A method of fabricating a nano-silver paste, comprising steps of:
(a) fabricating silver nanoparticles using silver nitrate as a silver ion source to produce said silver nanoparticles through a chemical reduction and using a protective agent to protect a surface of said silver nanoparticles;
(b) dissolving 2-ethylhexanoic acid in methyl alcohol and adding a solution of sodium hydroxide to obtain a mixed solution and adding a solution of silver nitrate to said mixed solution to obtain a silver precursor of organic metal; and
(c) mixing said silver nanoparticles, said silver precursor and a solvent to obtain a nano-silver paste, wherein said paste composition consists of a silver nanoparticle component having a particle size of 45 nm±20%.

2. The method according to claim 1 , wherein said protective agent is heptanoic acid.

3. The method according to claim 1 , wherein said protective agent has a weight occupying 6.4 percents (%)±20% of a weight of a whole there-containing said silver nanoparticles.

4. The method according to claim 1 , wherein said silver precursor is silver 2-ethylhexanoate.

5. The method according to claim 1 , wherein said solvent is selected from the group consisting of dimethylacetamide (DMAc), heptanol and α-terpineol.

6. The method according to claim 1 , wherein said silver nanoparticles, said silver precursor and said solvent are mixed at a ratio of 3:1:1.73.

7. The method according to claim 1 , further comprising hot-pressing the nano-silver paste at a temperature of 200˜250° C., such that said silver precursor in said nano-silver paste is cracked and reduces to fill pores left during sintering.

Assignees

• Univ Nat Cheng Kung

Inventors

• Hsu Steve Lien Chung
• Chen Yen Ting
• Chen In Gann

Classifications

• C09D7/48 Primary

  Stabilisers against degradation by oxygen, light or heat · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• C09D7/1241

  Chemistry & Metallurgy · mapped topic

• C09D5/24 Primary

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• B05D1/28

  performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers · CPC title