Pattern formation method, manufacturing method of piezoelectric film and manufacturing method of piezoelectric element
US-2015068673-A1 · Mar 12, 2015 · US
US9902153B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9902153-B2 |
| Application number | US-201514805739-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 22, 2015 |
| Priority date | Jul 28, 2014 |
| Publication date | Feb 27, 2018 |
| Grant date | Feb 27, 2018 |
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A method of making a piezoelectric film includes forming a PbTO 3 (PTO) coating film by applying a precursor liquid of a coating film containing PTO as a main ingredient, forming a PTO amorphous layer containing lead titanate as a main ingredient by heating the PTO coating film at a heating temperature lower than a crystallization temperature at which the PTO coating film is crystalized, and forming, on the PTO amorphous layer, a piezoelectric thin-film layer having a main (100) orientation measured by X-ray analysis and containing lead zirconate titanate (PZT) as a main ingredient. The heating temperature is 300° C. or lower.
Opening claim text (preview).
What is claimed is: 1. A method of making a piezoelectric film, comprising: (a) forming a PbTO 3 (PTO) coating film by applying a precursor liquid of a coating film containing PTO as a main ingredient, on a substrate; (b) forming a PTO amorphous layer containing lead titanate as a main ingredient by heating the PTO coating film, formed in (a), at a heating temperature lower than a crystallization temperature at which the PTO coating film is crystalized, the heating temperature being 300° C. or lower; and (c) forming, on the PTO amorphous layer formed in (b), a piezoelectric thin-film layer having a main (100) orientation measured by X-ray analysis and containing lead zirconate titanate (PZT) as a main ingredient. 2. The method according to claim 1 , wherein a ratio of the main (100) orientation of the piezoelectric thin-film layer formed in (c) is 90% or higher. 3. The method according to claim 1 , wherein the heating temperature in (b) is not lower than a temperature corresponding to a first absorption peak of a differential thermal analysis (DTA) curve of the precursor liquid. 4. The method according to claim 1 , wherein the heating temperature in (b) is not lower than 50° C. and not higher than 120° C. 5. The method according to claim 1 , wherein the forming the piezoelectric thin-film layer in (c) includes forming the piezoelectric thin-film layer by laser sintering. 6. A method of making a piezoelectric element, comprising forming an electrode on the piezoelectric film made by the method according to claim 1 to form the piezoelectric element. 7. A method of making a liquid discharge head including making a piezoelectric element by performing the method according to claim 6 .
Electricity · mapped topic
thin film formation · CPC title
of film type, deformed by bending and disposed on a diaphragm · CPC title
of film type, deformed by bending and disposed on a diaphragm · CPC title
by sol-gel deposition · CPC title
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