Copolymerized polyamide resin, method for preparing the same and molded article comprising the same

Patent metadata

Field	Value
Publication number	US-9902808-B2
Application number	US-201414583429-A
Country	US
Kind code	B2
Filing date	Dec 26, 2014
Priority date	Sep 25, 2014
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R 1 is independently a C 1 to C 5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C 1 to C 10 hydrocarbon group, R 2 and R 3 are each independently a C 1 to C 5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.

First claim

What is claimed is:

1. A copolymerized polyamide resin including a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid in an amount from about 88 to about 95 mol % and 1,4-cyclohexane dicarboxylic acid in an amount from about 5 to about 12 mol %, each based on 100 mol % of the dicarboxylic acid component, and a diamine component comprising m-xylene diamine in an amount from about 80 to about 95 mol % and bis(4-aminocyclohexyl)methane in an amount from about 5 to about 20 mol %, each based on 100 mol % of the diamine component,
wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more, and
wherein the copolymerized polyamide resin has a Yellowness Index difference (ΔYI) of about 20 or less calculated according to Equation 3 below:
Yellowness Index difference (ΔYI)=YI 1 −YI 0   [Equation 3]

wherein YI 0 is a Yellowness Index (YI) value of the copolymerized polyamide resin before a scorch test and YI 1 is a Yellowness Index value of the copolymerized polyamide resin after a scorch test, as measured according to ASTM E313-73, wherein the scorch test includes leaving about 1 to about 3 g of the copolymerized polyamide resin at about 200° C. for about 1 hour.

2. The copolymerized polyamide resin according to claim 1 , wherein the copolymerized polyamide resin has a mole ratio of the dicarboxylic acid component and the diamine component (dicarboxylic acid component:diamine component) from about 1:about 0.95 to about 1:about 1.15.

3. The copolymerized polyamide resin according to claim 1 , wherein the copolymerized polyamide resin has a terminal group encapsulated with an end capping agent comprising an aliphatic carboxylic acid, an aromatic carboxylic acid, or a mixture thereof.

4. The copolymerized polyamide resin according to claim 1 , wherein the copolymerized polyamide resin has a melting temperature (Tm) from about 220 to about 250° C., a crystallization temperature (Tc) from about 170 to about 200° C., and a glass transition temperature (Tg) from about 90 to about 110° C.

5. The copolymerized polyamide resin according to claim 1 , wherein the copolymerized polyamide resin has an intrinsic viscosity (IV) difference (ΔIV) of about 0.14 or less according to Equation 1:
Intrinsic viscosity difference (ΔIV)=IV 1 −IV 0   [Equation 1]

wherein, IV 0 is an intrinsic viscosity of the copolymerized polyamide resin, as measured at about 25° C., and IV 1 is an intrinsic viscosity, as measured by melting about 10 g of the copolymerized polyamide resin at about 260° C. and leaving the melted copolymerized polyamide resin for about 30 minutes, followed by cooling the copolymerized polyamide resin to about 25° C.

6. The copolymerized polyamide resin according to claim 1 , wherein the copolymerized polyamide resin has a gel content of about 0.4% or less, as measured by melting about 10 g of the copolymerized polyamide resin at about 260° C. and leaving the melted copolymerized polyamide resin for about 30 minutes, followed by cooling the copolymerized polyamide resin to an ambient temperature.

7. A method for preparing a copolymerized polyamide resin comprising:
polymerizing a monomer mixture comprising a dicarboxylic acid component comprising adipic acid in an amount from about 88 to about 95 mol % and 1,4-cyclohexane dicarboxylic acid in an amount from about 5 to about 12 mol %, each based on 100 mol % of the dicarboxylic acid component, and a diamine component comprising m-xylene diamine in an amount from about 80 to about 95 mol % and bis(4-aminocyclohexyl)methane in an amount from about 5 to about 20 mol %, each based on 100 mol % of the diamine component,
wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more, and
wherein the copolymerized polyamide resin has a Yellowness Index difference (ΔYI) of about 20 or less calculated according to Equation 3 below:
Yellowness Index difference (ΔYI)=YI 1 −YI 0   [Equation 3]

wherein YI 0 is a Yellowness Index (YI) value of the copolymerized polyamide resin before a scorch test and YI 1 is a Yellowness Index value of the copolymerized polyamide resin after a scorch test, as measured according to ASTM E313-73, wherein the scorch test includes leaving about 1 to about 3 g of the copolymerized polyamide resin at about 200° C. for about 1 hour.

8. The method for preparing a copolymerized polyamide resin according to claim 7 , comprising polymerizing the monomer mixture to obtain a prepolymer; and performing a solid state polymerization of the prepolymer.

9. The method of preparing copolymerized polyamide resin according to claim 7 , the prepolymer has an intrinsic viscosity from about 0.1 to about 0.4 dL/g.

10. The method of preparing copolymerized polyamide resin according to claim 7 , wherein the solid state polymerization comprises heating the prepolymer to a temperature of about 150 to about 220° C.

11. A molded article formed from the copolymerized polyamide resin according to claim 1 .

12. The copolymerized polyamide resin according to claim 1 , wherein the copolymerized polyamide resin has a Yellowness Index change (ΔYI) of from about 10 to about 20.

13. The copolymerized polyamide resin according to claim 12 , wherein the copolymerized polyamide resin has a Yellowness Index change (ΔYI) of from about 10 to about 18.

Assignees

• Samsung Sdi Co Ltd
• Lotte Advanced Mat Co Ltd

Inventors

• Kwon So Young
• Kim Jin Kyu
• Jin Young Sub
• Kim Joon Sung
• Lee Ki Yon
• Jun Suk Min

Classifications

• C08G69/28

  Preparatory processes · CPC title

• C08G69/265 Primary

  from at least two different diamines or at least two different dicarboxylic acids · CPC title

• C08G69/30

  Solid state polycondensation · CPC title

• C08G69/26 Primary

  derived from polyamines and polycarboxylic acids · CPC title