Composite bonding tool with high thermal conductivity and low coefficient of thermal expansion

US9902091B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9902091-B2
Application numberUS-201514691914-A
CountryUS
Kind codeB2
Filing dateApr 21, 2015
Priority dateApr 21, 2015
Publication dateFeb 27, 2018
Grant dateFeb 27, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A composite bonding tool may comprise a mold surface made from a composite material including a fibrous material and a matrix disposed about the fibrous material. The resin may be cured and have a thermal conductivity greater than about 10 watts per meter Kelvin. The fibrous material may be further metal coated or plated to increase thermal conductivity. Carbon nanomaterials may be added to the matrix or onto the surface of the fibrous material in order to further enhance thermal conductivity. The mold surface has a relatively high thermal conductivity and relatively low coefficient of thermal expansion, and a relatively low mass.

First claim

Opening claim text (preview).

What is claimed is: 1. A composite bonding tool, comprising: a composite mold comprising: a fibrous material; and a matrix disposed about the fibrous material and cured, wherein the matrix comprises a thermal conductivity greater than 10 watts per meter Kelvin, wherein the fibrous material and the matrix form a layup surface of the composite mold, the layup surface being configured to directly contact and shape a part disposed on the composite mold. 2. The composite bonding tool of claim 1 , wherein the matrix comprises the thermal conductivity from 20 to 50 watts per meter Kelvin. 3. The composite bonding tool of claim 1 , wherein the fibrous material comprises a chopped fiber. 4. The composite bonding tool of claim 1 , wherein the fibrous material comprises a metal coated fiber. 5. The composite bonding tool of claim 4 , wherein the metal coated fiber is coated with a nickel-iron alloy. 6. The composite bonding tool of claim 1 , further comprising a nanostructure disposed in the matrix. 7. The composite bonding tool of claim 6 , wherein the nanostructure comprises at least one of carbon nanotubes, carbon nanofibers, or graphene nanoplatelets. 8. The composite bonding tool of claim 1 , wherein the matrix comprises a hydrogen-unsaturated resin with closed ring geometry. 9. The composite bonding tool of claim 1 , wherein the fibrous material is distributed isotropically within the matrix. 10. The composite bonding tool of claim 1 , wherein the matrix comprises at least one of a high-thermal-conductivity ceramic or a resin formed using at least one of phenol or imidazole. 11. A composite bonding tool surface, comprising: a fibrous material; and a matrix disposed about and infiltrating the fibrous material, wherein the matrix comprises a thermal conductivity greater than 10 watts per meter Kelvin, wherein the composite bonding tool surface is configured to directly contact and shapes a part. 12. The composite bonding tool surface of claim 11 , wherein the fibrous material comprises a metal coated fiber. 13. The composite bonding tool surface of claim 11 , wherein the matrix comprises at least one of a high-thermal-conductivity ceramic or a resin formed using at least one of phenol or imidazole. 14. The composite bonding tool surface of claim 11 , wherein the matrix comprises a lower coefficient of thermal expansion than glass. 15. The composite bonding tool surface of claim 11 , wherein the thermal conductivity of the matrix is between 20 watts per meter Kelvin and 50 watts per meter Kelvin.

Assignees

Inventors

Classifications

  • Conductive · CPC title

  • having particular thermal properties · CPC title

  • Moulds made of at least two different materials having different thermal conductivities · CPC title

  • Resin-bonded materials, e.g. inorganic particles · CPC title

  • inorganic · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9902091B2 cover?
A composite bonding tool may comprise a mold surface made from a composite material including a fibrous material and a matrix disposed about the fibrous material. The resin may be cured and have a thermal conductivity greater than about 10 watts per meter Kelvin. The fibrous material may be further metal coated or plated to increase thermal conductivity. Carbon nanomaterials may be added to the…
Who is the assignee on this patent?
Rohr Inc
What technology area does this patent fall under?
Primary CPC classification B29C33/3828. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).