Vacuum carrier module, method of using and process of making the same

Patent metadata

Field	Value
Publication number	US-9902092-B2
Application number	US-201314089811-A
Country	US
Kind code	B2
Filing date	Nov 26, 2013
Priority date	Nov 26, 2013
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

A vacuum carrier module includes a substrate having at least one hole and an edge region. There is at least one support on a top surface of the substrate. Further, a gel film is adhered to the edge region of the substrate. The at least one hole fluidly connects a reservoir located above the top surface of the substrate. A method of using a vacuum carrier module includes planarizing a gel film by passing an alignment material through a hole in a substrate to contact a first surface of the gel film, positioning at least one chip on a second surface of the gel film opposite the first surface. The method further includes encasing the at least one chip in a molding material and applying a vacuum to the first surface of the gel film.

First claim

What is claimed is:

1. A vacuum carrier module comprising:
a substrate comprising a bottom surface, a top surface, and an edge region, the edge region being disposed around a periphery of the substrate and protruding above the top surface;
a plurality of fluid passageways extending through the substrate from the top surface to the bottom surface;
a gel film comprising a first surface adhered to the edge region of the substrate and a second surface for supporting a chip, wherein the first surface of the gel film and the top surface of the substrate form a reservoir in fluid communication with the plurality of fluid passageways, and wherein the reservoir is configured to receive and contain an aligning material under positive pressure to planarize the gel film; and
a plurality of supports located on the top surface and protruding above the top surface of the substrate, the plurality of supports each having an uppermost supporting surface spaced from the top surface by a distance, wherein the uppermost supporting surface with a largest distance from the top surface is physically spaced apart from the first surface of the gel film when the gel film is planar, and wherein each of the uppermost supporting surface make direct contact with the first surface of the gel film when the reservoir is under negative pressure.

2. The vacuum carrier module of claim 1 , wherein the reservoir is configured to receive an alignment material, the alignment material comprises at least one of Compressed Dry Air (CDA), Nitrogen, or silicone oil.

3. The vacuum carrier module of claim 1 , wherein the substrate has a center portion and a top surface of the edge region that is raised with respect to a top surface of the center portion or the top surface of the edge region is flat with respect to the top surface of the center portion.

4. The vacuum carrier module of claim 1 , wherein the plurality of supports comprise a second support located on the edge region of the substrate.

5. The vacuum carrier module of claim 4 , wherein the gel film is adhered to the second support.

6. The vacuum carrier module of claim 1 , wherein the gel film comprises at least one of a silicone based compound or a polymer based compound.

7. The vacuum carrier module of claim 1 , wherein the plurality of supports have an upper surface parallel to the top surface of the substrate, wherein the upper surface extends above a top surface of the edge region of the substrate.

8. The vacuum carrier module of claim 1 , wherein the plurality of supports have an upper surface parallel to the top surface of the substrate, wherein the upper surface is lower than a top surface of the edge region of the substrate.

9. The vacuum carrier module of claim 1 , further comprising an adhesive material between the gel film and an entirety of the edge region of the substrate.

10. The vacuum carrier module of claim 9 , wherein the adhesive material comprises a polymer composite.

11. A method of making a vacuum carrier module, the method comprising:
forming at least one hole in a substrate;
forming at least one support on a top surface of the substrate, wherein forming the at least one support on the top surface of the substrate comprises:
depositing a support material on the top surface of the substrate, the support material being different than a material of the substrate; and
etching the support material to define the at least one support; and

fixing a gel film to an edge region of the substrate using a polymer composite or an epoxy adhesive, wherein the gel film is positioned over the at least one support.

12. The method of claim 11 , wherein fixing the gel film to the substrate further comprises:
applying the epoxy adhesive to the at least one support; and
after applying the epoxy adhesive to the at least one support, disposing the gel film on the epoxy adhesive.

13. The method of claim 11 , wherein forming the least one hole in the substrate further comprises extending the hole from a bottom surface of the substrate to the top surface of the substrate.

14. The method of claim 11 , wherein forming the at least one support on the top surface of the substrate further comprises forming the at least one support on the edge region of the substrate.

15. A vacuum carrier module comprising:
a substrate having a top surface with a center region and an edge region on a peripheral portion of the top surface around the center region;
at least one hole extending through the center region of the top surface to a bottom surface of the substrate;
at least one support formed on top of the center region of the top surface and at least one second support formed on top of the edge region of the top surface, the at least one second support having a first upper surface higher than the top surface and comprising a different material than the substrate; and
an adhesive binding a gel film to the first upper surface of the at least one second support, wherein the gel film, the at least one second support, and the top surface form a reservoir in fluid communication with the at least one hole, and wherein the reservoir is configured to receive and contain an aligning material under positive pressure to planarize the gel film.

16. The vacuum carrier module of claim 15 , wherein the at least one support has a second upper surface substantially co-planar with the first upper surface.

17. The vacuum carrier module of claim 15 , wherein the at least one support has a second upper surface parallel to the top surface of the substrate, and extending above the first upper surface, wherein the second upper surface is substantially level across an entirety of the at least one support.

18. The vacuum carrier module of claim 15 , wherein the at least one support has a second upper surface parallel to the top surface of the substrate, and lower than the first upper surface, wherein the second upper surface is substantially level across an entirety of the at least one support.

19. The vacuum carrier module of claim 15 , further comprising an adhesive material between the gel film and the first upper surface of the edge region.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Huang Tien Yu
• Tseng Chun Hao
• Kuo Ying Hao
• Yee Kuo Chung

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• B29C45/14016

  Intermittently feeding endless articles, e.g. transfer films, to the mould (B29C45/14262 takes precedence) · CPC title

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• Y10T156/1056

  Perforating lamina · CPC title