Maintenance valve for fluid ejection head

US9902166B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9902166-B2
Application numberUS-201715484358-A
CountryUS
Kind codeB2
Filing dateApr 11, 2017
Priority dateSep 12, 2012
Publication dateFeb 27, 2018
Grant dateFeb 27, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An ejection chip is disclosed, and comprises a substrate, a flow feature layer, a nozzle plate, and one or more valves. The substrate includes one or more fluid channels and one or more fluid ports each in communication with at least one of the one or more fluid channels. The flow feature layer is disposed over the substrate, and the flow feature layer include one or more flow features each in communication with at least one of the one or more fluid ports. The nozzle layer is disposed over the flow feature layer, and the nozzle layer includes one or more nozzles each in communication with at least one of the one or more flow features so that one or more fluid paths are defined by the one or more fluid channels, the one or more fluid ports, the one or more flow features, and the one or more nozzles. The one or more valves selectively impede flow of fluid through the one or more fluid paths.

First claim

Opening claim text (preview).

What is claimed is: 1. An ejection chip comprising: a substrate that comprises one or more fluid channels and one or more fluid ports, each fluid port being in communication with at least one of the one or more fluid channels; a flow feature layer disposed over the substrate, the flow feature layer comprising one or more flow features each in communication with at least one of the one or more fluid ports; a nozzle plate disposed over the flow feature layer, the nozzle plate comprising one or more nozzles each in communication with at least one of the one or more flow features; one or more fluid paths defined by the one or more fluid channels, the one or more fluid ports, the one or more flow features, and the one or more nozzles; and one or more valves that change or decrease a gap greater than a clearance spanning a corresponding fluid port of the one or more fluid ports to the clearance upon actuation. 2. The ejection chip of claim 1 , wherein the one or more valves are disposed under the substrate. 3. The ejection chip of claim 1 , wherein the one or more valves are disposed over the substrate. 4. The ejection chip of claim 1 , wherein the one or more valves change or decrease the gap to the clearance to impede flow of fluid through select fluid paths of the one or more fluid paths during a maintenance operation. 5. The ejection chip of claim 1 , wherein the one or more valves change or increase the clearance to the gap to permit fluid flow through select fluid paths of the one or more fluid paths during a jetting operation. 6. The ejection chip of claim 1 , wherein at least one of the one or more valves change or increase the clearance to the gap to selectively permit fluid flow at the one or more fluid ports. 7. The ejection chip of claim 1 , wherein the one or more valves comprise a bimetallic valve. 8. The ejection chip of claim 7 , wherein the bimetallic valve comprises a plurality of materials each having a different coefficient of thermal expansion. 9. The ejection chip of claim 8 , further comprising a heater that heats the bimetallic valve. 10. The ejection chip of claim 7 , wherein the bimetallic valve extends substantially across at least one of the one or more fluid ports. 11. The ejection chip of claim 10 , wherein the bimetallic valve extends entirely across at least one of the one or more fluid ports. 12. The ejection chip of claim 1 , wherein at least one of the one or more valves may be a piezoelectric valve or an electrostatic valve. 13. An ejection chip comprising: a substrate that comprises one or more fluid channels, one or more fluid ports each in communication with at least one of the one or more fluid channels, and one or more fluid chambers; a flow feature layer disposed over the substrate, the flow feature layer comprising one or more flow features each in communication with at least one of the one or more fluid ports; a nozzle plate disposed over the flow feature layer, the nozzle plate comprising one or more nozzles each in communication with at least one of the one or more flow features, one or more fluid paths defined by the one or more fluid channels, the one or more fluid ports, the one or more flow features, and the one or more nozzles; and one or more valves that change respective gaps between the one or more fluid channels and the one or more fluid chambers of the substrate. 14. The ejection chip of claim 13 , wherein the one or more valves comprise flexible membranes. 15. The ejection chip of claim 14 , wherein the flexible membranes are formed of an elastomer. 16. The ejection chip of claim 14 , further comprising a pneumatic channel that creates a pressure differential along at least one of the one or more fluid paths. 17. The ejection chip of claim 14 , wherein the flexible membranes engage a wall along at least one of the one or more fluid paths.

Assignees

Inventors

Classifications

  • Heads having a valve · CPC title

  • using wiping constructions (B41J2/16552 takes precedence) · CPC title

  • B41J2/1404Primary

    Geometrical characteristics · CPC title

  • Structure of the manifold · CPC title

  • Prevention {or detection} of nozzle clogging, e.g. cleaning, capping or moistening for nozzles · CPC title

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9902166B2 cover?
An ejection chip is disclosed, and comprises a substrate, a flow feature layer, a nozzle plate, and one or more valves. The substrate includes one or more fluid channels and one or more fluid ports each in communication with at least one of the one or more fluid channels. The flow feature layer is disposed over the substrate, and the flow feature layer include one or more flow features each in …
Who is the assignee on this patent?
Funai Electric Co
What technology area does this patent fall under?
Primary CPC classification B41J2/1404. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).